• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.73-79
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• 2022

In this study, a reaction study between Ga, which has recently been spotlighted as a low-temperature bonding material, and Cu, a representative electrode material, was conducted to investigate information necessary for low-temperature soldering applications. Interfacial reaction and intermetallic compound (IMC) growth were observed and analyzed by reacting Ga and Cu/Au substrates in the temperature range of 80-200℃. The main IMC growing at the reaction interface was CuGa₂ phase, and AuGa₂ IMC with small particle sizes was formed on the upper part and Cu₉Ga₄ IMC with a thin band shape on the lower part of the CuGa₂ layer. CuGa₂ particles showed a scallop shape, and the particle size increased without significant shape change as the reaction time increased, similar to the case of Cu₆Sn₅ growth. As a result of analyzing the CuGa₂ growth mechanism, the time exponent was calculated to be ~3.0 in the temperature range of 120-200℃, and the activation energy was measured to be 17.7 kJ/mol.

• Journal of Powder Materials
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• v.16 no.6
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• pp.416-423
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• 2009

Diamond/SiC composites are appropriate candidate materials for heat conduction as well as high temperature abrasive materials because they do not form liquid phase at high temperature. Diamond/SiC composite consists of diamond particles embedded in a SiC binding matrix. SiC is a hard material with strong covalent bonds having similar structure and thermal expansion with diamond. Interfacial reaction plays an important role in diamond/SiC composites. Diamond/SiC composites were fabricated by high temperature and high pressure (HPHT) sintering with different diamond content, single diamond particle size and bi-modal diamond particle size, and also the effects of composition of diamond and silicon on microstructure, mechanical properties and thermal properties of diamond/SiC composite were investigated. The critical factors influencing the dynamics of reaction between diamond and silicon, such as graphitization process and phase composition, were characterized. Key factor to enhance mechanical and thermal properties of diamond/SiC composites is to keep strong interfacial bonding at diamond/SiC composites and homogeneous dispersion of diamond particles in SiC matrix.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.6
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• pp.665-672
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• 2012

Interfacial cracks bonded with dissimilar transversely isotropic piezoelectric media that are subjected to combined anti-plane mechanical and in-plane electrical loading are analyzed. The problem is formulated using complex function theory, from which the Hilbert problem is derived. By solving the Hilbert problem, the general form solution is obtained. Using this solution, closed-form solutions for one or two finite cracks as well as a semi-infinite crack are obtained, for the problem in which one concentrated mechanical and electrical load is imposed on the crack surface. This solution could be used as a Green's function to generate solutions to other problems with the same geometry but different loading conditions.

• Corrosion Science and Technology
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• v.9 no.3
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• pp.129-136
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• 2010

The corrosion behaviors of 316L stainless steel were investigated in simulated anodic and cathodic environments for proton exchange membrane fuel cell (PEMFC) by using electrochemical measurement techniques. Interfacial contact resistance(ICR) between the stainless steel and gas diffusion layer(GDL) was also measured. The possibility of 316L was evaluated as a substitute material for the graphite bipolar plate of PEMFC. The value of ICR decreased with an increase in compaction stress(20 N/$cm^2$~220 N/$cm^2$) showing the higher values than the required value in PEMFC condition. Although 316L was spontaneously passivated in simulated cathodic environment, its passive state was unstable in simulated anodic environment. Potentiostatic and electrochemical impedance spectroscopy (EIS) measurement results showed that the corrosion resistance in cathodic condition was higher and more stable than that in anodic condition. Field emission scanning electron microscopy (FE-SEM), and inductively coupled plasma(ICP) were used to analyze the surface morphology and the metal ion concentration in electrolytes.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.3
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• pp.434-442
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• 2001

When the interfacial crack of two dissimilar isotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid method developed in this research are valid. Separating method of stress component is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 80∼85% (in case of aluminum, 24.3∼25.9%) of Rayleigh wave velocity of epoxy resin. The near-field stress components of crack-tip are similar with those of pure isotropic material under static or dynamic loading, but very near-field stress components of crack-tip are different from those.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.277-277
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• 2012

