• Membrane Journal
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• v.8 no.1
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• pp.29-41
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• 1998

Thin-film composite reverse osmosis membranes of aromatic polyamides were prepared by the interfacial polymerization. Aromatic polyamides as active skin layer were made from the interfacial polymerization of MPD(m-phenylene diamine) in the aqueous and TMC(trimesoyl chloride) in HCFC(1,1-dichloro-1-fluoroethane) organic solvent. The performances of the various reverse osmosis composite membranes prepared by changing processing variables were examined. The performance of membrane manufactured by batch system was varied with organic solvent, monomer concentration, dipping time, heat treatment temperature, acid acceptor, ethanol post treatment, and acid post treatment. Ethanol post treatment was the most dominant factors in increasing permeate amount, while the monomer concentration and dipping time were the main factors in increasing selectivity. The spiral-wound module was produced with the membrane prepared at optimum condition of the continuous process. Comparing the performance of this membrane module made here with that of commercial membrane module, the permeate flux was increased by 33% while the rejection was decreased by 5%.

• Journal of the Korean Applied Science and Technology
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• v.17 no.4
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• pp.213-225
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• 2000

Sophorolipids were biosynthesized using a strain of yeast, Torulopsis bombicola ATCC22214. It has been reported that this yeast gives the highest yields for the production of biosurfactant sophorolipids. Hence, this yeast was used in this study. One of the objectives of this study is to increase the yield of the sophorolipid synthesis. To meet this end, basic culture medium was formulated on the basis of literature research to-date. When this medium was used, the increase in yield from 15% to 150% was observed compared to using the media in the literature. To examine how the interfacial characteristics of sophorolipids change with substrate, glucose (the first carbon source) was maintained in the media and after being cultured for three days, the second carbon sources such as alkanes, vegetable oils, alcohols or organic acids were added. The whole broth was extracted twice with ethyl acetate and the extract was analyzed by thin layer chromatograhy(TLC). After qualitative analyses by TLC, surface tensions of sophorolipids were measured by the Wilhelmy plate method and critical micelle concentration(CMC) was determined using these surface tension data. Also, interfacial tensions were measured by the spinning drop method and emulsions of the three-component water/decane/sophorolipid system were tested. Sophorolipids were effective and efficient in terms of surface tension reduction and CMC, but they were ineffective as emulsifiers because emulsions were separated within 30 minutes.

• Korean Journal of Materials Research
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• v.5 no.5
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• pp.560-567
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• 1995

Interfacial reactions, phase equilibria and elecrrical properties of Co films on (001) oreinted GaAs substrate, in the temperature range 300-$700^{\circ}C$ for 30min. have been investigated using x-ray diffraction and Augger electron spectropcopy. Cobalt started to react with GaAs at 38$0^{\circ}C$ by formation of Co$_{2}$GaAs phase. At 42$0^{\circ}C$, CoGa and CpAs nucleated at the Co and Co$_{2}$GaAs interface and grew with Co$_{2}$GaAs upto 46$0^{\circ}C$. contacts produced in this annealing regime were rectifying and Schottky varrier heights increased from 0.688eV(as-deposite state) up to 0.72eV(42$0^{\circ}C$). In the subsequent reation, the ternary phase started to decompose and lost stoichiometry at 50$0^{\circ}C$. At higher temperature, Co$_{2}$GaAs disappered and CoGa/CoAs/GaAs layer structures were formed. Contacts produced at higher temperature regime(>50$0^{\circ}C$) showed very low effective barriers. The results of interfacial reactions can be understood from the Co-Ga-As ternary phase diagram.

