• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.14 no.11
• /
• pp.5947-5955
• /
• 2013

This study was intended to estimate the axial deformation of joint between pavement modules in the rapid-constructible modular pavement system, and to investigate the applicability of two-phase composites for a joint material, which was composed of cement paste, epoxy, or polyurethane as a matrix and sand as particles. A case which had supports under the pavement module as well as a case which the module was put on roadbed directly were considered in FEM analysis for the axial deformation. The effect of self-weight, live load, thermal change, and drying shrinkage were estimated and the thermal change was found to cause the largest deformation compared to the others. Deformation capacity of two-phase composites was predicted using the modified shear-lag model. In the analytical results for the elastic modulus and maximum tensile strain with different volume fractions of sand, 20~30 % replacement of sand was revealed to satisfy the required strain capacity with economy when if the width of joint was designed to be 15~20 mm.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2006.02a
• /
• pp.1-14
• /
• 2006

[ $\blacklozenge$ ] PCB에 있어서 Embedded passive 는chip을 직접 내장하는 방법과 특별한 특성을 갖는 재료 및 공법을 사용하여 chip 응 대치하는 방법이 있다. $\blacklozenge$ Embedded passive PCB가 적용될 수 있는 유력한 적용 분야는 소형화가가 요구되는 분야와 고속 특성이 요구되는 분야를 들 수 있고, 따라서, Module, SOP/SIP, Package substrate 등이 우선적으로 적용될 수 있는 분야다. $\blacklozenge$ Embedded capacitor를 적용한 경우, 일반적인 chip capacitor를 적용한 경우보다 더 좋은 전기적인 특성(SRF, Q)을 얻을 수 있으며, solder joint 등의 영향을 포함하면 더욱 좋은 특성이 얻어질 수 있다. $\blacklozenge$ Embedded passive 의 상용화를 위해서, 공차를 관리하는 방법의 개발과 공차에 대한 합리적인 규격을 설정하는 것이 우선 과제이다. $\blacklozenge$ Embedded resistor 의 경우, Laser trim을 적용하여 ${\pm}\;5\%$ 또는 그 이하의 공차를 실현할 수 있고, $30\;K\Omega/sq$. 의 고저항의 적용까지 가능하다. $\blacklozenge$ 고속 신호에서의 noise 감소, module, SIP/SOP 의 소형화를 실현하는데 Embedded passive(혹은 active)PCB 가 기여 할 수 있을 것이고, 이를 위하여 Set 업체, PCB 업체, 재료 업체간의 지속적인 협조가 필요할 것이다.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.27-34
• /
• 2017

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

• Proceedings of the KSR Conference
• /
• 2003.10a
• /
• pp.204-209
• /
• 2003

The railway vehicle is composed of many suspension components, such as 1st springs, 2nd dampers, that have an influence on the dynamic characteristics of high speed train. Also, the wheel/rail shapes and its contact mechanism affect the dynamic behavior of high speed train. but these geometric contact characteristics are nonlinear functions of the wheelset lateral displacement and it do not exact dynamic analysis for high speed train. there is a need to develop a new wheel/rail contact module for dynamic behavior and wheelset model is divided motor box, wheel box and wheel body. This wheel is moved by motor box and constrained by joint. It is almost same a train and its result is more exactly.

• 제어로봇시스템학회:학술대회논문집
• /
• 2001.10a
• /
• pp.83.3-83
• /
• 2001

A method to adaptively control leg-ends trajectories of a five-legged walking robot, Cepheus-2, has been developed in terms of a kind of a table look-up method. Cepheus-2 is a five-legged robot with a pentagonal body with two joints of each leg. The robot control system has a hierarchical autonomic-integrated architecture with a main computer (PC), a manager and servo modules. Being given the goals of walking by the main computer, the manager module assigns a type of leg-end trajectories of which data are described with the work space coordinates for the legs. Every servo module generates the joint angle data. In steady walking of the robot on flat floor without obstacle, two joints have to generate the assigned trajectory and five legs ...

