• 제목/요약/키워드: Interface strength

검색결과 1,709건 처리시간 0.023초

SiO$_2$-CaO-Al$_2$O$_3$계 유리 솔더에 의한 알루미나의 접합 현상에 관한 연구 (A Study for Joining of Alumina Soldered by SiO$_2$-CaO-A1$_2$O$_3$ Glasses)

  • 안병국
    • Journal of Welding and Joining
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    • 제21권2호
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    • pp.35-41
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    • 2003
  • Sintered alumina ceramics were joined by 2 kinds of SiO$_2$-CaO-A1$_2$O$_3$ glass solders having a similar expansivity as alumina. Wetting of glass/alumina was examined by sessile drop method. The observation of interface and bending strength related to alumina/glass/alumina systems were investigated by means of SEM/EDX and 4-point bending test. the result are summarized as follow: (1) Wetting of glass solders on alumina was good at temperatures higher than 145$0^{\circ}C$. (2) When the joining temperature wan high, diffusion and/or reactions between solder md alumina took place at the interface. These diffusions and reactions occurring at the interface greatly affected the bending strength of joining body. (3) Highest strength corresponding to 80% that of alumina was obtained by the solder of 35SiO$_2$-35CaO-30A1$_2$O$_3$(wt%) glass.

이종재료의 경사접착이음에 대한 파괴강도의 예측 (Prediction Fracture Strength on Adhesively Bonded scarf Joints in Dissimilar Materials)

  • 정남용
    • 한국생산제조학회지
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    • 제4권4호
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    • pp.50-60
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    • 1995
  • Recently advantages joining dissimiliar materials and light weight material techniques have led to increasing use of structural adhesives in the various industries. Stress singulartiy occurs at the interface edges of adhesively bonded dissimilar materials. So it is required to analyze its stress singularity at the interface edges of adhesively bonded joints indissimilar materials. In this paper, the analysis method of stress singularity is studied in detail. Also, effects of the stress singularity at the interface edge of adhesively bonded scarf joints in combinations of dissimilar materials are investigated by using 2-dimensional elastic program of boundary element method. As the results, the strength evaluation method of adhesively bonded dissimilar materials using the stress singularity factor, $\Gamma$,is very useful. The fracture criterion, method of strength evaluation and prediction of fracture strength by the stress singularity factor on the adhesively bonded dissimilar materials are proposed.

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Friction behavior of controlled low strength material-soil interface

  • Han, WooJin;Kim, Sang Yeob;Lee, Jong-Sub;Byun, Yong-Hoon
    • Geomechanics and Engineering
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    • 제18권4호
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    • pp.407-415
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    • 2019
  • A controlled low strength material (CLSM) is a highly flowable cementitious material used for trench backfilling. However, when applying vertical loads to backfilled trenches, shear failure or differential settlement may occur at the interface between the CLSM and natural soil. Hence, this study aims to evaluate the characteristics of the interface friction between the CLSM and soils based on curing time, gradation, and normal stress. The CLSM is composed of fly ash, calcium sulfoaluminate cement, sand, silt, water, and an accelerator. To investigate the engineering properties of the CLSM, flow and unconfined compressive strength tests are carried out. Poorly graded and well-graded sands are selected as the in-situ soil adjacent to the CLSM. The direct shear tests of the CLSM and soils are carried out under three normal stresses for four different curing times. The test results show that the shear strengths obtained within 1 day are higher than those obtained after 1 day. As the curing time increases, the maximum dilation of the poorly graded sand-CLSM specimens under lower normal stresses also generally increases. The maximum contraction increases with increasing normal stress, but it decreases with increasing curing time. The shear strengths of the well-graded sand-CLSM interface are greater than those of the poorly graded sand-CLSM interface. Moreover, the friction angle for the CLSM-soil interface decreases with increasing curing time, and the friction angles of the well-graded sand-CLSM interface are greater than those of the poorly graded sand-CLSM interface. The results suggest that the CLSM may be effectively used for trench backfilling owing to a better understanding of the interface shear strength and behavior between the CLSM and soils.

