• Nuclear Engineering and Technology
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• 제50권6호
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• pp.842-848
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• 2018

Motivated by reducing the uncertainties in quantification of debris bed coolability, this paper reports an experimental study on two-phase flow resistances and interfacial drag in packed porous beds. The experiments are performed on the DEBECO-LT (DEbris BEd COolability-Low Temperature) test facility which is constructed to investigate the adiabatic single and two phase flow in porous beds. The pressure drops are measured when air-water two phase flow passes through the porous beds packed with different size particles, and the effects of interfacial drag are studied especially. The results show that, for two phase flow through the beds packed with small size particles such as 1.5 mm and 2 mm spheres, the contribution of interfacial drag to the pressure drops is weak and ignorable, while the significant effects are conducted on the pressure drops of the beds with bigger size particles like 3 mm and 6 mm spheres, where the interfacial drag in beds with larger particles will result in a descent-ascent tendency in the pressure drop curves along with the fluid velocity, and the effect of interfacial drag should be considered in the debris coolability analysis models for beds with bigger size particles.

• 한국주조공학회지
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• 제25권2호
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• pp.80-87
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• 2005

The microstructure and mechanical property of the Ni and Ni-Cr porous metal reinforced AC4C matrix composites fabricated by squeeze casting were investigated. In this study Ni, Ni-Cr porous metals which are estimated to be easy to fabricate by squeeze casting are used as strengtheners for composite materials. As a matrix material, Al-7wt.%Si-0.3wt.%Mg(AC4C) has been used. In case of Ni/AC4C and Ni-Cr/AC4C composite, $750^{\circ}C$ melt temperature and minimum 25MPa squeezing pressure are needed to produce sound composite materials. The observation of interfacial reaction zone at various heat treatment condition shows that atsolutionizing temperature of above $520^{\circ}C$, the interfacial reaction zone increases proportionally with heat treatment time and the reaction products formed by interfacial reactions are mainly composed by $Al_{3}Ni$ and $Al_{3}Ni_{2}$ phases.

• Journal of Welding and Joining
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• 제20권5호
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• pp.106-112
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• 2002

In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.406-407
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• 2006

This paper describes the ohmic contact formation between a TiW film as a contact material deposied by RF magnetron sputter and polycrystalline 3C-SiC films deposied on thermally grown Si wafers. The specific contact resistance (${\rho}_c$) of the TiW contact was measured by using the C-TLM. The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature were also analyzed by XRD and SEM. All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30min., the lowest contact resistivity of $2.90{\times}10^{-5}{\Omega}cm^2$ was obtained due to the improved interfacial adhesion.

• Journal of Welding and Joining
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• 제20권1호
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• pp.91-96
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• 2002

Three different kinds of substrate used in this study : bare Cu, electroless Ni/Cu substrate with a Nilayer thickness of $5\mu\textrm{m}$, immersion Au/electroless Ni/Cu substrate with the Au and Ni layer of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness, respectively. The wettability and interfacial tension between various substrate and Sn-3.5Ag solder were examined as a function of soldering temperature, types of flux. The wettability of Sn-3.5Ag solder increased with soldering temperature and solid content of flux. The wettability of Sn-3.5Ag solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and decreased wettability.

• Geomechanics and Engineering
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• 제18권5호
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• pp.555-566
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• 2019

The purpose of this paper is to investigate the thermal effects on the behaviour reinforced-concrete beams strengthened by bonded angle-ply laminated composites laminates plate $[{\pm}{\theta}n/90m]_S$. Effects of number of $90^{\circ}$ layers and number of ${\pm}{\theta}$ layers on the distributions of interfacial stress in concrete beams reinforced with composite plates have also been studied. The present results represent a simple theoretical model to estimate shear and normal stresses. The effects the temperature, mechanical properties of the fibre orientation angle of the outer layers, the number of cross-ply layers, plate length of the strengthened beam region and adhesive layer thickness on the interfacial shear and normal stresses are investigated and discussed.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.776-780
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• 2002

This paper describes the concept and the characteristics of hyper interfacial bonding developed as a new concept joining process for UFG (ultra-fine grained) steel. Hyper interfacial bonding process is characterized by instantaneous surface melting bonding which involves a series of steps, namely, surface heating by high frequency induction, the rapid removing of heating coil and joining by pressing specimens. UFG steels used in this study have the average grain size of 1.25 ${\mu}{\textrm}{m}$. The surface of specimen can be rapidly heated up and melted within 0.2s. Temperature gradient near heated surface is relatively steep, and peak temperature drastically fell down to about 1100K at the depth of 2~3mm away from the heated surface of specimen. Bainite is observed near bond interface, and also M-A (martensite-austenite) islands are observed in HAZ. Grain size increases with increasing heating power, however, the grain size in bonded zone can be restrained under 11 ${\mu}{\textrm}{m}$. Hardened zone is limited to near bond interface, and the maximum hardness is Hv350~Hv390.

