• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.9
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• pp.27-33
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• 2016

Phenolic resin has excellent heat resistance and good mechanical properties as a thermosetting resin. However, its thermosetting characteristics cause it to produce a non-recyclable waste in the form of sprue and runner which is discarded and represents up to 15~20% of the overall products. Forty thousand tons of phenolic resin sprue and runner are disposed of (annually). The (annual) cost of such domestic waste disposal is calculated to be 20 billion won. In this study, discarded phenol resin scraps were pulverized and treated by silanes to improve their interfacial adhesion with HDPE. The sizes of the pulverized pulverulent bodies and fine particles were (100um~1000um) and (1~100um), respectively. The pulverized phenol resin was treated with 3-(methacryloyloxy) propyltrimethoxysilane and vinyltrimethoxy silane and the changes in its characteristics were evaluated. The thermal properties were evaluated by DSC and HDT. The mechanical properties were assessed by a notched Izod impact strength tester. When the silane treated phenol resin was added, the heat distortion temperature of HDPE increased from $77^{\circ}C$ to $96^{\circ}C$ and its crystallinity and crystallization temperature also increased. Finally, its impact strength and tensile strength increased by 20% and 50%, respectively, in comparison with the non-treated phenol resin.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.71-79
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• 2021

In this study, we have successfully fabricated the Sn-Ni paste and evaluated the bonding properties for high-temperature endurable EV (Electric Vehicle) power module applications. From evaluating of the micro-structural changes in the TLPS (Transient Liquid Phase Sintering) joints with Sn and Ni contents in the Sn-Ni pastes, a lack of Ni powders and Ni particle agglomerations by Ni surplus were observed in the Sn-20Ni and Sn-50Ni joints (in wt.%), respectively. In contrast, relatively dense microstructures are observed in the Sn-30Ni and Sn-40Ni TLPS joints. From differential scanning calorimetry (DSC) thermal analysis results of the fabricated Sn-Ni paste and TLPS bonded joints, we confirmed that the complete reactions of Sn with Ni to form Ni-Sn intermetallic compounds (IMCs) at bonding temperatures occurred, and there is no remaining Sn in the joints after TLPS bonding. In addition, the interfacial reactions and IMC phase changes of the Sn-30Ni joints under various bonding temperatures were reported, and their mechanical shear strength were investigated. The TLPS bonded joints were mainly composed of residual Ni particles and Ni₃Sn₄ intermetallic phase. The average shear strength tended to increase with increasing bonding temperature. Our results indicated a high shear strength value of approximately 30 MPa at a bonding temperature of 270 ℃ and a bonding time of 30 min.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.160-160
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• 2015

InGaZnO (IGZO) thin-film transistors (TFTs) are very promising due to their potential use in high performance display backplane [1]. However, the stability of IGZO TFTs under the various stresses has been issued for the practical IGZO applications [2]. Up to now, many researchers have studied to understand the sub-gap density of states (DOS) as the root cause of instability [3]. Nomura et al. reported that these deep defects are located in the surface layer of the IGZO channel [4]. Also, Kim et al. reported that the interfacial traps can be affected by different RF-power during RF magnetron sputtering process [5]. It is well known that these trap states can influence on the performances and stabilities of IGZO TFTs. Nevertheless, it has not been reported how these defect states are created during conventional RF magnetron sputtering. In general, during conventional RF magnetron sputtering process, negative oxygen ions (NOI) can be generated by electron attachment in oxygen atom near target surface and accelerated up to few hundreds eV by self-bias of RF magnetron sputter; the high energy bombardment of NOIs generates bulk defects in oxide thin films [6-10] and can change the defect states of IGZO thin film. In this study, we have confirmed that the NOIs accelerated by the self-bias were one of the dominant causes of instability in IGZO TFTs when the channel layer was deposited by conventional RF magnetron sputtering system. Finally, we will introduce our novel technology named as Magnetic Field Shielded Sputtering (MFSS) process [9-10] to eliminate the NOI bombardment effects and present how much to be improved the instability of IGZO TFTs by this new deposition method.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.2
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• pp.95-102
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• 2001