• Journal of Korean Association for Spatial Structures
• /
• v.23 no.4
• /
• pp.71-79
• /
• 2023

In this study, a prefabricated buckling brace (PF-BRB) was proposed, and a test specimen was manufactured based on the design formula for the initial shape and structural performance tests were performed. As a result of the experiment, all standard performance requirements presented by KDS 41 17 00 and MOE 2021 were satisfied before and after replacement of the reinforcement module, and no fracture of the joint module occurred. As a result of the incremental load test, the physical properties showed a significant difference in the stiffness ratio after yielding under the compressive load of the envelope according to the experimental results. It is judged necessary to further analyze the physical properties according to the experimental results through finite element analysis in the future.

• Journal of the Korean Society for Railway
• /
• v.13 no.1
• /
• pp.16-22
• /
• 2010

Various programs for dynamic simulation of the railway vehicle have advantages and disadvantages. These programs have limitation that cannot express a large deformable body for an wire of the railway vehicle. In this study, a program for dynamic simulation of the railway vehicle is developed. And the rigid, flexible and large deformable body can be simulated using this program. Its reliability is verified by comparison with a commercial program. Also, a wire is considered as the large deformable body and a sliding joint which connects the rigid body to the large deformable body is included. Moreover, as the wheel-rail contact module is added, the dynamic simulation of the railway vehicle can be analyzed using the developed program.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.17-25
• /
• 2017

Recently, research and application for a power module have been actively studied according to the increasing demand for the production of vehicles, smartphones and semiconductor devices. The power modules based on the transient liquid phase (TLP) technology for bonding of power semiconductor devices have been introduced in this paper. The TLP bonding has been widely used in semiconductor packaging industry due to inhibiting conventional Pb-base solder by the regulation of end of life vehicle (ELV) and restriction of hazardous substances (RoHS). In TLP bonding, the melting temperature of a joint layer becomes higher than bonding temperature and it is cost-effective technology than conventional Ag sintering process. In this paper, a variety of TLP bonding technologies and their characteristics for bonding of power module have been described.

• The Journal of Korea Robotics Society
• /
• v.14 no.4
• /
• pp.278-284
• /
• 2019

Legged locomotion has high mobility on irregular surfaces by touching the ground at discrete points. Inspired by the creature's legged locomotion, legged robots have been developed to explore unstructured environments. In this paper, we propose a modular crawler that can easily adjust the number of legs for adapting the environment that the robot should move. One module has a pair of legs, so the number of legs can be adjusted by changing the number of modules. All legs are driven by a single driving motor for simple and compact design, so the driving axle of each module is connected by the universal joint. Universal joints between modules enable the body flexion for steering or overcoming higher obstacles. A prototype of crawler with three modules is built and the driving performance and the effect of module lifting on the ability to overcome obstacles are demonstrated by the experiments.

• Current Photovoltaic Research
• /
• v.8 no.4
• /
• pp.124-128
• /
• 2020

Output power of photovoltaic (PV) modules installed outdoors decreases every year due to environmental conditions such as temperature, humidity, and ultraviolet irradiations. In order to promote the installation of PV modules, the reliability must be guaranteed. One of the important factors affecting reliability is intermetallic compounds (IMC) layer formed in ribbon solder joint. For this reason, various studies on soldering properties between the ribbon and cell have been performed to solve the reliability deterioration caused by excessive growth of the IMC layer. However, the IMC layer of the PV module interconnected by multi-wires has been studied less than using the ribbon. It is necessary to study soldering characteristics of the multi-wire module for improvement of its reliability. In this study, we analyzed the growth of IMC layer of the PV module with multi-wire and the degradation of output power through damp-heat test. The fabricated modules were exposed to damp-heat conditions (85 ºC and 85 % relative humidity) for 1000 hours and the output powers of the modules before and after the damp-heat test were measured. Then, the process of dissolving ethylene vinyl acetate (EVA) as an encapsulant of the modules was performed to observe the IMC layer. The growth of IMC layer was evaluated using OM and FE-SEM for cross-sectional analysis and EDS for elemental mapping. Based on these results, we investigated the correlation between the IMC layer and output power of modules.