• Steel and Composite Structures
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• v.48 no.6
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• pp.693-708
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• 2023

Composite beams, two materials joined together, have become more common in structural engineering over the past few decades because they have better mechanical and structural properties. The shear connectors between their layers exhibit some deformability with finite stiffness, resulting in interfacial shear slip, a phenomenon known as partial shear interaction. Such a partial shear interaction contributes significantly to the composite beams. To provide precise predictions of the geometric nonlinear behavior shown by two-layered composite beams with interfacial shear slips, a robust analytical model has been developed that incorporates the influence of significant displacements. The application of a higher-order beam theory to the two material layers results in a third-order adjustment of the longitudinal displacement within each layer along the depth of the beam. Deformable shear connectors are employed at the interface to represent the partial shear interaction by means of a sequence of shear connectors that are evenly distributed throughout the beam's length. The Von-Karman theory of large deflection incorporates geometric nonlinearity into the governing equations, which are then solved analytically using the Navier solution technique. Suggested model exhibits a notable level of agreement with published findings, and numerical outputs derived from finite element (FE) model. Large displacement substantially reduces deflection, interfacial shear slip, and stress values. Geometric nonlinearity has a significant impact on beams with larger span-to-depth ratio and a greater degree of shear connector deformability. Potentially, the analytical model can accurately predict the geometric nonlinear responses of composite beams. The model has a high degree of generality, which might aid in the numerical solution of composite beams with varying configurations and shear criteria.

• Advances in concrete construction
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• v.15 no.6
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• pp.359-376
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• 2023

Ultra-high-performance concrete (UHPC) has become an attractive cast-in-place repairing material for existing engineering structures. The present study aims to investigate age-dependent high-early-strength UHPC (HESUHPC) material properties (i.e., compressive strength, elastic modulus, flexural strength, and tensile strength) as well as interfacial shear properties of HESUHPC-normal strength concrete (NSC) composites cured at different season temperatures (i.e., summer, autumn, and winter). The typical temperatures were kept for at least seven days in different seasons from weather forecasting to guarantee an approximately consistent curing and testing condition (i.e., temperature and relative humidity) for specimens at different ages. The HESUHPC material properties are tested through standardized testing methods, and the interfacial bond performance is tested through a bi-surface shear testing method. The test results quantify the positive development of HESUHPC material properties at the early age, and the increasing amplitude decreases from summer to winter. Three-day mechanical properties in winter (with the lowest curing temperature) still gain more than 60% of the 28-day mechanical properties, and the impact of season temperatures becomes small at the later age. The HESUHPC shrinkage mainly occurs at the early age, and the final shrinkage value is not significant. The HESUHPC-NSC interface exhibits sound shear performance, the interface in most specimens does not fail, and most interfacial shear strengths are higher than the NSC-NSC composite. The HESUHPC-NSC composites at the shear failure do not exhibit a large relative slip and present a significant brittleness at the failure. The typical failures are characterized by thin-layer NSC debonding near the interface, and NSC pure shear failure. Two load-slip development patterns, and two types of main crack location are identified for the HESUHPC-NSC composites tested in different ages and seasons. In addition, shear capacity of the HESUHPC-NSC composite develops rapidly at the early age, and the increasing amplitude decreases as the season temperature decreases. This study will promote the HESUHPC application in practical engineering as a cast-in-place repairing material subjected to different natural environments.

• Journal of the Korean Magnetics Society
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• v.6 no.1
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• pp.1-6
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• 1996

To simulate the characteristics of magnetic exchange coupling at the interface of MR/TbCo thin films, the directions of magnetizations were calculated by minimizing energy in the films. Newton method and Gauss-Seidel method were used. The width of M-H curve increased with TbCo anisotropy constant, and with the thickness of the transition region of TbCo layer. Hysteresis loop width became extremely narrow (less than 10 Oe of coercivity), when the TbCo transition region length was $400\;\AA$. Also the hysteresis loop of films with low interfacial exchange coupling constant was similiar to that of short transition region length. When interfacial exchange coupling constant was 1/100 of perfect coupling, hysteresis loop showed a coercivity of less than 10 Oe. Comparing the measured hysteresis loop of a fabricated sample with that of simulated one, exchange coupling con¬stant could be estimated.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.12
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• pp.1667-1672
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• 2003