Hafnium oxide thin films for gate dielectric were deposited at $300^{\circ}C$ on p-type Si (100) substrates by plasma enhanced chemical vapor deposition (PECVD) and annealed in $O_2$ and $N_2$ ambient at various temperatures. The effect of hydrogen treatment in 4% $H_2$ at $350^{\circ}C$ for 30 min on the electrical properties of $HfO_2$for gate dielectric was investigated. The flat-band voltage shifts of $HfO_2$capacitors annealed in $O_2$ambient are larger than those in $N_2$ambient because samples annealed in high oxygen partial pressure produces the effective negative charges in films. The oxygen loss in $HfO_2$films was expected in forming gas annealed samples and decreased the excessive oxygen contents in films as-deposited and annealed in $O_2$ or $N_2$ambient. The CET of films after hydrogen forming gas anneal almost did not vary compared with that before hydrogen gas anneal. Hysteresis of $HfO_2$films abruptly decreased by hydrogen forming gas anneal because hysteresis in C-V characteristics depends on the bulk effect rather than $HfO_2$/Si interface. The lower trap densities of films annealed in $O_2$ambient than those in $N_2$were due to the composition of interfacial layer becoming closer to $SiO_2$with increasing oxygen partial pressure. Hydrogen forming gas anneal at $350^{\circ}C$ for samples annealed at various temperatures in $O_2$and $N_2$ambient plays critical role in decreasing interface trap densities at the Si/$SiO_2$ interface. However, effect of forming gas anneal was almost disappeared for samples annealed at high temperature (about $800^{\circ}C$) in $O_2$ or $N_2$ambient.

• Bulletin of the Korean Chemical Society
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• v.23 no.2
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• pp.225-228
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• 2002

Amorphous $Ga_2O_3$ films have been grown on Si(100) substrates by metal organic chemical vapor deposition (MOCVD) using gallium isopropoxide, $Ga(O^iPr)_3$, as single precursor. Deposition was carried out in the substrate temperature range 400-800 $^{\circ}C$. X-ray photoelectron spectroscopy (XPS) analysis revealed deposition of stoichiometric $Ga_2O_3$ thin films at 500-600 $^{\circ}C$. XPS depth profiling by $Ar^+$ ion sputtering indicated that carbon contamination exists mostly in the surface region with less than 3.5% content in the film. Microscopic images of the films by scanning electron microscopy (SEM) and atomic force microscopy (AFM) showed formation of grains of approximately 20-40 nm in size on the film surfaces. The root-mean-square surface roughness from an AFM image was ${\sim}10{\AA}$. The interfacial layer of the $Ga_2O_3$/Si was measured to be ${\sim}35{\AA}$ thick by cross-sectional transmission electron microscopy (TEM). From the analysis of gaseous products of the CVD reaction by gas chromatography-mass spectrometry (GC-MS), an effort was made to explain the CVD mechanism.

• Composites Research
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• v.33 no.5
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• pp.247-250
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• 2020

In this study, the possibility of manufacturing a magnesium (Mg) composites reinforced with continuous silicon carbide (SiC) fibers was examined using a liquid pressing process. We fabricated uniformly dispersed SiC fiberAZ91 composites using a liquid phase pressing process. Furthermore, the precipitates were controlled through heat treatment. As a continuous Mg₂Si phase was formed at the interface between the SiC fiber and the AZ91 matrix alloy, the interfacial bonding strength was improved. The tensile strength at room temperature of the prepared composite was 479 MPa, showing excellent mechanical properties.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2004.11a
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• pp.90-98
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• 2004

