• 마이크로전자및패키징학회지
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• 제15권1호
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• pp.33-37
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• 2008

Kirkendall void는 전해도금 Cu/Sn-Ag 솔더 접합부에서 형성되었으며 Cu 도금욕에 함유되는 첨가제에 의존한다. 첨가제로 사용된 SPS의 함량의 증가와 함께 $150^{\circ}C$에서 열처리 후 많은 양의 Kirkendall void가 $Cu/Cu_3Sn$ 계면에 존재하였다. AES 분석은 void 표면에 S가 편석되어 있음을 보여주었다. $Cu/Cu_3Sn$ 계면을 따라 파괴된 시편에서 Cu, Sn, S peak만 검출되었고 AES 깊이 프로파일에서 S는 급격하게 감소하였다. $Cu/Cu_3Sn$ 계면에서 S 편석은 계면에너지를 낮추고 Kirkendall void 핵생성을 위한 에너지장벽을 감소시킨다. 낙하충격시험은 SPS를 사용하여 도금된 Cu의 경우 Kirkendall void가 형성된 $Cu/Cu_3Sn$ 계면에서 파괴가 진행되고 급격하게 신뢰성이 감소됨을 보였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2008년도 추계학술발표대회 및 제15회 신소재 심포지엄
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• pp.28.1-28.1
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• 2008

• 마이크로전자및패키징학회지
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• 제31권1호
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• pp.35-42
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• 2024

최근 반도체 칩의 소형화 및 고집적화에 따라 미세 피치에 의한 범프 브리지 (bump bridge) 현상이 문제점으로 주목받고 있다. 이에 따라 범프 브리지 현상을 최소화할 수 있는 Cu pillar bump가 미세 피치에 대응하기 위해 반도체 패키지 산업에서 널리 적용되고 있다. 고온의 환경에 노출될 경우, 접합부 계면에 형성되는 금속간화합물(Intermetallic compound, IMC)의 두께가 증가함과 동시에 일부 IMC/Cu 및 IMC 계면 내부에 Kirkendall void가 형성되어 성장하게 된다. IMC의 과도한 성장과 Kirkendall void의 형성 및 성장은 접합부에 대한 기계적 신뢰성을 약화시키기 때문에 이를 제어하는 것이 중요하다. 따라서, 본 연구에서는 CS(Cu+ Sn-1.8Ag Solder) 구조 Cu pillar bump의 등온 시효 처리에 따른 접합부 특성 평가가 수행되었으며 그 결과가 보고되었다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1295-1300
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• 2008

During the manufacturing and the service life of Au-Al wire bonded electronic packages, the ball bonds experience elevated temperatures and hence accelerated thermal diffusion reactions that promote the transformation of the Au-Al phases and the IMC growth. In this paper, the IC under high temperature storage (HTS) tests at $175^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ are meticulously investigated. Thermal exposure resulted in the IMC growth, Kirkendall void and the crack of the Au-Al phases. The crack propagation occurs resulting in the failure of the Au-Al ball bonds. As the IC was exposed at the high temperature, decreased in the lifetime.

• 마이크로전자및패키징학회지
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• 제14권4호
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• pp.15-20
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• 2007

시효처리에 따른 Cu pillar 범프 내 다양한 계면에서의 금속간화합물 성장거동을 각각 120, 150, $165^{\circ}C$의 온도에서 300시간동안 시효처리하면서 연구하였다. 분석 결과 Cu pillar와 SnPb 계면에서는 $Cu_6Sn_5$와 $Cu_3Sn$이 관찰되었고, 시효처리 시간이 경과함에 따라 parabolic 형태로 성장하였다. 또한 시효처리 온도가 높을수록 시간에 따른 $Cu_6Sn_5$와 $Cu_3Sn$의 성장속도는 더욱 빨랐다. kirkendall void는 Cu Pillar와 $Cu_3Sn$ 사이의 계면과 $Cu_3Sn$ 내부에서 형성되었고, 시효처리 시간이 경과함에 따라 성장하였다. 리플로우 후에 SnPb와 Ni(P)사이의 계면에서는 $(Cu,Ni)_6Sn_5$가 형성되었고, 시효처리 시간에 따른 $(Cu,Ni)_6Sn_5$거 두께 변화는 관찰되지 않았다. 시효처리 온도와 시간에 따른 금속간화합물의 두께 변화를 이용하여 전체$(Cu_6Sn_5+Cu_3Sn)$금속간화합물과 $Cu_6Sn_5,\;Cu_3Sn$ 금속간화합물의 성장에 대한 활성화 에너지를 구해본 결과 각각 1.53, 1.84, 0.81 eV의 값을 가지고 있었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.709-710
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• 2009

