• Transactions of Materials Processing
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• v.7 no.5
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• pp.481-488
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• 1998

The active metal brazing was applied to bond Alumina and Ni-Cr steel by Ag-Cu-Zr-Sn alloy and the interfacial microstructure and reaction mechanism were investigated. Polycrystalline monoclinic $ZrO_2$ with a very fine grain of 100-150 nm formed at the alumina grain boundary contacted with Zr segregation layer at the interface. The $ZrO_2$ layer containing the inclusions and cracks were developed at the boundary of inclusion/$ZrO_2$ due to the difference in specific volume. The development of $ZrO_2$ at the interface was successfully explained by the preferential penetration of $ZrO_2$ at the interface was successfully explained by the preferential penetration of Zr atoms a higher concentration of oxygen and a high diffusion rate of Al ions into molten brazing alloy.

• Computers and Concrete
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• v.12 no.1
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• pp.1-18
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• 2013

This paper presents an actual microstructure-based numerical method to investigate the mechanical properties of concrete at mesoscopic level. Digital image processing technique is used to capture the concrete surface image and generate the actual 3-phase microstructure of the concrete, which consists of aggregate, matrix and interfacial transition zones. The microstructure so generated is then transformed into a mesh or grid for numerical analysis. A finite difference code FLAC2D is used for the numerical analysis to simulate the mechanical responses and failure patterns of the concrete. Several cases of concrete with different degrees of material heterogeneity and under different compression loading conditions have been analysed. From the numerical results, the effects of the internal material heterogeneities as well as the external confining stresses are studied. It is shown that the material heterogeneities arising from the presence of different phases and the existence of interfacial transition zones have great influence on the overall mechanical behaviour of concrete and that the numerically simulated behaviour of concrete with or without confining stresses applied agrees quite well with the general observations reported in the literature.

• Journal of the Korean Ceramic Society
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• v.48 no.5
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• pp.373-378
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• 2011

The composite added with surface-coated chopped carbon fiber showed the microstructure of a 3 dimensional discretional arrangements. The fiber reinforced reaction bonded silicon carbide composite, containing the 50 vol% carbon fiber, showed the porosity of < 1 vol%, 3-point bending strength value of 250MPa and fracture toughness of 4.5 $MPa{\cdot}m^{1/2}$. As the content of carbon fiber was increased from 0 vol% to 50 vol% in the composite, fracture strength was decreased due to the increase of carbon fiber, which has a less strength than SiC and molten Si. On the other hand, the fracture toughness was increased with increasing the amount of carbon fiber. According to the polished microstructure, carbon fiber was shown to have a random 3 dimensional arrangement. Moreover, the fiber pull-out phenomenon was observed with the fractured surface, which can explain the increased fracture toughness of the composite containing high content of carbon fiber.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.204-204
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• 2006

The interfacial interaction along with microstructure and some properties of the polyimide(PI)/silica or polyimide/silsesquioxane hybrid nanocomposites will be discussed with reviewing recent publications including our own works. Poly(vinyl silsesquioxane) (PVSSQ), aminosilane (APS), and titania can effectively play vital roles to compatibilize the PI/silica hybrid composites by enhancing interfacial interaction or reducing agglomeration of large domains, which helps the formation of nanocomposites for the PI/silica hybrid system.

• Korean Journal of Materials Research
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• v.26 no.12
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• pp.751-756
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• 2016

Graphite was diffusion-bonded by hot-pressing to W-25Re alloy using a Ti interlayer. For the joining, a uniaxial pressure of 25 MPa was applied at $1600^{\circ}C$ for 2 hrs in an argon atmosphere with a heating rate of $10^{\circ}C\;min^{-1}$. The interfacial microstructure and elemental distribution of the W-25Re/Ti/Graphite joints were analyzed by scanning electron microscopy (SEM). Hot-pressed joints appeared to form a stable interlayer without any micro-cracking, pores, or defects. To investigate the high-temperature stability of the W-25Re/Ti/Graphite joint, an oxy-acetylene torch test was conducted for 30 seconds with oxygen and acetylene at a 1.3:1 ratio. Cross-sectional analysis of the joint was performed to compare the thickness of the oxide layer and its chemical composition. The thickness of W-25Re changed from 250 to $20{\mu}m$. In the elemental analysis, a high fraction of rhenium was detected at the surface oxidation layer of W-25Re, while the W-25Re matrix was found to maintain the initial weight ratio. Tungsten was first reacted with oxygen at a torch temperature over $2500^{\circ}C$ to form a tungsten oxide layer on the surface of W-25Re. Then, the remaining rhenium was subsequently reacted with oxygen to form rhenium oxide. The interfacial microstructure of the Ti-containing interlayer was stable after the torch test at a temperature over $2500^{\circ}C$.