Nano/micro-scale studies on friction properties were conducted on Si (100) and three self-assembled monolayers (SAMs) (PFOTC, DMDM, DPDM) coated on Si-wafer by chemical vapor deposition technique. Experiments were conducted at ambient temperature $(24{\pm}1^{\circ}C)$ and humidity $(45{\pm}5\%)$. Nano-friction was evaluated using Atomic Force Microscopy (AFM) in the range of 0-40nN normal loads. In both Si-wafer and SAMs, friction increased linearly as a function of applied normal load. Results showed that friction was affected by the inherent adhesion in Si-wafer, and in the case of SAMs the physical/chemical structures had a major influence. Coefficient of friction of these test samples was also evaluated at the micro-scale using a micro-tribotester. It was observed that SAMs had superior frictional property due to their low interfacial energies. In order to study of the effect of contact area on friction coefficient at the micro-scale, friction was measured for Si-wafer and DPDM against Soda Lime balls (Duke Scientific Corporation) of different radii 0.25 mm, 0.5 mm and 1 mm at different applied normal loads $(1500,\;3000\;and\;4800{\mu}N)$. Results showed that Si-wafer had higher friction coefficient than DPDM. Furthermore, unlike that in the case of DPDM, friction was severely influenced by wear in the case of Si-wafer. SEM evidences showed that solid-solid adhesion to be the wear mechanism in Si-wafer.

• Journal of Powder Materials
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• v.27 no.1
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• pp.52-57
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• 2020

In this study, we report the microstructure and characterization of Ta₂₀Nb₂₀V₂₀W₂₀Ti₂₀ high-entropy alloy powders and sintered samples. The effects of milling time on the microstructure and mechanical properties were investigated in detail. Microstructure and structural characterization were performed by scanning electron microscopy and X-ray diffraction. The mechanical properties of the sintered samples were analyzed through a compressive test at room temperature with a strain rate of 1 × 10^-4 s^-1. The microstructure of sintered Ta₂₀Nb₂₀V₂₀W₂₀Ti₂₀ high-entropy alloy is composed of a BCC phase and a TiO phase. A better combination of compressive strength and strain was achieved by using prealloyed Ta₂₀Nb₂₀V₂₀W₂₀Ti₂₀ powder with low oxygen content. The results suggest that the oxide formed during the sintering process affects the mechanical properties of Ta₂₀Nb₂₀V₂₀W₂₀Ti₂₀ high-entropy alloys, which are related to the interfacial stability between the BCC matrix and TiO phase.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.6
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• pp.4007-4012
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• 2014

This study examined the fabrication and thermal properties of fumed silica/ceramic wool inorganic composites. A predetermined quantity of fumed silica and ceramic wool was mixed uniformly into a slurry state and stabilized in the mold at room temperature, and converted to a massive foamed body through a complete drying process at $150^{\circ}C$. Although the samples without polyvinyl alcohol (PVA) as an interfacial adhesive showed a bulk density of 0.6-0.8 $g/cm^3$ in the range, 10-70wt% fumed silica, those samples with 3wt% PVA exhibited remarkably lower bulk densities with enhanced mechanical and thermal insulation properties, without thermal cracking even above $800^{\circ}C$. The K-factor of the samples was lower in proportion to the fumed silica contents, showing good thermal insulation properties of ca. 0.08 $W/m^{\circ}K$ at $500^{\circ}C$ for the sample with 30wt% fumed silica.

• Polymer(Korea)
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• v.25 no.6
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• pp.774-781
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• 2001

In order to reuse the waste matters, the polyester hybrid composites were fabricated with the waste stone (WSP) and waste tire (WTC). Before mixing, the waste fillers were treated with the silane coupling agent [${\gamma}$-methacryloxy propyl trimethoxy silane(${\gamma}$-MPS)] for enhancing the dispersion of the fillers and interfacial bonding with polymer matrix. Mechanical properties and morphologies of the resulted hybrid composites were investigated with the filler content. The hybrid composites containing surface treated fillers have high initial thermal decomposition temperature and low weight loss compared to the untreated one. The highest mechanical properties of composites were obtained with the ${\gamma}$-MPS (2 wt%) treated fillers. The porosity of composite increased with the content of organic filler which can be reduced by the silane surface treatment of fillers. The pore size distribution of the composites varied with the waste filler content.