• 한국전기전자재료학회논문지
• /
• 제17권3호
• /
• pp.267-271
• /
• 2004

The joint strength and fracture surface of Sn-Pb solder bump in photo diode packages after isothermal aging testing were studied experimentally. Cu/Sn-Pb solders were adopted, and aged for up to 900 hours at 12$0^{\circ}C$ and 17$0^{\circ}C$ to analyze the effect of intermetallic compound(IMC). In 900-hour aging experiments, the maximum shea strength of Sn-Pb solder decreased by 20％ and 9％. The diffraction patterns of Cu$_{6}$Sn$_{5}$, scallop-shape IMC, and planar-shape Cu$_3$Sn were observed by Transmission Electron Microscopy (TEM).EM).

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 1995년도 춘계학술대회논문집
• /
• pp.90-106
• /
• 1995

The "O"S' BONDING make metallic and non-metalic crystal structures and form localized superconducting orbitals , which induce electrical conduction , semi-conduction, and superconduction. The orbitals are proced by Ampere's law, Faraday's law , Meissner effect, highcritical temperature of thecopper oxide layers. abnomal trans-membrane signal in cancer cell and plastic deformations bytwins and dislocations, In the case of alloying metals, the most deterimentla cases of electrical conduction are those of solid solution and intermetalic compound . The highest case for the hardness are also those of solid solution and intermetallic compound. It explains the contributions of the "O"S' BONDING for conduction bands and plastic deformation by twins and dislocations.ns and dislocations.

• 한국표면공학회지
• /
• 제9권2호
• /
• pp.1-7
• /
• 1976

The dissolving and growth kinetics of intermetallic compounds for the reaction between solid iron and molten zinc were studied under nitorgen atmosphere over the temperature range between470$^{\circ}C$ and 680$^{\circ}C$. The rates of dissolution of solid iron into molten zinc were obtained under a static conditon, The amount of dissolution of sold iron and the growth of intermetalic compounds could be determined by means of microscopy. The thickness of intermetallic compound at a given temperature increases with increasing time, whereas for a given time decreases with increasing temperature . The rate of dissolution is controlled by the diffusion process of iron in the effective boundary layer of molten zinc over the temperature range 470$^{\circ}$-530$^{\circ}C$, 570$^{\circ}$-620$^{\circ}C$, and 650$^{\circ}$-665$^{\circ}C$, while by the surface reaction over the range 530$^{\circ}$-570$^{\circ}C$ and 620$^{\circ}$-650$^{\circ}C$.

• 한국레이저가공학회지
• /
• 제14권4호
• /
• pp.9-13
• /
• 2011

The solar panel that consists of copper plate and copper tube was successfully welded by ultrasonic seam welding. However it was not only expensive the copper material but also ultrasonic welding has many problem such as high error rate, difficulty of dissimilar material welding, noise, etc. At this study, the laser welding of solar panel with aluminum plate instead of copper. The welding were carried out with the pulsed Nd:YAG laser and the weld bead geometry was measured with the variation of pulse energy. Consequently, there was no difference between the ultrasonic and the laser welding on the performance of heat transfer capacities. Also the formation of intermetalic compound such as CuAl2 was increased with the pulse energy.

• 한국재료학회지
• /
• 제17권8호
• /
• pp.402-407
• /
• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• 대한금속재료학회지
• /
• 제47권12호
• /
• pp.811-818
• /
• 2009

In order to meet increasingly complex and rigorous technical specifications, extensive effort has been devoted to fabricate clad materials with multi-layered metal plates. In this study, novel stainless steel/aluminum/copper (STS/Al/Cu) three-ply clad materials were fabricated by a hot rolling process for cookware applications. The effect of the testing temperature on the mechanical properties of the clad materials and on each component metal was investigated during the tensile tests. The interface properties of the clad materials were also examined by optical microscopy (OM) and an electron probe micro-analyzer (EPMA). The best mechanical and interfacial properties for a warm working process were found in a sample annealed at a temperature of $300^{\circ}C$. For the sample annealed at $400^{\circ}C$, the results of the tensile test indicated that interface delamination occurred only in the region of the Al/Cu interfaces. This was due to the formation of the thick and brittle intermetallic compound of $Al_2Cu$ in the Al/Cu interface. In contrast, no interface delamination was observed in the STS/Al interface, most likely due to its strong bond strength.

• 한국진공학회지
• /
• 제17권5호
• /
• pp.466-472
• /
• 2008

퍼플골드는 78wt%Au-22wt%Al로 이루어진 합금으로 화학식은 $AuAl_2$로 표현된다. 최근 화이트골드, 핑크골드와 더불어 특유의 적자색 (보라색)이 나는 유색골드의 하나로 장신구나 의장용 소재로 활용되고 있다. 퍼플골드는 Au와 Al의 중간상으로 연성과 주조성이 나쁜 특성이 있어 단조와 주조작업을 통하여 원하는 형상의 퍼플골드를 얻기 힘든 단점이 있다. 따라서 절단과 연마공정만으로 최종제품을 제작하거나 박막으로 증착하여 의장용 소재로 활용하는 것이 가능하다. 본 연구는 순수한 Au와 Al을 소오스로 각각 200nm$SiO_2$/Si기판에 78:22의 무게비로 증착시킨 후 열처리를 시행한 경우와, $AuAl_2$를 용융을 통하여 벌크형으로 얻은 후 이를 소오스로 사용하여 유리기판에 기판온도를 상온으로 유지하면서 진공증착을 통하여 표면처리를 한 경우로 나누어 실험을 진행하였다. 완성된 시편은 육안검사, 미세구조분석, 면저항분석, 색차분석, XRD 분석을 통하여 증착된 퍼플골드의 색과 두께를 위주로 한 물성을 측정하였다. 12.5nmAu/40nmAl/200nm$SiO_2$/Si 구조로 제작하고 열처리 한 경우 과도한 표면응집현상이 일어나면서 퍼플골드가 형성되지 않았다. $AuAl_2$ 소오스로부터 직접 열증착한 경우는 벌크상태와 동일한 적자색을 보였으며 퍼플골드의 의장용으로서 심미적 기능이 가능한 것으로 판단되었다.