• Transactions of Materials Processing
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• v.27 no.5
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• pp.267-275
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• 2018

The clad sheet material is produced by a roll-bonding process of one or more materials with different properties. Good formability of clad sheet material is an essential property in to deform a clad metal sheet into a part or component. Performance of the clad sheet material largely depends on interfacial bond strength between different materials. In this study, interfacial bond strength of STS/Al clad sheet was analyzed by varying experimental parameters using a blanking process. Experimental parameters are the punching speed, clearance, and stacking order of plate materials. In addition, blanking test results were compared with bond strengths measured by the T-peel test, that analyzes interface bonding strength of the standard clad sheet. The blanking process was analyzed by the finite element method under the sticking condition of interface of different materials, and experimental results and analysis results were compared.

• Nuclear Engineering and Technology
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• v.51 no.5
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• pp.1333-1344
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• 2019

An integrated approach of model simplification for high burnup spent nuclear fuel is proposed based on material calibration using optimization. The spent fuel rods are simplified into a beam with a homogenous isotropic material. The proposed approach of model simplification is applied to fuel rods with two kinds of interfacial configurations between the fuel pellets and cladding. The differences among the generated models and the effects of interfacial bonding efficiency are discussed. The strategy of model simplification adopted in this work is to force the simplified beam model of spent fuel rods to possess the same compliance and failure characteristics under critical loads as those that result in the failure of detailed fuel rod models. It is envisioned that the simplified model would enable the assessment of fuel rod failure through an assembly-level analysis, without resorting to a refined model for an individual fuel rod. The effective material properties of the simplified beam model were successfully identified using the integrated optimization process. The feasibility of using the developed simplified beam models in dynamic impact simulations for a horizontal drop condition is examined, and discussions are provided.

• Advances in materials Research
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• v.7 no.2
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• pp.83-103
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• 2018

In this paper, the problem of interfacial stresses in damaged reinforced concrete beams strengthened with bonded prestressed functionally graded material plate and subjected to a uniformly distributed load, arbitrarily positioned single point load, or two symmetric point loads is developed using linear elastic theory. The adopted model takes into account the adherend shear deformations by assuming a linear shear stress through the depth of the damaged RC beam. This solution is intended for application to beams made of all kinds of materials bonded with a thin FGM plate. The results show that there exists a high concentration of both shear and normal stress at the ends of the functionally graded material plate, which might result in premature failure of the strengthening scheme at these locations. Finally, numerical comparisons between the existing solutions and the present new solution enable a clear appreciation of the effects of various parameters of the beams on the distributions of the interfacial stresses.

• Journal of Sensor Science and Technology
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• v.31 no.4
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• pp.218-227
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• 2022

Triboelectric nanogenerators (TENGs), a new green energy, that have various potential applications, such as energy harvesters and self-powered sensors. The output performance of TENGs has been improving rapidly, and their output power significantly increased since they were first reported owing to improved triboelectrification materials and interfacial material engineering. Because the operation of a TENG is based on contact electrification in which electric charges are exchanged at the interface between two materials, its output can be increased by increasing the contact area and charge density. Material surface modification with microstructures or nanostructures has increased the output performance of TENGs significantly because not only does the sharp micro/nano morphology increases the contact area during friction, but it also increases the charge density. Chemical treatment in which ions or functional groups are added has also been used to improve the performance of TENGS by modifying the work functions, charge densities, and dielectric constants of the triboelectric materials. In addition, ultrahigh output power from TENGs without using new materials or treatments has been obtained in many studies in which special structures were designed to control the current release or to collect the charge current directly. In this review, we discuss physical and chemical treatments, bulk modifications, and interfacial engineering for enhancing TENG performance by improving contact electrification and electrostatic induction.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.10
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• pp.873-877
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• 2007

In order to apply a complex multilayer chip LC filter, this study has estimated the interfacial reaction and coupling properties of dielectric materials $Pb(Fe_{1/2}Nb_{1/2})O_3$ and Ni-Zn-Cu ferrite materials through low-temperature co-sintering (LTCS). PFN powders were fabricated using double calcinated at $700^{\circ}C$ and then $850^{\circ}C$. While the perovskite phase rate was found to be 91 %, after heat treatment at $900^{\circ}C$ for 6h, the perovskite phase rate and density exhibited a value of 100 % and 7.46$g/cm^3$, respectively. The PFN/Ni-Zn-Cu ferrite, PFN/CUO (or $Pb_2Fe_2O_5$) and ferrite/CuO (or $Pb_2Fe_2O_5$) were mechanically coupled through interfacial reactions after the specimen was co-sintered at $900^{\circ}C$ for 6 h. No intermediate layer exists for the mutual coupling reaction. This result indicates the possibility of low-temperature co-sintering without any interfacial reaction layer for a multilayer chip LC filter.