In contrast to the high demand for MEMS devices, microflow analysis is not feasible even for single-phase flow with conventional Navier-Stokes equation because of non-continuum effect when characteristic dimension is comparable with local mean free path. DSMC is one of particle based DNS(Direct Numerical Simulation) methods that uses no continuum assumption. In this paper, gas flow in microchannel is studied using DSMC. Interfacial shear and flow characteristics are observed and compared with the results of gas flow that is in contact with liquid case and solid wall case. The simulation is limited to the case of equilibrium steady state and evaporation/condensation coefficient is assumed to be the same and unity. System temperature remains constant and the interfacial shear appears to be small compared to the result with solid wall. This is because particles evaporated and reflected from the liquid surface form high density layer near the interface with liquid flow.

• Electrical & Electronic Materials
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• v.16 no.9
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• pp.65.1-65
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• 2003

The interface of zirconium oxide thin films on silicon is analyzed in detail for their potential applications in the microelectronics. The formation of an interfacial layer of ZrSi$\sub$x/O$\sub$y. with graded Zr concentration is observed by the x-ray photoelectron spectroscopy and secondary ion mass spectrometry analysis. The as-deposited ZrO$_2$/ZrSi$\sub$x/O$\sub$y//Si sample is thermally stable up to 880$^{\circ}C$, but is less stable compared to the ZrO$_2$/SiO$_2$/Si samples. Post-deposition annealing in oxygen or ammonia improved the thermal stability of as-deposited ZrO$_2$/ZrSi$\sub$x/O$\sub$y/Si to 925$^{\circ}C$, likely due to the oxidation/nitridation of the interface. The as-deposited film had an equivalent oxide thickness of∼13 nm with a dielectric constant of ∼21 and a leakage current of 3.2${\times}$10e-3 A/$\textrm{cm}^2$ at 1.5V. Upon oxygen or ammonia annealing, the formation of SiO$\sub$x/ and SiH$\sub$x/N$\sub$y/O$\sub$z/ at the interface reduced the overall dielectric constants.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.740-742
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• 1998

In this paper, we described the effect of rapid thermal annealing on the electrical properties of interfacial layer between various top electrodes and $(Ba_{0.5}Sr_{0.5})TiO_3$ thin films. BST thin films were fabricated on Pt/TiN/$SiO_2$/Si substrate by RF magnetron sputtering technique. AI, Ag, and Cu films for the formation of top electrode were deposited on BST thin films by thermal evaporator. Top electrodes/BST/Pt capacitor annealed with rapid thermal annealing at various temperature. In $(Ba_{0.5}Sr_{0.5})TiO_3$ thin films with Cu top electrode annealed at $500^{\circ}C$, the dielectric constant was measured to the value of 366 at 1.2 [kHz] and the leakage current was obtained to the value of $5.85{\times}10^{-7}\;[A/cm^2}$ at the forward bias of 2 [V].

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.481-486
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• 2002

We have investigated the effects of plating materials for Cu lead (Sn-lOPb, AwPdJNi, Sn-3.5Ag, Sn-3Bi and Sn-0.7Cu) on properties of QFP joints using a Sn-8Zn-3Bi solder. The results were compared with the joints using Sn-3. 5Ag-0. 7Cu and Sn-37Pb solders. As a result, the joints with the Sn-3.5Ag, Sn-3Bi and Sn-0.7Cu plated Cu lead had the reliability comparable to those of the Sn-3.5Ag-0.7Cu and Sn-37Pb soldered joints with respect to the joint strength after the high temperature holding tests at 348K to 423k. In particular, the joint with the Sn-3.5Ag plated Cu lead had the best reliability. This is caused by the low growth rate of a Cu-Sn interfacial reaction layer that degrades the joint strength of the soldered joints. Consequently, the Sn-3.5Ag plating was found to be most feasible plating for the Sn-8Zn-3Bi soldered joint.