• Membrane Journal
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• v.33 no.6
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• pp.427-438
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• 2023

In this study, in order to improve the performance of the reverse osmosis membrane with high water flux and high salt rejection, a study was conducted on the evaluation of characteristics according to the curing temperature and time during various additives and interfacial polymerization. The morphology of the membrane with no additives and the membrane with additives both showed a "rigid-and-valley" structure, confirming that the polyamide layer was successfully polymerized on the surface of the porous support layer. In addition, the additive of 2-Ethyl-1,3-hexanediol (EHD) had improved hydrophilicity and water flux, which was confirmed by measuring the contact angle. Finally, a highly permeable TFC membrane with NaCl and MgSO₄ salt rejection of 97.78% and 98.7% and a high water flux of 3.31 L/(m²⋅h⋅bar) was prepared.

• Applied Chemistry for Engineering
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• v.16 no.5
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• pp.664-671
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• 2005

In this study, the effect of sosurfactant on microemulsion phase behavior was investigated in ternary systems containing alkyl ethoxylates nonionic surfactant, water and d-limonene. The addition of a cosurfactant produced a microemulsion phase over a wide range of temperature and promoted formation of a microemulsion phase at lower temperatures. In particular, small amounts of n-propanol, as a cosurfactant, were found to be the most effective in extending a microemulsion phase region over a wide range of temperature. Temperature sensitivity of a nonionic surfactant system was effectively relieved by addition of the anionic surfactant sodium dodecyl sulfate. And the formation of one phase microemulsion was not affected by pH, hardness concentration and addition of an antioxidation agent. The cleaner candidates were determined from microemulsion phase behavior study, and their cleaning efficiency was tested using a dipping method. All the cleaner candidates selected during this study showed excellent removal efficiency for abietic acid over a temperature range from 30 to $40^{\circ}C$ presumably due to a decrease in interfacial tension.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.3
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• pp.576-583
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• 2018

Silicon carbide is considered to be a potentially useful material for high-temperature electronic devices, as its band gap is larger than that of silicon and the p-type and/or n-type conduction can be controlled by impurity doping. Particularly, porous n-type SiC ceramics fabricated from ${\beta}-SiC$ powder have been found to show a high thermoelectric conversion efficiency in the temperature region of $800^{\circ}C$ to $1000^{\circ}C$. For the application of SiC thermoelectric semiconductors, their figure of merit is an essential parameter, and high temperature (above $800^{\circ}C$) electrodes constitute an essential element. Generally, ceramics are not wetted by most conventional braze metals,. but alloying them with reactive additives can change their interfacial chemistries and promote both wetting and bonding. If a liquid is to wet a solid surface, the energy of the liquid-solid interface must be less than that of the solid, in which case there will be a driving force for the liquid to spread over the solid surface and to enter the capillary gaps. Consequently, using Ag with a relatively low melting point, the junction of the porous SiC semiconductor-Ag and/or its alloy-SiC and/or alumina substrate was studied. Ag-20Ti-20Cu filler metal showed promise as the high temperature electrode for SiC semiconductors.

• Journal of Conservation Science
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• v.27 no.4
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• pp.403-414
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• 2011

This study is re-creational experiment of Goryeo gold-painted decoration based on the research of the gold remaining and gold painting technique on the two pieces of Goryeo gold-painted celadon and the three pieces of Chinese gold-painted porcelain on North Song period which ones have been owned by National Museum of Korea since 2007. For the observation of glue state and color developing ability, four kinds of agglutinative agent and gold powder were mixed over the porcelain sherds, then gradually fired from $100^{\circ}C$ to $1200^{\circ}C$. Visual effect and ideal temperature were measured. Among of them, oil and glue showed the best results in glue state and color developing ability. Through those results, the entire Goryeo engraved celadon were reproduced in modern facilities. Oil and glue were gold-painted over the glaze then it was fired at the ideal temperature 700 to $800^{\circ}C$. For observation the binding condition, the gold-painting cross section was looked by the scanning electron microscope (SEM). As the result, oil and glue did not make much difference in Agglutinative agent, but gold was good, the color developing ability, however, in the case of oil, the edge of gold is curled because of its interfacial tension, and it is not dried well at room temperature so the working property is not as good as the glue. Glue more effective in terms of work efficiency, but color developing ability to fall slightly in this experiment were able to see through.

• Analytical Science and Technology
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• v.28 no.3
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• pp.182-186
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• 2015

In this study, the porous CuO/MnO₂ catalyst was prepared through the co-precipitation process from an aqueous solution of potassium permanganate (KMnO₄), manganese(II) acetate (Mn(CH₃COO)₂·4H₂O) and copper(II) acetate (Cu(CH₃COO)₂·H₂O). The phase change in MnO₂ was analyzed according to the reaction molar ratio of KMnO₄ to Mn(CH₃COO)₂. The reaction mole ratio of KMnO₄ to Mn(CH₃COO)₂·4H₂O was varied at 0.3:1, 0.6:1, and 1:1. The aqueous solution of Cu(CH₃COO)₂ was injected into a mixed solution of KMnO₄ and Mn(CH₃COO)₂ to 10~75 wt% relative to MnO₂. The Cu ion co-precipitates as CuO with MnO₂ in a highly dispersed state on MnO₂. The physicochemical property of the prepared CuO/MnO₂ was analyzed by using the TGA, DSC, XRD, SEM, and BET. The different phase types of MnO₂ were prepared according to the reaction mole ratio of KMnO₄ to Mn(CH₃COO)₂·4H₂O. The results confirmed that the porous CuO/MnO₂ catalyst with γ-phase MnO₂ was produced in the reaction mole ratio of KMnO₄ to Mn(CH₃COO)₂ as 0.6:1 at room temperature.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.450-455
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• 2002

Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of $\beta$-Sn, Ag$_3$Sn, ad Cu$_{6}$Sn$_{5}$ phases was confirmed in the solder, and the η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer was found to form at the interface between the solder and the Cu pad. By conducting shear tests, it was found that the BGA joint using Cu-cored solder ball could prevent the degradation of joint strength during aging at 423K because of the slower growth me of η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer formed at the solder, pad interface. Furthermore, Cu-cored multi-component Sn-Ag-Bi balls were fabricated by sequentially coating the binary Sn-Ag and Sn-Bi solders on Cu balls. The reflow property of these solder balls was investigated. Melting of these solder balls was clarified to start at the almost same temperature as that of Sn-2Ag-0.75Cu-3Bi solder. A microstructure composing of (Sn), Ag$_3$Sn, Bi and Cu$_{6}$Sn$_{5}$ phases was found to form in the solder ball, and a reaction layer containing primarily η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ was found at the interface with Ni/Au coated Cu pad after reflow soldering. By conducting shear test, it was found that the BGA joints using this Cu-core solder balls hardly degraded their joint shear strength during aging at 423K due to the slower growth rate of the η'-(Au, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer at the solder/pad interface.he solder/pad interface.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.7
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• pp.779-785
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• 2015

Cathodic protection is recognized as the most cost-effective and technically appropriate corrosion prevention method for the submerged zone of offshore structures, ships, and deep-sea facilities. When cathodic protection is applied, the cathodic currents cause dissolved oxygen reduction, generating hydroxyl ions near the polarized surface that increase the interfacial pH and result in enhanced carbonate ion concentration and precipitation of an inorganic layer whose principal component is calcium carbonate. Depending on the potential, magnesium hydroxide can also precipitate. This mixed deposit is generally called "calcareous deposit." This layer functions as a barrier against the corrosive environment, leading to a decrease in current demand. Hence, the importance of calcareous deposits for the effective, efficient operation of marine cathodic protection systems is recognized by engineers and scientists concerned with cathodic protection in submerged marine environments. Calcareous deposit formation on a marine structure depends on the potential, current, pH, temperature, pressure, sea-water chemistry, flow, and time; deposit quality is significantly influenced by these factors. This study determines how calcareous deposits form in sea water, and assesses the interrelationship of formation conditions (such as the sea water temperature and surface condition of steel), deposited structure, and properties and the effectiveness of the cathodic protection.

• Elastomers and Composites
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• v.44 no.2
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• pp.164-174
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• 2009

PA66/EPDM/PP-g-MA and PA66/EPDM-g-MA/PP-g-MA composites were manufactured by a modular intermeshing twin screw extruder for enhanced low temperature impact resistance with different content of PP-g-MA. The results showed that composite containing 90 wt% of PA66, 8 wt% of EPDM-g-MA, and 2 wt% of PP-g-MA has a optimum value in the thermal and mechanical properties. The characteristics of the composites were analyzed by TGA, DSC, and SEM. From above results, we established that the low interfacial strength and the impact resistance at low temperature shown in a pre-existing PP/EPDM composite were enhanced by grafting with compatibilizer such as maleic anhydride. These results show the possibility of local manufacturing process and cost down with optimum screw configuration for best mixing quality in the twin screw extruder.

• Korean Journal of Materials Research
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• v.9 no.10
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• pp.1012-1017
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• 1999

Low resistance ohmic contacts to the Si-doped $\textrm{In}_{0.17}\textrm{Ga}_{0.83}\textrm{N}$(~$\times10^{19}\textrm{cm}^{-3}$) were obtained using the W metallization schemes. Specific contact resistance decreased with increasing annealing temperature. The lowest resistance is obtained after a nitrogen ambient annealing at $950^{\circ}C$ for 90 s, which results in a specific contact resistance of $2.75\times10^{-8}\Omega\textrm{cm}^{-3}$. Interfacial reactions and surface are analyzed using x-ray diffraction and scanning electron microscopy (SEM). The X-ray diffraction results show that the reactions between the W film and the $\textrm{In}_{0.17}\textrm{Ga}_{0.83}\textrm{N}$ produce a $\beta$-$W_2N$ phase at the interface. The SEM result shows that the morphology of the contacts is stable up to a temperature as high as $850^{\circ}C$. Possible mechanisms are proposed to describe the annealing temperature dependence of the specific contact resistance.

• Journal of the Korean Vacuum Society
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• v.18 no.4
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• pp.245-253
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• 2009

For the growth optimization of InAs/GaSb (8/8-ML) strained-layer superlattice (SLS), the structure has been grown under various conditions and modes and characterized by the high-resolution x-ray diffraction (XRD) analysis. In this study, the strain modulation is induced by changing parameters and modes, such as the growth temperature, the ratio of V/III beam-equivalent-pressure (BEP), and the growth interruption (GI), and the strain variation is analyzed by measuring the angle separation of 0th-order satellite peak in XRD patterns. The XRD results reveal that the growth temperature and the V/III(Sb/Ga) ratio are major parameters to change the crystallineity and the strain modulation in SLS structures, respectively. We have observed that the SLS samples with compressive strain prepared in this study are show a transition to tensile strain with decreasing V/III(Sb/Ga) ratio, and the GI process is a sensitive factor giving rise to strain modulation. These results obtained in this study suggest that optimized growth temperature and V/III(Sb/Ga) ratio are $350^{\circ}C$ and 20, respectively, and the appropriate GI time is approximately 3 seconds just before InAs growth that the crystallineity is maximized and the strain relaxation is minimized.