• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.938-940
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• 1998

In order to improve insulating character and ability of insulating system of power apparatus, the interfacial and complex structure is widely used. However, the interface or complex structure of insulation materials is reported as a weak point which causes breakdown. As the interface of insulation system degrades its electrical property and eventually causes a failure, the datailed phenomenon analysis is reported. The object of this paper is to evaluate dielectric property of PET film with the interface. The $tan{\delta}$ increased with the existence of semiconducting layer and showed prominent decrease as a function of temperature. Also, the $tan{\delta}$ showed prominent increase as a function of frequency. The dielectric properties of interfacial were affected by the interface characteristics.

• Interaction and multiscale mechanics
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• v.4 no.2
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• pp.165-171
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• 2011

In this study, we proposed a three-dimensional dynamic model under the diffuse interface description for the single crawling cell. From the developed model, we described the clear evolution processes for crawling neutrophil and assessed the reliable quantitative chemotactic property, which confirmed the high possibility of adequate predictions. To establish the system considering of multiple mechanisms such as, diffusion, chemotaxis, and interaction with surface, a diffuse interface model is employed.

• 한국전산유체공학회:학술대회논문집
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• 2009.04a
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• pp.283-289
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• 2009

In level set method, material properties are made to change smoothly across an interface of two materials with different properties by introducing an interpolation or smoothing scheme. So far, the weighted arithmetic mean (WAM) method has been exclusively adopted in level set method, without complete assessment for its validity. We showed here that the weighted harmonic mean (WHM) method for rate constants of various rate processes, including viscosity, thermal conductivity, electrical conductivity, and permittivity, gives much more accurate results than the WAM method. The selection of interpolation scheme is particularly important in multi-phase electrohydrodynamic problems in which driving force for fluid flow is electrical force exerted on the phase interface. Our analysis also showed that WHM method for both electrical conductivity and permittivity gives not only more accurate, but also more physically realistic distribution of electrical force at the interface. Our arguments are confirmed by numerical simulations of drop deformation under DC electric field.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.10
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• pp.1500-1508
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• 2004

Stress and displacement fields for a crack propagating along interface between isotropic material and functionally gradient one with linear property gradation along X direction are developed. The stress and displacement fields are obtained from the complex function of steady plane motion for isotropic and functionally gradient material (FGM). The stresses and displacement in isotropic material of bimaterial are not influenced by nonhomogeneity, however, the fields in FCM are influenced by nonhomogeneity in the terms of higher order, n$\geq$3. When the nonhomogeneous parameter in FGM is zero, or in area close to crack tip, the fields are identical to those of isotropic-isotropic bimaterial. Using these stress components, the effects of nonhomogeneity on stresses are discussed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.2
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• pp.76-82
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• 2009

In this papers, Study on the Bonding property and Strength Evaluation in Bonding interface Joints of Dissimilar material using DOE. We found optimal condition that uses experimental design method (Response Surface Analysis, DOE) used temperature, pressure, time on experiment factor. And we could get bonding condition and strength that break and crack do not happen in mechanical processing about united dissimilar material. And progress 3 point bending tests and verified result.

• Proceedings of the KWS Conference
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• 2004.05a
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• pp.75-77
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• 2004

Microstructure and mechanical property of In48Sn solder on electrolytic Au/Ni/Cu BGA substrate were investigated with the number of reflows. AuIn and AuIn$_2$ IMCs were formed at the interface solder and pad after 1reflow. An increase of the number of reflows changed AuIn into AuIn$_2$. AuIn$_2$ IMC layer at the interface broke and spalled away into the solder after 3reflows. Shear force decreased with the number of reflows because the weakness of the interface by the spalling of AuIn$_2$ IMC layer.

• Proceedings of the KIEE Conference
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• 1996.11a
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• pp.221-223
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• 1996

The test on the breakdown strength and the electrical conduction property about the PET flim have been done when the interface exist and do not exist between the PET flim. The PET flim that does not exist the interface uniformly maintained the breakdown strength as the temperature increase. But, the breakdown strength of the PET flim inserted carbon black flim decreased as the temperature increase. The initial current of the PET flim inserted carbon black flim was higher than the PET flim and the uniformly distributed between 2.2E-9 and 2.5E-9 above 5kV/mm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1991.10a
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• pp.83-89
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• 1991

The partial discharge properties of interface layer in Mica-Epoxy composite, which has been mainly used for the coil insulating material of high voltage machinery, are different from those of resins due to the abnormal interface layer to be presented between inorganic material and resin. Accordingly, the study on discharge of interface in composite insulting system is strongly requsted for not only an increasing of insulating strength, but also the basical information of diagnosis system for high voltage equipment. As a result, it has been confirmed that the interface is an abnormal resin layer and the contact states at interface is depended upon the density of silane aqueous solution. Pulse frequency at abnormal interface shows a linear increasing with enlargement of discharge quantity. Whereas, in case of normal interface, pulse frequency property represents exponential increasing at the point of saturating. A life model can be diagramed from results of time dependance of skewness, and a survival life time can be quantified from the life model suggested.

• Korean Journal of Materials Research
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• v.13 no.5
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• pp.338-342
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• 2003

Adhesion between Cu and low-k films has been investigated. Low-k films deposited using a mixture of hexamethyldisilane(HMDS) and Para-xylene had a dielectric constant as low as 2.7, showing the thermally stable properties up to $400^{\circ}C$. In this study, Ti glue layer, boron dopant, and $N_2$plasma treatment were used to improve adhesion property of between Cu and low-k films. Ti glue layer slightly improved adhesion property. After $N_2$plasma treatment, the adhesion property was significantly improved due to the increased roughness and the formation of new binding states between Ti and plasma-treated PPpX : HMDS. However, $300^{\circ}C$ annealing of $N_2$plasma treated sample caused the diffusion of Cu into the PPpX : HMDS, degrading the low-k properties. In the case of Cu(B)/Ti/PPpX : HMDS, the adhesion was remarkably increased. This enhanced adhesion was attributed to formation of Ti-boride at the Cu-Ti interface. It is because the formed Ti-boride prevented the diffusion of Cu into the PPpX : HMDS and the Cu-Ti reaction at the Ti interface.

• Journal of Adhesion and Interface
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• v.6 no.4
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• pp.12-17
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• 2005

Natural fiber/phenolic biocomposites with chopped henequen fibers treated at various levels of electron beam irradiation (EBI) were made by means of a matched-die compression molding method. The interfacial property was explored in terms of interfacial shear strength measured by a single fiber microbonding test. The thermal properties were studied in terms of storage modulus, tan ${\delta}$, thermal expansion and thermal stability measured by dynamic mechanical analysis, thermomechanical analysis and thermogravimetric analysis, respectively. The result showed that the interfacial and thermal properties depend on the treatment level of EBI done to the henequen fiber surfaces. The present result also demonstrates that 10 kGy EBI is most preferable to physically modify the henequen fiber surfaces and then to improve the interfacial property of the biocomposite, supporting earlier results studied with henequen/poly (butylene succinate) and henequen/unsaturated polyester biocomposites.