• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.2
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• pp.87-93
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• 2022

The demand for metal-polymer joining technology have been increasing, especially in the industrial fields of automotive and aerospace, which require the manufacturing of various lightweight parts. Conventional joining processes have technical hurdles on aspects such as thermal degradation, need for chemical surface treatment, or complicated process settings. These issues can be alleviated by employing interlocking structures for the metal-polymer joined interface. In this study, we joined 3D-printed metal and polymer parts, which were featured with 3D-printed interlocking structures at their interface. By using high frequency induction heating, the joined region could be locally heated to reduce the thermal degradation and distortion of polymer parts. In addition, through the adjustment of interface morphologies and compression conditions, the polymer flow could be optimized to completely fill the interlocking grooves on metal parts, thereby achieving high joining strength. This suggests feasible guidelines for manufacturing metal-polymer joined structures involving 3D-printed architectures.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1056-1063
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• 2010

We present a new joining method for Pd-Cu membrane foils used as permeation tubes to collect $CO_2$. Since foils have poor mechanical strength, joining should be done at low temperatures to reduce residual stresses and without joining pressure. This contradicts the well known conditions for good contact between base materials that determines joint qualities. We selected Sn-Ag-Cu alloys that are highly reactive with Pd and Cu as a filler metal. As the filler melts at joining temperatures as low as $220{\sim}280^{\circ}C$, Pd and Cu are dissolved into the melt and react with the filler elements, which raises the melting temperature of the filler based on eutectic structures among the elements. Then, isothermal solidification progresses for the rest of the joining time. Intermetallic compounds (IMC) in the joints, one of the main factors for brittle joints, are inevitably formed. However, by optimizing both joining time and temperature, we balanced the wettability with IMC. Sealing test results confirmed that the joints are mechanically reliable during operation.

• Journal of Welding and Joining
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• v.21 no.1
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• pp.107-113
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• 2003

Joining of $Si_3N_4$ to $Si_3N_4$ with crystallized glass solder was studied. $SiO_2-Al_2O_3-MgO$ glass with $P_2O_5$ as a crystallizing reagent was used as a solder. To improve the hish temperature toughness of joined specimen, two stage heat treatment was applied to Joined sample for the crystallization of joined layer, Two factors, i.e. thickness of soldered layer and crystallization were taken and thier effects on joining strength were investigated by a SEM-EDX observation of joined interface and bending strength both at room and elevated temperatures. Obtained results are summarized as follows: (1) Nitrogen diffused from $Si_3N_4$ to solder during the Joining process. Average amount of nitrogen in soldered layer depended on the thickness of the soldered layer and increased with decrease of the thickness. (2) Joining strength of the specimen having a thinner soldered layer was stronger than that of thicker layer. This can be mainly attributed to the difference of the nitrogen content in the soldered layer. (3) Higher content of nitrogen in solder brought forth higher viscosity of the solder. Hence the crystallization of the solder become more difficult in thinner layer of the solder than thicker one. (4) Thus, the effect of crystallization was evaluated mostly by the thicker layer specimen. Crystallization of soldered layer improved markedly the fracure strength of joining at higher temperatures than the softening temperature of glass solder.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2000.02a
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• pp.6-8
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• 2000

The critical current density, Jc, of superconductor tape significantly depends on microstructural evolution during mechanical deformation. In this study, we fabricated Bi-2223 superconductor tape by PIT technique, and investigated mechanical properties of mono- and 61-filamentary tapes and their joined tapes. The strength of mono-filament tape was higher than those of 61-filament tape was higher than those of 61-filament tape, respectively. On the other hand, elongation of mono-filament tape, respectively. On the other hand, elongation of mono-filament tape was lower than 61 filament tape. The joined tapes shows lower strength and irreversible strain than those of unjoined tapes. The reduced strength and irreversible strain for joined tape is probably related to the induced damages such as irregular interface and Ag-instrusion in the transition region which acts as a stress concentration.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2002.10a
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• pp.591-598
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• 2002

