• Journal of the Semiconductor & Display Technology
• /
• v.8 no.2
• /
• pp.31-35
• /
• 2009

In the silicon wafer polishing process, the mounting stage of silicon wafer on the ceramic carrier block has been using the polishing template which utilizes the porous surface instead of traditional wax mounting method. Here in this article, the experimental study is carried out in order to study the wafer demounting by water jet and the effects of operating conditions such as the water jet flowrate and the number of water jet nozzles on the wafer demounting time. It is found that the measured wafer demounting time is inversely proportional to the water flowrate per nozzle, regardless of number of nozzles used; implying that the stagnation pressure by the water jet impingement is the dominant key factor. Additionally, by using the transparent disk instead of wafer, the air bubble formation and growth is observed under the disk, making the passage of water flow, and subsequently demounting the wafer from the porous pad.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.13 no.3
• /
• pp.61-67
• /
• 2004

In micro hole punching process the burr occurs inevitably, but the burr must be minimized in order to improve the quality and accuracy of the product. In this study, magnetic field-assisted polishing technique is applied to remove the burr which exists in nozzles for ink-jet printer head and proved to be a feasible for deburring by experiment. The deburring characteristics of sheet metals was investigated changing with polishing time and magnetic abrasive size. After the deburring, the burr size has remarkably reduced and roundness of the hole also has improved.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2003.10a
• /
• pp.329-333
• /
• 2003

In micro hole punching process the burr occurs inevitably, but the burr must be minimized in order to improve the quality and accuracy of the product. In this study, magnetic field assisted polishing technique is applied to remove the burr which exists in nozzles for ink-jet printer head and proved to be a feasible for deburring by experiment. The deburring characteristics of sheet metals was investigated changing with polishing time. After the deburring, the burr size has remarkably reduced and roundness of the hole also has improved.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2000.05a
• /
• pp.854-857
• /
• 2000

Chemical Mechanical Polishing(CMP) has been accepted as one of the essential processes for VLSI fabrication. However, as the polishing process continues, pad pores get to be glazed by polishing residues, which hinder the supply of new slurry. This defect makes removal rate decrease with a number of polished wafer and the desired within-chip planarity, within wafer and wafer-to-wafer nonuniformity are unable to be achieved. So, pad conditioning is essential to overcome this defect. The eletroplated diamond grit disk is used as the conventional conditioner, And alumina long fiber, the .jet power of high pressure deionized water and vacuum compression are under investigation. But, these methods have the defects like scratches on wafer surface by out of diamond grits, subsidences of pad pores by over-conditioning, and the limits of conditioning effect. To improve these conditioning methods. this paper presents the Characteristics of Ultrasonic conditioning aided by cavitation.

• Progress in Superconductivity and Cryogenics
• /
• v.8 no.1
• /
• pp.9-14
• /
• 2006

Sample preparation plays a critical role in microstructure analysis using TEM. Although TEM specimen has been usually prepared by jet-polishing or Ar-ion beam milling technique. these methods could not be applied to YBCO CC which is composed of IBAD or RABiTS substrates, several buffet layers, and YBCO superconducting layer because of big difference in mechanical strengths between the metallic phase and oxide phases. To obtain useful cross-sectional information such as interface between the phases or second phases in YBCO CC, it is prerequisite to secure the large area of thin section in the cross-sectional direction. The superconducting layer or the buffer layers are relatively weak and fragile compared to the metallic substrate such as Ni-5wt%W RABiTS of Hastelloy-based IBAD, and preferential removal of weak ceramic phases during polishing steps makes specimen preparation almost impossible. Tripod polisher and small jig were home-made and employed to sample preparation. The polishing angle was maintained <$1^{\circ}$ throughout the polishing steps using 2 micrometers attached to the tripod plate. TEM specimens with large and thin area could be secured and used for RABiTS/IBAD substrate analyses. In some cases, additional Ar-beam ion milling with low beam current and impinging angle was used for less than 30 sec. to remove debris or polishing media attacked to the specimens.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 1995.10a
• /
• pp.24-29
• /
• 1995

A recently developed finishing process using rotating magnetic field is known to be very efficient for the finishing of parts such as vacuum tube, sanitary tube, etc., which are difficult to be finished by the conventional finishing methods as they are generally curbed tubes. But, the finishing system using rotating magnetic field have the defect that is the cross section of workpiece only circle because of internal rotating tool. Therefore, new finishing process of the workpieces which cross section are not circle is important and required. magnetic abrasive jet machining is a new concept finishing process. It is the precision internal finishing method using working fluid mixed with magnetic abrasives, which is jetted into the internal surface of tube. And magnetic poles are equipped on external surface of tube. In this study new concept finishing process or, magnetic abrasive jet machining system was developed. machining condition was predicted using simulation and some characteristics of the finishing process was analyzed.