• 한국분말재료학회지
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• 제24권3호
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• pp.235-241
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• 2017

Titanium alloys have high specific strength, excellent corrosion and wear resistance, as well as high heat-resistant strength compared to conventional steel materials. As intermetallic compounds based on Ti, TiAl alloys are becoming increasingly popular in the aerospace field because these alloys have low density and high creep properties. In spite of those advantages, the low ductility at room temperature and difficult machining performance of TiAl and $Ti_3Al$ materials has limited their potential applications. Titanium powder can be used in such cases for weight and cost reduction. Herein, pre-forms of Ti-Al-xMn powder alloys are fabricated by compression forming. In this process, Ti powder is added to Al and Mn powders and compressed, and the resulting mixture is subjected to various sintering temperature and holding times. The density of the powder-sintered specimens is measured and evaluated by correlation with phase formation, Mn addition, Kirkendall void, etc. Strong Al-Mn reactions can restrain Kirkendall void formation in Ti-Al-xMn powder alloys and result in increased density of the powder alloys. The effect of Al-Mn reactions and microstructural changes as well as Mn addition on the high-temperature compression properties are also analyzed for the Ti-Al-xMn powder alloys.

• Journal of Advanced Marine Engineering and Technology
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• 제27권1호
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• pp.134-144
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• 2003

Reactive diffusion couples between Fe-5.8at.%Si and (Si wafer, $FeSi_2$, or FeSi alloy) were heat-treated at 1423k. The only layer of $Fe_3Si$ phase was formed in each diffusion couple. The width of $Fe_3Si$ layer was proportional to square root of diffusion time in each kind of diffusion couple. Growth rate of $Fe_3Si$ layer was relied on the concentration of Si in the supplied source of Si atoms. Interdiffusion coefficient of $Fe_3Si$ has been determined from the derived relation between growth rate constant and interdiffusion coefficient in this work. It was shown that the behavior of Kirkendall's void in $Fe_3Si$ layer was not affected by the kind of Si source. But solid solution $\alpha$ was formed in the diffusion couple between Fe-5.8 at.%Si and $Fe_3Si$ alloy. Kirkendall's voids in diffusional $\alpha$ were neglectively smaller than the case of $Fe_3Si$ phase growth.

• 한국표면공학회지
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• 제30권4호
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• pp.248-254
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• 1997

The sulfidation behavior of a sputter-deposited amorphous coating of 69.0%Nb-16.9Ni-11.9%Al-2.2%Si (at.%) has been investigated as a funtion of temperature.(973-1173K) in pure sulfur pressure of 0.01atm. The sulfidation kinetics of the casting obyed the parabolic rate low over the whole temperature ranges studied. The stlfidation rate increased with the temperature, as expected. The sulfide scale, the composition of which was $Al_2S_3,\;NbS_2,\;Ni_{3-x}S_2\;and\;FeCrS_4$, formed on the amorphous coating was primarily bilayered. Both the outer fastgrowing non-protective 4Al_2S_3$scale and the inner slowly-growing protective $NbS_2$,/TEX> scale and the inner slowly-growing protective $NbS_2$ scale had some Fe and Cr dissolution, which evidently came from the base substrate alloy of stainless steel type 304. Belows the coating, Kirkendall void formation was noticed. Nevertheless, a dramatic improvement of sulfidation resistance was achieved by sputter-depositing Nb-2 Ni-Al-Si layer on the stainless steel 304.

• 한국재료학회지
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• 제18권1호
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• pp.45-50
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• 2008

Microstructural evolution and the intermetallic compound (IMC) growth kinetics in an Au stud bump were studied via isothermal aging at 120, 150, and $180^{\circ}C$ for 300hrs. The $AlAu_4$ phase was observed in an Al pad/Au stud interface, and its thickness was kept constant during the aging treatment. AuSn, $AuSn_2,\;and\;AuSn_4$ phases formed at interface between the Au stud and Sn. $AuSn_2,\;AuSn_2/AuSn_4$, and AuSn phases dominantly grew as the aging time increased at $120^{\circ}C,\;150^{\circ}C,\;and\;180^{\circ}C$, respectively, while $(Au,Cu)_6Sn_5/Cu_3Sn$ phases formed at Sn/Cu interface with a negligible growth rate. Kirkendall voids formed at $AlAu_4/Au$, Au/Au-Sn IMC, and $Cu_3Sn/Cu$ interfaces and propagated continuously as the time increased. The apparent activation energy for the overall growth of the Au-Sn IMC was estimated to be 1.04 eV.