구리/에폭시 계의 필 접착력 분석 (Peel Strength Analyses of Copper/Epoxy System)

  • 최광성;유진;이호영
    • 한국표면공학회지
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    • 제29권4호
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    • pp.238-252
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    • 1996
  • In order to study the effect of interface oxides on the adhesion strength of the copper/epoxy system, copper foils were immersed in black oxide or brown oxide forming solutions before lamination with epoxy prepregs, and variation of peel strength with the treatment time were investigated. Results showed that peel strength decreased rapidly up to 1 minute of treatment lime and remained constant in the case of the black oxide treated specimens, which was accompanied by the thickening of $Cu_2O$ at the Copper/Epoxy interface during the period. In contrast, peel strength increased rapidly up to 1 minute of treatment time and remained constant in the case of the brown oxide treated specimens, which could be ascribed to the thickening of CuO. Subsequent heat treatments of the Copper/Epoxy laminations at $120^{\circ}C$ in air showed that peel strength remained constant in the case of the black oxide treated specimens but decreased gradually in the case of the brown oxide treated specimens. Following XPS analyses revealed that the latter was possibly caused by the coalescence of CuO at the Copper/Epoxy interface into $Cu_2O$.

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표면처리 및 양생 조건이 초고성능 콘크리트-보통 콘크리트 계면 부착강도에 미치는 영향 (Effect of Surface Preparation and Curing Condition on the Interfacial Bond Strength between Ultra High Performance Concrete and Normal Strength Concrete)

  • 강성훈;홍성걸
    • 한국구조물진단유지관리공학회 논문집
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    • 제19권3호
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    • pp.149-160
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    • 2015
  • 이 연구에서는 초고성능 콘크리트 (UHPC)와 보통 콘크리트 (NSC)간 계면부착강도에 관한 연구를 수행하였다. UHPC를 보수 보강재로 활용하기 위한 기존의 부착강도에 관한 연구와 달리, UHPC를 프리캐스트 합성부재로 활용하기 위한 연구에 초점을 맞추었으며, 여기에 영향을 미칠 수 있는 다양한 요인에 대하여 검토하였다. 기존 연구들을 분석한 결과, UHPC-NSC 계면 부착강도에 영향을 미칠 수 있는 요인으로는 계면의 형상, 합성 전 UHPC의 경화 진행상태, 합성 전 UHPC의 수분 흡수상태, 그리고 합성 후 양생장소와 같이 크게 4가지로 구분되었다. 계면의 형상을 변수로 한 실험에서는 형상에 따라 각기 다른 파괴모드가 나타났으며, 기존 연구에서 확인되지 않았던 거칠게 처리한 UHPC 계면 일부가 파괴되는 새로운 파괴모드가 발견되었다. 합성 전 UHPC의 경화진행 상태가 부착강도에 영향을 미치는 것으로 나타났으며, 이러한 영향은 부착 파괴모드에 따라 다르게 나타났다. 또한, 합성 전 UHPC의 수분상태가 부착강도에 영향을 주었으며, UHPC의 양생방법에 따라 서로 상반되는 결과를 보였다. 마지막으로, 합성한 시편의 양생조건 역시 계면 부착강도에 영향을 미친다는 것을 확인하였다.

XLPE/EPOM 계면의 전기적 특성 (Electrical Characteristics on the Interface between XLPE/EPDM)

  • 한성구;조정형;이창종;김종석;서광석;박대희;한상옥
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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    • pp.235-238
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    • 1996
  • In this paper, We intended to evaluate the characteristics of XLPE/EPDM interface which exists in the cable joint. The fault was mainly occurred in this interface. Thus we looked into the electrical characteristics through the conduction current and the breakdown test. Through from the experiment, we obtained the result that the conduction current in this interface flowed less than other dielectric materials, that the breakdown strength was higher and that the pressure dependance ㅐf the breakdown strength was higher.

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토목섬유 점토 차수재(GCL)와 지오멤브레인(GM)의 접촉 전단강도 평가 (An Evaluation of Interface Shear Strength between Geosynthetic Clay Liner and Geomembrane)

  • 서민우;김동진;박준범;박인준
    • 한국지반공학회논문집
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    • 제18권4호
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    • pp.137-146
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    • 2002
  • 폐기물 매립지에는 침출수가 외부로 유출되는 것을 방지하기 위해 지오멤브레인, 점토차수재 및 토목섬유 점토 차수재(GCL) 등이 널리 사용된다. 매립지의 사면에 설치되는 GCL과 지오멤브레인 사이의 접촉(interface) 전단강도는 사면에 설치되는 차수 및 최종 덮개시설의 안전한 설계를 위해 꼭 필요한 물성치로서, 본 연구에서는 대형 직접전단 시험기를 사용하여 두 종류의 GCL과 지오멤브레인 사이의 접촉 전단강도를 측정하였다. 본 논문에서는 Mohr-Coulomb 파괴 포락선을 이용하여 전단강도를 평가하였으며, 연직하중, 수화 및 건조상태, 수화조건 등이 전단강도에 미치는 영향을 알아보았다. 분석 결과 연직하중이나 수화 상태가 전단 거동 및 전단 강도에 미치는 영향은 하중의 크기와 토목섬유의 종류에 따라 다르게 나타났다. 6kPa의 하중을 가한 상태에서 수화를 시킨 후 실시한 전단 시험 결과는 기존의 문헌에 제시된 결과와도 잘 일치하는 모습을 보였다. 마지막으로 연직하중 및 수화조건에 따른 마찰각을 제시하여 유사한 토목섬유가 적용되는 현장의 설계시 참고자료로 활용할 수 있도록 하였다.

