• Title/Summary/Keyword: Jet Dispenser

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Evaluation and Development of Multi Thermal Bubble Ink Jet 3D Printing System (다중써멀버블 잉크젯방식의 3D 프린팅 시스템 개발 및 성능평가)

  • Shin, Mun Gwan;Bae, Sung Woo;Kim, Jung Su
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.9
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    • pp.787-792
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    • 2015
  • Recently, 3D printing technology is a hot issue in various industrial fields. According to the user's application, it allows for the free form fabrication method to be utilized in a wide range. The powder based fusion technique is one of the 3D printing methods. When using this method it is possible to apply the various binder jetting techniques such as piezo, thermal bubble jet, dispenser and so on. In this paper, a multi thermal bubble ink jet was integrated for jetting of powder binding material and developing a power fused 3D printing system. For high quality 3D printing parts, it needs an analysis and evaluation of the behavior of the thermal bubble ink jet head. In the experiment, a correlation between jetting binder quantity and layer thickness of powder was investigated, and a 3D part model was fabricated, which was used by measuring the scale factor.

Efficient way to clean Solder Printer Nozzles

  • Kim, Young-Min;Kim, Chi-Su
    • Journal of the Korea Society of Computer and Information
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    • v.27 no.11
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    • pp.115-121
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    • 2022
  • In surface mount technology (SMT), the screen printer, which is an equipment for applying solder cream, has a lot of poor coating as the pad becomes smaller. To solve this problem, a jet printer is being used recently. However, if the nozzle at the end of the valve applied to the jet printer head is not cleaned, solder cream remains or an error occurs. To prevent this, the nozzles should be cleaned periodically. In this paper, a more stable cleaning method than the existing technology is presented for the stable application of solder cream on a jet printer. In this method, cut a 35mm wide mujin cloth, wrap it in a roll, and rotate it with a DC geared motor on the other side to clean it. As a result, it was confirmed that the solder paste was not left on the nozzle surface and was well wiped when cleaning with about 2,000 dotting cycles.