PCDTBT (Poly[N-9''-hepta-decanyl-2,7-carbazole-alt-5,5-(4',7'-di-2-thienyl-2',1',3'-benzothiadiazole)]) is an attractive material as a semiconducting polymer for organic thin film transistor (OTFT) and organic solar cell (OSC). High power conversion efficiency (~6%) under simulated AM 1.5G solar illumination of bulk-heterojunction solar cell with PCDTBT and [6,6]-phenyl C60 butyric acid methyl ester (PC61BM) blend was reported. In OSC, it is known that the band alignment at the interface between donor and acceptor is critical. Therefore, we studied the interfacial electronic structures of PCDTBT and PC61BM. The polymers are deposited by electro-spray on gold and In-situ x-ray and ultraviolet photoelectron spectroscopy measurements revealed the interfacial electronic structures. We obtained the energy level alignment between two materials and the different interface formation was observed with different deposition order.

• Journal of Sensor Science and Technology
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• v.15 no.6
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• pp.386-390
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• 2006

This paper describes the ohmic contact formation of polycrystalline 3C-SiC films deposited on thermally grown Si wafers. In this work, a TiW (titanium tungsten) film as a contact material was deposited by RF magnetron sputter and annealed with the vacuum process. The specific contact resistance (${\rho}_{c}$) of the TiW contact was measured by using the C-TLM (circular transmission line method). The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature as also analyzed by XRD (X-ray diffraction) and SEM (scanning electron microscope). All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30 min., the lowest contact resistivity of $2.90{\times}10{\Omega}cm^{2}$ was obtained due to the improved interfacial adhesion. Therefore, the good ohmic contact of polycrystalline 3C-SiC films using the TiW film is very suitable for high-temperature MEMS applications.

• Proceedings of the KIEE Conference
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• 1998.07e
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• pp.1614-1616
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• 1998

Insulation performance of major components of prefabricated joint such as epoxy insulation unit and premolded rubber cone are guaranteed by material selection design and proper manufacturing. On the other hand insulation performance of the interfaces between the premolded rubber cone and the epoxy insulation unit and the cable insulation is maintained by keeping the premolded rubber cone to close contact with such insulation by spring. Electric characteristics of a interface depend on the contact pressure, but the required characteristics are assured so far as a proper contact pressure is maintained. In this report, the interfacial pressure by pressure sensors both in the early stage and after heating cycle were measured and the simulation by FEM program were presented. The comparison of these two results show that interfacial pressure could be controlled optimally by changing the spring length and lubricant state of the interface.

• Journal of Korea Foundry Society
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• v.20 no.2
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• pp.116-121
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• 2000

Interfacial reaction and mechanical properties between Sn-Zn-X ternary alloys(X : 3wt.%In, 4wt.%Bi) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 50days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3 mm $min^{-1}$ to measure tensile strength. According to the results of the solderability test, additions of In and Bi in the Sn-9wt.%Zn solder improve the wetting characteristics of the alloy and lower the melting temperature. Through the EDS and XRD analysis of Cu/Sn-9wt.%Zn solder joint, it was concluded that the intermetallic compound was the ${\gamma}-Cu_5Zn_8$ phase. Cu-Zn intermetallics at Cu/solder interfaces played an important role in both the microstructure evolution and failure of solder joints. Cu/solder joint strength was decreased by aging treatment, and those phenomenon was closely related to the thickening of intermetallic layer at Cu/solder joints.

• Journal of Korea Foundry Society
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• v.20 no.1
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• pp.21-28
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• 2000

Ni and Ni-Cr porous metals which are estimated to be easy to fabricate by squeeze casting are used as strengtheners for composite materials. As a matrix material, Al-7%wtSi-0.3 wt%Mg(AC4C) has been used. In case of Ni/AC4C and Ni-Cr/AC4C composite, $750^{\circ}C$ melt temperature and minimum 25 MPa squeezing pressure are needed to produce sound composite materials. The observation of interfacial reaction zone at various heat treatment condition showed that solutionizing temperature of above 520^{\circ}C$, the interfacial reaction zone increased proportionally with increasing heat treatment tim and reaction products formed by interfacial reaction are mainly composed of $Al_3Ni$ and $Al_3Ni_2$ phases. The tensile strength of Ni/AC4C and Ni-Cr/AC4C composite is lower than the matrix metal and this can be explained by the brittle intermetallic compounds formed at the interface of Ni and Ni-Cr reinforcements. But the properies of hardness, wear resistance and thermal expansion are better than the matrix due to the strengthening effect of Ni-Cr porous metals.