잔류응력과 계면접합강도를 고려한 금속복합재료의 열탄소성 변형 해석 (Thermal Elasto-Plastic Deformation Analysis of Metal Matrix Composites Considering Residual Stress and Interface Bonding Strength)

  • 강충길;서영호
    • 한국정밀공학회지
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    • 제16권1호통권94호
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    • pp.227-237
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    • 1999
  • As the interface bonding phenomenon between the matrix and the reinforcements has a large effect on the mechanical properties of MMCs, a sugestion of the strength analysis technique considering the residual stress and the interface bonding phenomenon is very important for the design of pans and the estimation of fatigue behavior. In this paper the three dimensional finite element anaysis is performed during the elasto-plastic deformation of the particulate reinforced metal matrix composites. It was analyzed with the volume fractions in view of microscale. Bonding strength. interface separation and matrix void growth between the matrix and the reinforcements will be predicted on deformation under tensile loading. An interface seperation is estimated by the fracture criterion which is a critical value of generalized plastic work per unit volume. The shape of the reinforcement is assumed to be a perfect sphere. And the type of the reinforcement distribution is assumed as FCC array. The thermal residual stress in MMCs is induced by the heat treatment. It is included at the simulation as an initial residual stress. The element birth and death method of the ANSYS program is used for the estimation of the interface bonding strength, void generation and propagation. It is assumed that the fracture in the matrix region begin to occur under the external loading when the plastic work per unit volume is equal to the critical value. The fracture strain will be defined. The experimental data of the extruded $SiC_p$>/606l Al composites are compared with the theoretical results.

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벗김강도 측정법에 의한 파워 모듈의 솔더접합 특성 평가 (Characterization of the Soldering Interface in Power Modules by Peel Strength Measurement)

  • 김남균;이희흥;방욱;서길수;김은동
    • 한국전기전자재료학회논문지
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    • 제16권12호
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    • pp.1142-1149
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    • 2003
  • The strength and characteristics of the soldering interface of the power semiconductor chip in a power module has been firstly surveyed by the peel strength measurement method. A power module is combined with several power chips which generally has 30∼400$\textrm{mm}^2$ chip area to allow several tens or bigger amps in current rating, so that the traditional methods for interface characterization like shear test could not be applied to high power module. In this study power diode modules were fabricated by using lead-tin solder with 10${\times}$10$\textrm{mm}^2$ or 7${\times}$7$\textrm{mm}^2$ soldering interface. The peel strengths of soldered interfaces were measured and then the microscopic investigation on the fractured surfaces were followed. The peel test indicated that the crack propagated either through the bulk of the soft lead-tin solder which has 55-60 kgf/cm peel strength or along the interface between the solder and the plated nickel layer which has much lower 22 kgf/cm strength. This study showed that the peel test would be a useful method to quantify the solderability as well as to recognize which is the worst interface or the softest material in a power module with a large soldering area.

Effects of interface angles on properties of rock-cemented coal gangue-fly ash backfill bi-materials

  • Yin, Da W.;Chen, Shao J.;Sun, Xi Z.;Jiang, Ning
    • Geomechanics and Engineering
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    • 제24권1호
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    • pp.81-89
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    • 2021
  • Uniaxial compression tests were conducted on sandstone-CGFB composite samples with different interface angles, and their strength, acoustic emission (AE), and failure characteristics were investigated. Three macro-failure patterns were identified: the splitting failure accompanied by local spalling failure in CGFB (Type-I), the mixed failure with small sliding failure along with the interface and Type-I failure (Type-II), and the sliding failure along with the interface (Type-III). With an increase of interface angle β measured horizontally, the macro-failure pattern changed from Type-I to Type-II, and then to Type-III, and the uniaxial compressive strength and elastic modulus generally decreased. Due to the small sliding failure along with the interface in the composite sample with β of 45°, AE events underwent fluctuations in peak values at the later post-peak failure stage. The composite samples with β of 60° occurred Type-III failure before the completion of initial compaction stage, and the post-peak stress-time curve initially exhibited a slow decrease, followed by a steep linear drop with peaks in AE events.