• Journal of Korea Foundry Society
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• v.22 no.2
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• pp.89-96
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• 2002

This study examined the effects of adding Zn to Sn-3.5Ag solder on the microstructure changes and behavior of interface reaction of the solder joint with Cu substrate. The solder/Cu joints were examined with microscope to observe the characteristics of microstructure changes and interfacial reaction layer with aging treatment for up to 120 days at $150^{\circ}C$. Results of the microstructure changes showed that the microstructures were coarsened with aging treatment, while adding 1%Zn suppresses coarsening microstructures. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-1Zn at the aging temperature of $150^{\circ}C$. Through the SEM/EDS analysis of solder joint, it was proved that intermetallic layer was $Cu_6Sn_5$ phase and aged specimens showed that intermetallic layer grew in proportion to $t^{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_6Sn_5$ phase formed at the side of substrate and Cu-Zn-Sn phase formed at the other side in double layer. It seems that Cu-Zn-Sn phase formed at solder side did a roll of banrier to suppress the growth of the $Cu_6Sn_5$ layer during the aging treatment.

• Journal of Korea Foundry Society
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• v.20 no.2
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• pp.116-121
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• 2000

Interfacial reaction and mechanical properties between Sn-Zn-X ternary alloys(X : 3wt.%In, 4wt.%Bi) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 50days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3 mm $min^{-1}$ to measure tensile strength. According to the results of the solderability test, additions of In and Bi in the Sn-9wt.%Zn solder improve the wetting characteristics of the alloy and lower the melting temperature. Through the EDS and XRD analysis of Cu/Sn-9wt.%Zn solder joint, it was concluded that the intermetallic compound was the ${\gamma}-Cu_5Zn_8$ phase. Cu-Zn intermetallics at Cu/solder interfaces played an important role in both the microstructure evolution and failure of solder joints. Cu/solder joint strength was decreased by aging treatment, and those phenomenon was closely related to the thickening of intermetallic layer at Cu/solder joints.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.469-474
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• 2002

Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bumps reflowed by laser was superior than the solder bumps reflowed by hot air, and the microstructure inside the solder bumps reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn$_4$ layer and remnant Au element. Needle-like AuSn$_4$ grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni$_3$Sn$_4$ intermetallic compound was found at the interface of solder bump reflowed by hot air, AuSn$_4$ particles distributed inside the whole solder bump randomly. It is the combination effect of the continuous AuSn$_4$ layer and finer eutectic microstructure inside the solder bump reflowed by laser that resulted in higher shear strength.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.15-18
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• 2001

The Mo/si multilayer for EUV lithography was deposited using magnetron sputtering system. The multilayers were characterized using the cross-sectional transmission electron microscope (TEM) and low/high angle X-ray diffraction (XRD). The microstructure of Mo and Si was highly textured structure and amorphous, respectively. The well-defined low angle XRD peaks implies a well-defined multilayer structure. The interfacial layer of Mo-on-Si was thicker than Si-on-Mo interfacial layer.

• Advances in concrete construction
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• v.1 no.3
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• pp.239-252
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• 2013

Mortar microstructure is considered as a three-phase composite material, which is cement paste, fine aggregate and interfacial transition zone. Interfacial transition zone is the weakest link between the cement paste and fine aggregate, so it has a significant role to determine the properties of cementitious composites. In this study, specimens (w/c = 0.35, 0.45, 0.55) with various volume fractions of fine aggregate ($V_f$ = 0, 0.1, 0.2, 0.3 and 0.4) were cast and tested. To predict the equivalent migration coefficient ($M_e$) and migration coefficient of interfacial transition zone ($M_{itz}$), double-inclusion method and Mori-Tanaka theory were used to estimate. There are two stages to estimate and calculate the thickness of interfacial transition zone (h) and migration coefficient of interfacial transition zone ($M_{itz}$). The first stage, the data of experimental chloride ion migration coefficient ($M_s$) was used to calculate the equivalent migration coefficient of fine aggregate with interfacial transition zone ($M_e$) by Mori-Tanaka theory. The second stage, the thickness of interfacial transition zone (h) and migration coefficient of interfacial transition zone ($M_{itz}$) was calculated by Hori and Nemat-Nasser's double inclusion model. Between the theoretical and experimental data a comparison was conducted to investigate the behavior of interfacial transition zone in mortar and the effect of interfacial transition zone on the chloride migration coefficient, the results indicated that the numerical simulations is derived to the $M_{itz}/M_m$ ratio is 2.11~8.28. Additionally, thickness of interfacial transition zone is predicted from $10{\mu}m$, 60 to $80{\mu}m$, 70 to $100{\mu}m$ and 90 to $130{\mu}m$ for SM30, M35, M45 and M55, respectively.