• 한국세라믹학회지
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• 제33권12호
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• pp.1421-1425
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• 1996

Sintered Si3N4 and Inconel composed of Ni(58-63%) Cr(21-25%) Al(1-17%) Mn(<1%) fe(balance) were pressurelessly joined by using Ag-Cu-Ti brazing filler metal at 950℃ and 1200℃ under N2 gas atmosphere of 1atm and their interfacial structures were investigated. In case that the reaction temperature was low as 950℃ its interfacial structure was "Inconel metal/Ti-rich phase layer/brazing filler metal layer/Si3N4 " Ti used as reactive metal existed in between inconel steel and brazing metal and moved to the interface of between brazing filler metal nd Si3N4 according as reaction temperature increased up to 1200℃. The interfacial structure of inconel steel-Si3N4 reacted at 1200℃ was ' inconel metal/Ni-rich phase layer containing of Fe. Cr and Si/Cu-rich phase layer containing of Mn and Si/Si3N4 " Cr Mn, Ni and Fe diffused to the interface of between brazing filler metal and Si3N4 and reacted with Si3N4 The most reactive components of ingredients of inconel metal were Cr and Mn. On the other hand Ti added as reactive components to Ag-Cu eutectic segregated into Ni-rich phase layer,.

• 폴리머
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• 제28권6호
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• pp.487-493
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• 2004

계면간 상호작용이 약한 폴리(에틸 아크릴레이트-co-t-부틸 아크릴레이트) (PEB) 에멀션 고분자를 사용한 나노복합체 혼합용액에서는 pH변화에 따라 고분자 입자들과 실리카 나노입자들의 분포 형태가 결정되었다. 이러한 나노복합체는 실리카 입자의 응집이 심하였고 불규칙적인 분산성을 나타내었다. 메타아크릴옥시프로필트리메톡시실란 (MPS)를 사용하여 개질한 용액 중합 고분자나 실리카 나노입자를 사용한 나노복합체에서는 계면간 강한 상호작용으로 인하여 실리카 나노입자가 미세하게 분산되었고 코어-쉘 형태학적 특성을 나타냈다. 계면을 MPS로 개질한 나노복합체에서는 강한 수소 결합 상호작용이 존재하는 것을 적외선 분광계로 확인하였다. 강한 계면 상호작용을 갖는 나노복합체는 고분자 사슬의 유리 전이 온도가 증가하였고 ΔC$_{p}$ 는 감소하였으며 열분해 온도는 상승되었다.며 열분해 온도는 상승되었다.

• 한국안전학회지
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• 제30권1호
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• pp.21-27
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• 2015

In this study, interfacial characteristics between SOFC and Ag paste as current collector was estimated in the high temperature environment. The Ag paste was used to connect the unit cell of SOFC strongly with interconnector and provide the electrical conductivity between them. To confirm electrical conductivity, Ag paste was treated in the furnace at $800^{\circ}C$ for 48 hours. The sheet resistance of Ag paste was measured to compare the resistance values before and after the heat treatment. Also, the four-point bending test was performed to measure the interfacial adhesion. The unit cell of SOFC and $SiO_2$ wafer were diced and then attached by Ag paste. The $SiO_2$ wafer had the center notch to initiate a crack from the tip of the notch. The modified stereomicroscope combined with the CCD camera and system for measuring the length was used to observe the fracture behavior. To compare the characteristics before heat treatment and after heat treatment, the specimen was exposed in the furnace at $800^{\circ}C$ for 48 hours and then the interfacial adhesion was evaluated. Finally, the interfacial adhesion energy quantitatively increases $1.78{\pm}0.07J/m^2$ to $4.9{\pm}0.87J/m^2$ between the cathode and Ag paste and also increase $2.9{\pm}0.47J/m^2$ to $5.12{\pm}1.01J/m^2$ between the anode and Ag paste through the high temperature. Therefore, it is expected that Ag paste as current collector was appropriate for improving the structural stability in the stacked SOFC system if the electrical conductivity was more increased.