• Journal of Welding and Joining
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• v.20 no.5
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• pp.106-112
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• 2002

In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.115-117
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• 2009

Interface dipole energies between interfacial layers with different thicknesses coated on indium tin oxides (ITOs) and 4,4'-bis[N-(1-naphtyl)-N-phenyl-amino]biphenyl are determined. After $O_2$ plasma treatment on thick-metal (>4 nm) coated ITO, the work function and interface dipole energy increased. In thin-metal (< 2 nm) coated ITO, no change in the interface dipole energy was found though the work function increased. Thus, the $O_2$ plasma treated thin (< 2 nm) interfacial layer reduced the hole injection barrier.

• Korean Journal of Materials Research
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• v.20 no.6
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• pp.319-325
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• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

• Corrosion Science and Technology
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• v.22 no.4
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• pp.287-296
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• 2023

Li-ion batteries have been gaining increasing importance, driven by the growing utilization of renewable energy and the expansion of electric vehicles. To meet market demands, it is essential to ensure high energy density and battery safety. All-solid-state batteries (ASSBs) have attracted significant attention as a potential solution. Among the advantages, they operate with an ion-conductive solid electrolyte instead of a liquid electrolyte therefore significantly reducing the risk of fire. In addition, by using high-capacity alternative electrode materials, ASSBs offer a promising opportunity to enhance energy density, making them highly desirable in the automotive and secondary battery industries. In ASSBs, Li metal can be used as the anode, providing a high theoretical capacity (3860 mAh/g). However, challenges related to the high interfacial resistance between Li metal and solid electrolytes and those concerning material degradation during charge-discharge cycles need to be addressed for the successful commercialization of ASSBs. This review introduces and discusses the interfacial reactions between Li metal and solid electrolytes, along with research cases aiming to improve these interactions. Additionally, future development directions in this field are explored.

• Composites Research
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• v.21 no.4
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• pp.7-14
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• 2008

Prediction of the load-bearing capacity of an adhesive-bonded Joint is of practical importance for engineers. This paper introduces interface fracture mechanics approach to predict the load-bearing capacity of composite metal bonded joints. The adhesion strength of composite/steel bonding is evaluated in terms of the energy release rate of an interfacial crack and the fracture toughness of the interface. Virtual track closure technique (VCCT) is used to calculate energy release rates, and hi-material end-notched flexure (ENF) specimens are devised to measure the interfacial fracture toughness. Bi-material ENF specimens gave consistent mode II fracture toughness $(G_{IIc})$ values of the composite/steel interface regardless of the thickness of specimens. The critical energy release rates of double-lap joints showed a good agreement with the measured fracture toughness. Therefore. the energy-based interfacial fracture characterization can be a practical engineering tool for predicting the load-bearing capacity of bonded joints.

• Nuclear Engineering and Technology
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• v.32 no.5
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• pp.433-445
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• 2000

The interfacial area concentration (IAC) is one of the most important parameters in the two-fluid model for two-phase flow analysis. The IAC can be measured by a local conductivity probe method that uses the difference of conductivity between water and air/steam. The number of sensors in the conductivity probe may be differently chosen by considering the flow regime of two-phase flow. The four sensor conductivity probe method predicts the IAC without any assumptions of the bubble shape. The local IAC can be obtained by measuring the three dimensional velocity vector elements at the measuring point, and the directional cosines of the sensors. The five sensor conductivity probe method proposed in this study is based on the four sensor probe method. With the five sensor probe, the local IAC for a given referred measuring area of the probe can be predicted more exactly than the four sensor probe. In this paper, the mathematical approach of the five sensor probe method for measuring the IAC is described, and a numerical simulation is carried out for ideal cap bubbles of which the sizes and locations are determined by a random number generator.

• Corrosion Science and Technology
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• v.23 no.4
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• pp.334-342
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• 2024

The need for efficient and sustainable energy storage solutions has emerged due to a rapidly increasing energy demand and growing concerns about environmental issues. Among various energy storage methods, lithium secondary batteries are widely used in a variety of electronic devices such as smartphones, laptops, electric vehicles, and large-scale power storage systems due to their high energy density, long lifespan, and cost competitiveness. Recently, all-solid-state batteries (ASSBs) have attracted great attention because they can reduce the risk of fire associated with liquid electrolytes. Additionally, using high-capacity alternative anodes and cathodes in ASSBs can enhance energy density. However, ASSBs that use solid electrolytes experience a degradation in their electrochemical performances due to resistance at solid-solid interfaces. These interfaces can also result in poor physical contact and the presence of products formed from chemical and electrochemical reactions. Solving this interface problem is a critical issue for the commercialization of ASSBs. This review summarizes interfacial reactions between the cathode and solid electrolyte, along with research aimed at improving these interactions. Future development directions in this field are also discussed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.6
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• pp.1047-1052
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• 2002

The impact value, the interfacial shear strength, the tensile strength and the fracture strain of Nb/MoSi$_2$laminate composites, which were associated with the interfacial reaction layer, have been investigated. Three types of Nb/MoSi$_2$ laminate composites alternating sintered MoSi$_2$ layers and Nb foils were fabricated as the parameter of hot press temperature. The thickness of interfacial reaction layer of Nb/MoSi$_2$ laminate composites increased with increasing the fabrication temperature. The growth of interfacial reaction layer increased the interfacial shear strength and led to the decrease of impact value in Nb/MoSi$_2$ laminate composites. It was also found that in order to maximize the fracture energy of Nb/MoSi$_2$ laminate composites, interfacial shear strength and the thickness of interfacial reaction layer must be secured appropriately.

• Korea-Australia Rheology Journal
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• v.13 no.3
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• pp.125-130
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• 2001

Block copolymers of PC-b-PMMA (polycarbonate-b-polymethylmethacrylate) and PC -b-SAN (polycarbonate-b-(styrene-c-acrylonitrile)), were examined as compatibilizers for blonds of PC with SAN copolymer. The average diameter of the dispersed particles was measured with an image analyser, and the interfacial properties of the blonds were analysed with an imbedded fiber retraction (IFR) technique. The average diameter of dispersed particles and interfacial tension of the PC/SAN blends reached a minimum value when the SAN copolymer contained about 24 wt% AN. Interfacial tension and particle size were further reduced by adding compatibilizer to the PC/SAN blends. PC-b-PMMA was more effective than PC-b-SAN as a compatibilizer in reducing the average diameter of the dispersed particles and interfacial tension of PC/SAN blend. A direct proportionality between the particle diameter and interfacial tension was also observed. The interfacial properties of the PC/SAN blends were optimized by adding a block copolymer and using an SAN copolymer that had minimum interaction energy with PC.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.41-48
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• 2018

The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.