• Journal of Magnetics
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• 제4권3호
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• pp.102-106
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• 1999

Ce exhibits the intermediate valence (IV) state both as an element and in its compounds. In the present review characteristic behavior of the materials showing the IV state are described. Then the methods of producing this state : the application of the external pressure, temperature and magnetic field as well as the alloying are being discussed. An identification of the IV state is frequently not a simple goal and the best results can be obtained using a combination of various independent methods. Particular attention is paid to the X-ray spectroscopy, lattice parameters and the magnetic properties. As the examples of the IV state in the Ce compounds the properties of following materials are reported : CeRhSb, $CeCu_5In_7, CeAg_6In_6, Sc_{1-x}Ce_xFe_4Al_8 $and for comparison Sc1-xYbxFe4Al8.

• 한국표면공학회지
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• 제36권4호
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• pp.329-333
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• 2003

The high-temperature oxidation behavior of Ti39Al-10V alloy that consisted primarily of $\beta$-Ti, ${\gamma}$-TiAl, and $\alpha_2$ $-Ti_3$Al phases was studied. The relatively thick and porous oxide scales formed consisted primarily of an outermost, thin TiO$_2$ layer, and an outer, thin $Al_2$$O_3$-rich layer, and an inner, very thick (TiO$_2$, $Al_2$$O_3$) mixed layer. Vanadium was present uniformly throughout the oxide scale. The formation and subsequent evaporation of V-oxides such as VO, $VO_2$, and $V_2$O$_{5}$ deteriorated oxidation resistance and scale adherence of the TiAl alloy significantly.y.

• 한국표면공학회지
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• 제33권5호
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• pp.365-372
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• 2000

Pure $Fe_3$Al alloys with three different compositions of Fe-21.8%Al, Fe-24.1%Al and Fe-27.2%Al were prepared by vacuum induction melting followed by homogenization and hot forging. The long-time oxidation behavior of the prepared alloys was studied at 1073, 1273 and 1473k in air. The oxidation resistance greatly increased with an increase in Al contents. Thin and uniform oxide scales were always formed on Fe-27.2%Al, while thick and fragile oxide scales were formed on Fe-(21.8, 24.1%)Al. Internal oxidation was observed in Fe-(21.8, 24.1%)Al, when oxidized above 1273K. The major oxidation product of all the oxidized alloys was always $\alpha$-$Al_2$$O_3$.

• 대한금속재료학회지
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• 제47권5호
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• pp.267-273
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• 2009

Three types of structural intermetallic compounds, $Ni_3Al$, NiAl and TiAl, having each single phase structure without pores were produced by arc-melting process. Their sliding wear properties were investigated against a hardened tool steel. It was shown that the wear of the intermetallic compounds was hardly occurred against the hardened tool steel. TiAl compound showed the best wear resistance among them. In this case, wear was preferentially occurred on the surface of the hardened tool steel of the mating material which has higher hardness. It could be found that the wear mode on intermetallics without pores by arc-melting process was different from that on its porous layer coated on steel by combustion synthesis.

• 대한금속재료학회지
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• 제48권2호
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• pp.141-147
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• 2010

An Ni-Al intermetallic coating has been produced by induction heating on mild steel. The effect of the induction heating conditions on the microstructure of the coating has been investigated. The reaction synthesis of the intermetallic compounds was promoted while increasing the heating rate and the holding time at reaction temperature. Especially, an NiAl phase corresponding to the initial composition of mixed powder was predominantly formed. However, the synthesis at low reaction temperatures occurred by solid state diffusion during the holding time and an Fe-Al reaction layer was formed at the interface with the substrate, regardless of the heating rate. The combustion synthesis of the intermetallic compound occurred at a temperature higher than 1023 K and resulted in an almost single phase NiAl structure.

• 열처리공학회지
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• 제19권1호
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• pp.10-19
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• 2006

Microstructure and morphology of precipitates in $Ni_3Al$- and TiAl-based intermetallics containing carbon have been investigated in terms of transmission electron microscopy(TEM). In an $L1_2$-ordered $Ni_3Al$ alloy with 4 mol.% of chromium and 0.2~3.0 mol.% of carbon, fine octahedral precipitates of $M_{23}C_6$ type carbide were formed in the matrix by aging at temperatures around 973 K after solution annealing at 1423 K. TEM examination revealed that the $M_{23}C_6$ phase and the matrix lattices have a cube-cube orientation relationship and keep partial atomic matching at the {111} interface. After prolonged aging or by aging at higher temperatures, the $M_{23}C_6$ precipitates then adopt a rod-like morphology elongated parallel to the <100> directions. In the $L1_0$-ordered TiAl containing 0.1~2.0 mol.% carbon, TEM observations revealed that needle-like precipitates, which lie only in one direction parallel to the [001] axis of the $L1_0$ matrix, appear in the matrix and preferentially at dislocations. Selected area electron diffraction(SAED) patterns analyses have shown that the needle-shaped precipitate is $Ti_3AlC$ of perovskite type. The orientation relationship between the $Ti_3AlC$ and the $L1_0$ matrix is found to be $(001)_{Ti3AlC}//(001)_{L10\;matrix}$ and $[010]_{Ti3AlC}//[010]_{L10\;matrix}$. By aging at higher temperatures or for longer period at 1073 K, plate-like precipitates of $Ti_2AlC$ with a hexagonal structure are formed on the {111} planes of the $L1_0$ matrix. The orientation relationship between the $Ti_2AlC$ and the $L1_0$ matrix is $(0001)_{Ti2AlC}//(111)_{L10\;matrix}$ and $_{Ti2AlC}//_{L10\;matrix}$.