• Korean Journal of Materials Research
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• v.17 no.4
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• pp.215-221
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• 2007

The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.388-389
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• 2007

In this work, Organic Light Emitting Diodes using Aluminum-Oxynitride as a hole-injecting interfacial have been fabricated. This interfacial layer is inserted at the ITO/N,NV-diphenyl-N, NV-bis(3-methylphenyl)-1,1V-diphenyl-4,4V-diamine (TPD) interface. The brightness and efficiency of the device with the AION film is higher than that of the device without it. The enhancements are attributed to an improved balance of hole and electron injections due to the energy level realignment and the change in carrier tunneling probability by the interfacial layer.

• Tribology and Lubricants
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• v.25 no.6
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• pp.404-408
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• 2009

In this paper, the relationship between the material removal rate and the interfacial mechanical properties at particle-surface contact situation, which can be seen in an abrasive machining process using micro/nano-sized particles, was discussed. Friction and stiffnesses were measured experimentally on an atomic force microscope (AFM) by using colloidal probes which have a silica colloid particle in place of tip to simulate a particle-flat surface contact in an abrasive machining process. From the experimental investigation and theoretical contact analysis, the interfacial contact properties such as lateral stiffness of contact, friction, the material removal rate were presented with respect to some of material surfaces and the relationship between the properties as well.

• Tribology and Lubricants
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• v.34 no.3
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• pp.115-122
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• 2018

Chemical mechanical polishing (CMP) is a hybrid processing method in which the surface of a wafer is planarized by chemical and mechanical material removal. Since mechanical material removal in CMP is caused by the rolling or sliding of abrasive particles, interfacial friction during processing greatly influences the CMP results. In this paper, the trend of tribology research on CMP process is discussed. First, various friction force monitoring methods are introduced, and three elements in the CMP tribo-system are defined based on the material removal mechanism of the CMP process. Tribological studies on the CMP process include studies of interfacial friction due to changes in consumables such as slurry and polishing pad, modeling of material removal rate using contact mechanics, and stick-slip friction and scratches. The real area of contact (RCA) between the polishing pad and wafer also has a significant influence on the polishing result in the CMP process, and many researchers have studied RCA control and prediction. Despite the fact that the CMP process is a hybrid process using chemical reactions and mechanical material removal, tribological studies to date have yet to clarify the effects of chemical reactions on interfacial friction. In addition, it is necessary to clarify the relationship between the interface friction phenomenon and physical surface defects in CMP, and the cause of their occurrence.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.267-270
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• 2003

We have studied the interfacial diffusion phenomena and the role of ${\alpha}-Al_2O_3$ buffer layer as a diffusion barrier in the $Ba-ferrite/SiO_2$ magnetic thin films for high-density recording media. In the interface of amorphous Ba-ferrite ($1900-{\AA}-thick)/SiO_2$ thin film during annealing, the interfacial diffusion started to occur at ${\sim}700^{\circ}C$. As the annealing temperature increased up to $800^{\circ}C$, the interfacial diffusion abruptly proceeded resulting in the high interface roughness and the deterioration of the magnetic properties. In order to control the interfacial diffusion at the high temperature, we introduced ${\alpha}-Al_2O_3$ buffer layer ($110-{\AA}-thick$) in the interface of $Ba-ferrite/SiO_2$ thin film. During the annealing of $Ba-ferrite/{\alpha}-Al_2O_3/SiO_2$ thin film even at ${\sim}800^{\circ}C$, the interface was very smooth. The smooth interface of the film was also clearly shown by the cross-sectional FESEM. The magnetic properties, such as saturation magnetization 3nd intrinsic coercivity, were also enhanced, due to the inhibition of interfacial diffusion by the ${\alpha}-Al_2O_3$ buffer layer. Our study suggests that the ${\alpha}-Al_2O_3$ buffer layer act as a useful interfacial diffusion barrier in the $Ba-ferrite/SiO_2$ thin films.