• The korean journal of orthodontics
• /
• v.53 no.3
• /
• pp.139-149
• /
• 2023

Objective: To assess the color stability and translucency of full cubic stabilized zirconia (FSZ) following orthodontic bonding with different surface treatments and coffee thermocycling (CTC). Methods: This in vitro study was conducted on 120 disc-shaped specimens of FSZ. Thirty specimens were selected as the control group and remained intact. The remaining specimens were randomly divided into three groups based on the type of surface treatment (n = 30): airborne particle abrasion (APA), silica-coating (CoJet), and carbon dioxide (CO₂) laser. After metal bracket bonding in the test groups, debonding and polishing were performed. Subsequently, all specimens underwent CTC (10,000 cycles). Color parameters, color difference (ΔE₀₀), and translucency parameter (TP) were measured three times at baseline (t0), after debonding and polishing (t1), and after CTC (t2). Data were statistically analyzed (α = 0.05). Results: Significant difference existed among the groups regarding ΔE₀₀t0t2 (p < 0.001). The APA group showed minimum (ΔE₀₀ = 1.15 ± 0.53) and the control group showed maximum (ΔE₀₀ = 0.19 ± 0.02) color stability, with no significant difference between the laser and CoJet groups (p = 0.511). The four groups were significantly different regarding ΔTPt0t2 (p < 0.001). Maximal increases in TP were noted in the CoJet (1.00 ± 0.18) and APA (1.04 ± 0.38) groups while minimal increase was recorded in the control group (0.1 ± 0.02). Conclusions: Orthodontic treatment makes zirconia restorations susceptible to discoloration and increased translucency. Nonetheless, the recorded ΔE₀₀ and ΔTP did not exceed the acceptability threshold.

• Tribology and Lubricants
• /
• v.26 no.4
• /
• pp.219-223
• /
• 2010

Despite the increasing need of nanometer-scale accuracy in abrasive machining using ultrasmall particles such as abrasive jet and chemical mechanical polishing(CMP), the process mechanism is still unknown. Based on the background, research on the effects of various process parameters on the machined surface at abrasive machining was motivated and performed by using finite element analysis where the effect of slurry fluid flow involved. The effect of particle shape on the machined surface during particle-surface collision was discussed in this paper. The results from FEA simulation revealed that any damage or defect generation on machined surface by the impact may occur only if the particle has enough impact energy. Therefore, it could be concluded that generation of the defects and damage on the wafer surface after CMP process was mainly due to direct contact of the 3 bodies, i.e., pad-particle-wafer.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.86-89
• /
• 2003

Chemical Mechanical Planarization(CMP) has been accepted as the most effective processes for ultra large scale integrated (ULSI) chip manufacturing. However, as the polishing process continues, pad pores get to be glazed by polishing residues, which hinder the supply of new slurry. And pad surface is ununiformly deformed as real contact distance. These defects make material removal rate(MRR) decrease with a number of polishied wafer. Also the desired within-chip planarity, within wafer non-uniformity(WIWNU) and wafer to wafer non-uniformity(WTWNU) arc unable to be achieved. So, pad conditioning in CMP Process is essential to overcome these defects. The eletroplated or brazed diamond conditioner is used as the conventional conditioning. And. allumina long fiber, the jet power of high pressure deionized water, vacuum compression. ultrasonic conditioner aided by cavitation effect and ceramic plate conditioner are once used or under investigation. But. these methods arc not sufficient for ununiformly deformed pad surface and the limits of conditioning effect. So this paper focuses on the characteristics of diamond conditioner which reopens glazed pores and removes ununiformly deformed pad away.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1294-1298
• /
• 2005

In this study, combined micro press and surface finishing process are proposed to fabricate the micro nozzle array on a stainless steel sheet metal. In micro hole punching process the burr occurs inevitably, but the burr must be minimized in order to improve the quality and accuracy of the product. For this reason, subsequent magnetic field-assisted finishing technique is applied to remove the burr which exists around the nozzles for ink-jet printer head and proved to be a feasible for deburring by experiment. The deburring characteristics of sheet metals were investigated changing with polishing time and magnetic abrasive size. After the deburring, the burr size has remarkably reduced and roundness of the hole also has improved.