• 마이크로전자및패키징학회지
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• 제22권2호
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• pp.47-53
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• 2015

인쇄회로기판 솔더 상부 및 하부 접합부의 서로 다른 표면처리 조건에 따른 Sn-3.0Ag-0.5Cu (SAC305) 접합부의 열처리 및 전류 인가에 따른 금속간 화합물 성장거동을 비교하기 위하여 in-situ 미세구조분석 및 electromigration (EM) 수명평가를 실시하였다. 솔더 접합 직후, 상부 접합부의 electroless nickel immersion gold (ENIG) 표면처리에서는 $(Cu,Ni)_6Sn_5$, 하부 접합부의 organic solderability preservative (OSP) 표면처리에서는$ Cu_6Sn_5$, $Cu_3Sn$ 금속간 화합물이 접합 계면에서 생성되었다. EM 수명평가 결과 온도 $130^{\circ}C$, 전류밀도 $5.0{\times}10^3A/cm^2$ 하에서 평균파괴시간이 약 78.7 hrs으로 도출되었고, 하부 OSP 표면처리에서 전자가 솔더로 빠져나가는 부분에서 Cu의 소모에 의한 단락이 주 손상기구로 확인되었다. In-situ 주사전자현미경을 통해 계면 미세구조 분석 결과 상부 접합부 ENIG 표면처리에서 전자의 방향에 따른 미세구조의 큰 차이가 없고 뚜렷한 손상이 관찰되지 않았으나, 하부 접합부 OSP 표면처리의 경우 전자가 솔더로 유입되는 부분에서 빠른 Cu 소모로 인한 보이드 성장이 관찰되었다. 따라서, SAC305무연솔더 접합부에서 ENIG 표면처리가 OSP 표면처리보다 보다 우수한 EM확산방지막 역할을 하여 금속간 화합물 성장을 억제하고 보다 우수한 EM 신뢰성을 보이는 것으로 판단된다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.

• 한국분말재료학회지
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• 제4권4호
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• pp.283-290
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• 1997

$Ti_5Si_3$ intermetallics containing 0-6 wt% of Cu were made by reactive sintering (RS) under vacuum using elemental powder mixtures (Process 1), electro-pressure sintering (EPS) using RS'ed materials (Process2), and EPS using elemental powder mixtures (Process 3). Relatively low dense titanium silicides were gained by process 1, in which porosity decreased with increasing Cu content. For example, porosity changed from 42 to 19.4% with the increase in Cu content from 0 to 6 wt%, indicating that Cu is a useful sintering aid. The titanium silicides fabricated by Process 2 had a higher density than those by Process 1 at given composition, and porosity decreased with increasing Cu content. For example, porosity decreased from 38 to 6.8% with the change in Cu content from 0 to 6 wt%. A high dense titanium silicides were obtained by Process 3. In this Process, porosity decreased a little by Cu addition, and was almost insensitive to Cu content. Namely, about 9 or 7% of porosity was shown in 0 or 1-6 wt% Cu containing silicides, respectively. The hardeness increased by Cu addition, and was not changed markedly with Cu content for the silicides fabricated by Process 3. This tendency was considered to be resulted from porosity, hardening of grain interior by Cu addition, and softening of grain boundary by Cu-base segregates. All these results suggested that EPS using elemental powder mixtures (Process 3) is an effective processing method to achieve satisfactorily dense titanium silicides.

• Korean Chemical Engineering Research
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• 제55권3호
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• pp.379-384
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• 2017

LiCl 용융염에서 희토류 산화물의환원율을 높이기 위해 NiO와 혼합하여 전해환원을실시하였다. Cyclic voltammetry (CV) 실험을 통해 LiCl 용융염 내에서 혼합산화물의 전기화학적 환원거동을 조사하였다. 혼합산화물로 제작된 환원전극과 그라파이트 산화전극 사이에 일정한 작동전압을 인가하여 이론전하량 대비 다양한 전하량을 공급한 후 중간생성물의 결정구조를 XRD를 이용하여 분석하였다. NiO 산화물을 첨가함으로써 전기전도성이 좋은 Ni 금속 주위로 희토류 산화물이 환원되어 RE-Ni 합금형태의 금속으로 완전히 전환되었으며, 합금을 형성하는 반응 메커니즘을 제시하였다.