• Proceedings of the Korean Institute of Building Construction Conference
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• 2019.05a
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• pp.107-108
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• 2019

The interlayer noise of the apartment house is a typical problem that reduces the quality of the residential environment. Therefore, many researchers have developed soundproofing materials that blocks noise between floors. However, most development technologies do not have the noise cut-off effect felt by residents, and may also have a defect in long-term deflection. In this respect, this study developed high-performance interlayer soundproofing material that can overcome existing problems. The developed technology has the noise reduction effect experienced by the residents and it has high durability without long-term deflection. Therefore, high-performance interlayer soundproofing material is expected to contribute to reducing disputes over noise between floors of apartment residents.

• Journal of Welding and Joining
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• v.23 no.6
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• pp.99-105
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• 2005

The mixing ratio effect of the GTD-111(base metal) powder and the GNI-3 (Ni-l4Cr-9.5Co-3.5Al-2.5B) powder on TLP(Transient Liquid Phase) bonding phenomena and mechanism was investigated. At the mixing ratio of the base metal powder under $50wt\%$, the base metal powders fully melted at the initial time and a large amount of the base metal near the bonded interlayer was dissolved by liquid inter metal. Liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B into the base metal. The solid phases in the bonded interlayer grew epitaxially from the base metal near the bonded interlayer inward the insert metal during the isothermal solidification. The number of grain boundaries farmed at the bonded interlayer corresponded with those of base metal. At the mixing ratio above $60wt\%$, the base metal powder melted only at the surface of the powder and the amount of the base metal dissolution was also less at the initial time. Nuclear of solids firmed not only from the base metal near the bonded interlayer but also from the remained base metal powder in the bonded interlayer. Finally, the polycrystal in the bonded interlayer was formed when the isothermal solidification finished. When the isothermal solidification was finished, the contents of the elements in the boned interlayer were approximately equal to those of the base metal. Cr-W borides and Cr-W-Ta-Ti borides formed in the base metal near the bonded interlayer. And these borides decreased with the increasing of holding time.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1775-1778
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• 2006

Through baking process on an interlayer, known as hole transporting layer, varying baking temperature up to 300 degree, which is considered as extremely high for polymer light emitting device (PLED) system, we found interesting relationship between packing density and morphology affecting device performance. Granular morphology shows that as temperature increases, grain size is getting smaller to pack closely and make interlayer harden. Such denser interlayer has temperature dependency of its own mobility, even without clear evidence of degradation of material itself. Its fact proven in a single film also reflects on multilayered PLED's performance like IVL, efficiency, lifetime. It's found that, especially, to enhance lifetime is related with thermal stability of interlayer and its mobility dependency to meet better charge balance. Therefore, it gives us understanding not only baking effect of interlayer, but also material & device designing guide to enhance lifetime.

• ETRI Journal
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• v.33 no.1
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• pp.32-38
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• 2011

We investigated the light-emitting performances of blue phosphorescent organic light-emitting diodes, known as PHOLEDs, by incorporating an N,N'-dicarbazolyl-3,5-benzen interlayer between the hole transporting layer and emitting layer (EML). We found that the effects of the introduced interlayer for triplet exciton confinement and hole/electron balance in the EML were exceptionally dependent on the host materials: 9-(4-tert-butylphenyl)-3,6-bis(triphenylsilyl)-9H-carbazole, 9-(4-tert-butylphenyl)-3,6-ditrityl-9H-carbazole, and 4,4'-bis-triphenylsilanyl-biphenyl. When an appropriate interlayer and host material were combined, the peak external quantum efficiency was greatly enhanced by over 21 times from 0.79% to 17.1%. Studies on the recombination zone using a series of host materials were also conducted.

• Corrosion Science and Technology
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• v.10 no.2
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• pp.65-70
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• 2011

DLC is considered as the candidate material for application of moving parts in automotive components relatively in high pressure and temperature operating conditions for its high hardness with self lubrication and chemical inertness. The properties of interlayer between the substrate and the DLC film were studied. Arc ion plating method have been employed to deposit onto substrate and sputtering method was used for synthesizing DLC onto interlayer. Among these six types of interlayer, deposited DLC film onto TiCN showed excellent value for characteristics. From the results of analysis for physical properties of DLC films, it seems that the adhesion forces were more important factors than intrinsic mechanical properties such as hardness, roughness and wear resistance of DLC films. AFM(Atomic Force Microscope) was used for understanding roughness of DLC films. Hardnesses of the coating layers were identified by nano-indentation method and adhesions were checked by scratch method.