The interface element method for non-matching FEM meshes is extended using stabilized nodal integration. Two non-matching meshes are shown to be joined together compatibly, with the aid of the moving least square approximation. Using stabilized nodal integration, the interface element method is able to satisfy the patch test, which guarantees the convergence of the method.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.35-41
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• 2003

Sintered alumina ceramics were joined by 2 kinds of SiO$_2$-CaO-A1$_2$O$_3$ glass solders having a similar expansivity as alumina. Wetting of glass/alumina was examined by sessile drop method. The observation of interface and bending strength related to alumina/glass/alumina systems were investigated by means of SEM/EDX and 4-point bending test. the result are summarized as follow: (1) Wetting of glass solders on alumina was good at temperatures higher than 145$0^{\circ}C$. (2) When the joining temperature wan high, diffusion and/or reactions between solder md alumina took place at the interface. These diffusions and reactions occurring at the interface greatly affected the bending strength of joining body. (3) Highest strength corresponding to 80% that of alumina was obtained by the solder of 35SiO$_2$-35CaO-30A1$_2$O$_3$(wt%) glass.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.10
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• pp.891-896
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• 2015

In order to protect the environment, using light material is becoming more and more attractive within the automobile industry. Aluminum alloys are the best and lightest metallic materials used in the automotive, electron, and aerospace industries. Al alloy and SGARC were joined by cold metal transfer (CMT) welding, using AlSiMn4 as a filler. Results showed that dissimilar metals from the Al 6000 series/SGARC could be successfully joined by CMT under proper processing parameters. The micro-hardness value of 125Hv was obtained at an interface.

• Journal of the Korean Society for Nondestructive Testing
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• v.28 no.3
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• pp.292-301
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• 2008

A linearized model for hysteretic acoustic nonlinearity of imperfectly joined interface is proposed and analyzed by using Coulomb damping to investigate the characteristics of the reflection and transmission coefficients for harmonic waves at the contact interface. Closed crack is modeled as non welded interface that has nonlinear discontinuity condition in displacement across its boundary. Based on the hysteretic contact stiffness of the contact interface, the reflected and transmitted waves are determined by deriving the tractions on both sides of the interface in terms of the discontinuous displacements across the interface. It is found that the amplitudes of the reflected and transmitted waves are dependent on the frequency and the hysteretic stiffness. As the frequency of the incident wave increases, the higher reflection and lower transmission are obtained. It also shows that the hysteresis of the interface increases the reflection coefficient, but reduces the transmission coefficient. A fatigue crack is also made in aluminum specimen to demonstrate these characteristics of the reflection and transmission of contact interfaces.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.19-24
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• 2000

To make stacked chip packages far high-density packaging of memory chips used in workstations or PC severs, several lead-frames are to be connected vertically. Fer this purpose. Sn or Sn/Ag were electrochemically deposited on Cu lead-frames and their microstructures were examined by XRD and SEM. Then, two specimens were annealed at $250^{\circ}C$ for 10 min. and pressed to be joined. The shear stresses of joined lead-frames were measured fur comparison. In the case of Sn only, $Cu_3Sn$ was formed by the reaction of Sn and Cu lead-frames. In the case of Sn/Ag, besides $Cu_3Sn$. $Ag_3Sn$ was formed by the reaction of Sn and Ag. Compared to joined specimens made from Sn only, those made from Sn/Ag showed 1.2 times higher shear stress. This was attributed to the $Ag_3Sn$ phase formed at the joined interface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.217-217
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• 2009

In this study, the effect of bending strain on the transport property and critical current of lap and butt-jointed BSCCO tapes have been investigated. The samples were joined using a mechanically controlled jointing procedure. In order to ensure a uniform pressure application at the joint part, a single point contact has been devised and also to achieve a uniform thickness at the joint interface.