• Journal of the Korean institute of surface engineering
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• v.40 no.1
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• pp.23-31
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• 2007

The objective of this study is to investigate the effect of Al addition on the reaction behavior of cobalt with molten zinc. Pure cobalt specimen was immersion tested in the three kinds of molten zinc (pure, 0.12%Al added and 0.24%Al added) baths at $460^{\circ}C,\;490^{\circ}C\;and\;520^{\circ}C$. For the understanding of degradation processes, specimens were analyzed with scanning electron microscope (SEM) and energy dispersive spectrum (EDS), and electrochemical stripping method. When 0.12% and 0.24% Al was added in molten zinc baths, three intermetallic compounds layers of ${\gamma},\;{\gamma}_1,\;and\;{\gamma}_2$ were formed on the Co matrix and ${\beta}_1$ layer was not formed between the Co matrix and the ${\gamma}$ layer. Particles of CoAl intermetallic compound were formed at the interface between the ${\gamma}_2$ layer and zinc melt and they did not adhere to the Co-Zn intermetallic layer. Weight loss of the Co specimen increased as Al content in the molten zinc increased and the relationship of weight loss vs. immersion time followed parabolic rate law. Rate controlling process for the reaction rate of Co with Al added molten zinc was analyzed as the diffusion process of Al atom through a boundary layer between the ${\gamma}_2$ layer and the Al added zinc melt.

• Journal of the Korean Electrochemical Society
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• v.2 no.3
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• pp.150-155
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• 1999

The Electrochemical stabilities of the Brewer-Engel type intermetallic compounds of Co-Mo $(35 wt\%)$ and Ni-Mo$(35 wt\%)$ manufactured by the arc-melting method for the hydrogen electrode of $H_2-O_2$ alkaline fuel cell were investigated. Effects of temperature and concentration on the electrochemical behavior of the electrodes in the $80^{\circ}C$ 6 N KOH solution deaerated with $N_2$ gas were studied by electrochemical methods. The effect of overpotential on the electrochemical stabilities of Co-Mo and Ni-Mo intermetallic compounds was also discussed under the normal operation condition of AFC. It was shown that Co-Mo electrode had lower electrochemical stability as compared to Ni-Mo. In the case of Co-Mo electrode, a simultaneous dissolution of cobalt and molybdenum has occurred at low anodic overpotential form equilibrium hydrogen electrode potential, but the dissolution of cobalt was serious, and Co(OH)l layer on the electrode surface formed at the high anodic overpotential. In contrast the Ni-Mo electrode had high electrochemical stability because formation of the dense and thin protective $Ni(OH)_2$ layer prevented the dissolution of molybdenum.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.9-18
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• 1999

In this study, Metallugical properties between Sn-3.5Ag, Sn-37Pb eutectic solders and Au/Ni/cu substrate according to time span above the melting point were investigated. A conventional reflow soldering machine wert used for this study and time span above the melting point was determined by changing peak soldering temperature and conveyor speed. As results, scallop type intermetallic compounds of $Ni_3Sn_4$ were formed at joint interface and no Cu-Sn compounds were found at all; Ni layer performed as a barrier for Cu diffusion. As the peak soldering temperature increased, thickness of the intermetallic compound layer increased; maximum thickness of the scallop-layer was 2.2$\mu\textrm{m}$. The shape of scallops were transformed from hemi-sphere type to elliptical shape with smaller size. Micro-hardness of the solder joint decreased as the eutectic structure of Sn-3.5Ag and Sn-37Pb increased.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.05a
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• pp.5-5
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• 1999

A novel process is proposed to improve oxidation resistance of Ti-Al intermetallic compounds at elevated temperatures by both Cr addition and pre-sulfidation, where TiAl alloys withlor without Cr addition were sulfidized at 1173K for 86.4ks at a 1.3 Pa sulfur partial pressure in a $H_2-H_2S$ gas mixture. The pre-sulfidation treatment formed a thin Cr-Al alloy layer as well as 7~10 micrometer $TiAl_3$ and $TiAl_2$ layer, due to selective sulfidation of Ti. Oxidation resistance of the pre-sulfidation processed TiAl 4Cr alloy was examined under isothermal and heat cycle conditions between room temperature and 1173K in air. Changes in $TiAl_3$ into $TiAl_2$ and then TiAl phases as well as their effect on oxidation behavior were investigated and compared with the oxidation behavior of the TiAl-4Cr alloy as TiAl and pre-sulfidation processed TiAl aHoys. After oxidation for up to 2.7Ms a protective $Al_2O_3$ scale was formed, and the pre-formed $TiAl_3$ changed into $TiAl_2$ and the $Al_2Cr$ phase changed into a CrAlTi phase between the $Al_2O_3$ scale and $TiAl_2$ layer. The pre-sulfidation processed TiAl-4Cr alloy had very good oxidation resistance for longer times, up to 2.7 Ms, in contrast to those observed for the pre-sulfidation processed TiAl alloy where localized oxidation occurred after 81 Oks and both the TiAl and TiAl-4Cr alloys themselves corroded rapidly from the initial stage of oxidation

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.726-731
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• 2002

Reaction synthesis is a process to form ceramics, intermetallics and their composites from elemental powder mixture. Application of this process to a surface modification techniques has a possibilities to enable the process at a lower temperature or for a shorter time, although synthesized materials are likely to include voids and unreacted elements. This paper intend to examine the effect of Si addition to the mixture of Al and Ni on the densification of synthesized Ni-Al intermetallic compounds and to evaluate the surface properties of obtained coatings. By the Si addition, exothermic reaction temperature to form Ni-Al intermetallic was lowered to be below the melting point of Al. Si soluted $Al_3$Ni$_2$, $Al_3$Ni and $Al_{6}$Ni$_3$Si were mainly formed in the coating layer when powder mixture was heated to 973K for 300s. Besides, densification was enhanced by increasing hot press pressure, Si additions and heating rate. When the composition of eutectic Al-Si reaches 78%, void ratio of sintered compact reduced to 0.4%. It is caused by higher flowability of Al-Si liquid phase generated and its infiltration into the void. Since the hardness of NiAl(Si) compound (about 600HV) formed in the coating layer is higher than that of Ni-Al compound (about 400HV), coating layer with high density and superior wear property is obtained by hot press using reaction synthesis from Al-Ni-Si powder mixture.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.133-137
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• 2003

The effect of Bi additions to the eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compound (IMC) layers during solid-state aging of Sn-Ag-Bi/Cu solder joints has been Investigated. The Bi additions enhanced the growth rate of the total IMC layer comprising of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers. This enhanced IMC growth rate was primarily due to the rapid increase In the growth rate of $Cu_6Sn_5$ sublayer. The growth rate of $Cu_3Sn$ sublayers was little influenced and appeared to be retarded by the Bi additions. The observed growth behavior of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers could be understood if the interfacial reaction barrier at the $Cu_6Sn_5/solder$ interface were reduced by the segregation of Bi at the interface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.152-158
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• 2016

The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.285-287
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• 2002

This study is investigated in variations of micro-structures and mechanical properties of Ti/SUS321L joint with bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed the thickness of their reaction layer increased. In tensile test, it was examined that the tensile strength had maximum value at the bonding time of 5min and decreased after bonding time over 5min because of increasing their oxides and intermetallic compounds.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.