• Coupled systems mechanics
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• v.12 no.6
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• pp.519-530
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• 2023

This paper presents a mathematical model suitable for the calculation of laminated glass, i.e. glass plates combined with an interlayer material. The model is based on a beam differential equation for each glass plate and a separate differential equation for the slip in the interlayer. In addition to slip, the model takes into account prestressing force in the interlayer. It is possible to combine the two contributions arbitrarily, which is important because the glass sheet fabrication process changes the stiffness of the interlayer in ways that are not easily predictable and could introduce prestressing of varying magnitude. The model is suitable for reformulation into an inverse procedure for calculation of the relevant parameters. Model consisting of a system of differential-algebraic equations, proved too stiff for cases with the thin interlayer. This novel approach covers the full range of possible stiffnesses of layered glass sheets, i.e., from zero to infinite stiffness of the interlayer. The comparison of numerical and experimental results contributes to the validation of the model.

• Transactions of the Korean Society of Automotive Engineers
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• v.4 no.6
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• pp.18-26
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• 1996

A two dimensional thermo elasto-plastic finite element stress analysis was performed to study residual stress distributions in AI composites reinforced by SiC whisker and $ZrO_2$ ceramic joints. The influences on the residual stress distributions due to the difference of the reinforcement volume fraction and interlayer material property were investigated. Specifically, stress distributions between AI interlayer material property were investigated. Specifically, stress distributions between AI interlayer and $ZrO_2$ ceramic and between the AI interlayer and AI composite were computationally analzed.

• Journal of Welding and Joining
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• v.25 no.5
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• pp.45-50
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• 2007

The Ni-base superalloy GTD111 DS is used in the first stage blade of high power land-based gas turbines. Advanced repair technologies of the blade have been introduced to the gas turbine industry over recent years. The effect of the filler metal powder on Transient Liquid Phase bonding phenomenon and tensile mechanical properties was investigated on the GTD111 DS superalloy. At the filler metal powder N series, the base metal powders fully melted at the initial time and a large amount of the base metal near the bonded interlayer was dissolved by liquid inter metal. Liquid filler metal powder was eliminated by isothermal solidification which was controlled by the diffusion of B into the base metal. The solids in the bonded interlayer grew from the base metal near the bonded interlayer inward the insert metal during the isothermal solidification. The bond strength of N series filler metal powder was over 1000 MPa. and ${\gamma}'$ phase size of N series TLP bonded region was similar with base metal by influence of Ti, Al elements. At the insert metal powder M series, the Si element fluidity of the filler metal was good but microstructure irregularity on bonded region because of excessive Si element. Nuclear of solids formed not only from the base metal near the bonded interlayer but also from the remained filler metal powder in the bonded interlayer. When the isothermal solidification was finished, the content of the elements in the boned interlayer was approximately equal to that of the base metal. But boride and silicide formed in the base metal near the bonded interlayer. And these boride decreased with the increasing of holding time. The bond strength of M series filler metal powder was about 400 MPa.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.1
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• pp.6-10
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• 2018

Ni germanide (NiGe) is a promising alloy material with small contact resistance at the source/drain (S/D) of Ge MOSFETs. However, it is necessary to reduce the specific contact resistance between NiGe and the doped Ge S/D region in high-performance MOSFETs. In this study, a novel method is proposed to reduce the specific contact resistance between NiGe and p-type Ge (p-Ge) using a Tb interlayer. The specific contact resistance between NiGe and p-Ge was successfully decreased with the introduction of the Tb interlayer. To investigate the mechanism behind the reduction in the specific contact resistance, the elemental distribution and crystalline structure of NiGe were analyzed using secondary ion mass spectroscopy and X-ray diffraction. It is likely that the reduction in specific contact resistance was caused by an increase in the concentration of boron in the space between NiGe and p-Ge due to the influence of the Tb interlayer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.397-397
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• 2007

Diamondlike carbon (DLC) coatings were deposited on alumina ceramic seals using a plasma immersion ion deposition technique (PIID). Then they were subjected to tribological tests using a pin-on-disc tribometer under a high load (1.3 GPa) and under elevated temperatures up to 400C. Coefficients of friction (COFs) were recorded and compared with that of the untreated alumina while the wear tracks were analyzed using SEM with EDS to characterize the DLC films. To enhance the DLC adhesion to the substrate, various interlayers including Si and Cr were deposited using the PIID process or an ion beam assisted deposition (IBAD) method. It was observed that the DLC coating, if adhering well to the substrate, reduced the COFs significantly, from 0.4-0.8 for the uncoated alumina to about 0.05-0.1, within the tested temperature range. The adhesion was determined by the interlayer type and possibly by the application method. Cr interlayer did not perform as well as the Si interlayer. This could also be due to the fact that the Cr interlayer and the subsequent DLC coating had to be done in two different processing systems, while both the Si interlayer and the subsequent DLC film were deposited in one system without breaking the chamber. The coating failure mode was found to be delamination between the Cr and the alumina substrate. In contrast, the Si interlayer with proper DLC deposition procedures resulted in very good adhesion and hence excellent tribological performance. Further study may lead to future DLC applications of ceramic seals.