• 제목/요약/키워드: Interface parameter

검색결과 360건 처리시간 0.033초

비점성 정체 유동 하에서의 응고와 열전달 (Heat Transfer and Solidification in the Inviscid Stagnation Flow)

  • 유주식;김용진
    • 한국전산유체공학회지
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    • 제5권1호
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    • pp.27-32
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    • 2000
  • This study investigates the problem of phase change from liquid to solid in the inviscid stagnation flow. The instantaneous location of the solid-liquid interface is fixed for all times by a coordinate transformation. Finite difference method is used to obtain the solution of the unsteady problem, and the growth rate of solid and the transient heat transfer from the surfaces of solid are investigated. The transient solution is dependent on the three dimensionless parameters, but the final steady state is determined by only one parameter of temperature ratio/conductivity ratio. It is observed that the instantaneous heat flux at the surface of solid can be obtained with sufficient accuracy by measuring the thickness of the solid or vice versa.

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비점성 평면 정체 유동 응고 문제에 대한 점근적 해석 (An Asymptotic Analysis on the Inviscid Plane Stagnation-flow Solidification Problem)

  • 유주식;엄용균
    • 대한기계학회논문집B
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    • 제24권6호
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    • pp.792-801
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    • 2000
  • The problem of phase change from liquid to solid in the inviscid plane-stagnation flow is theoretically investigated. The solution at the initial stage of freezing is obtained by expanding it in powers of time, and the final equilibrium state is determined from the steady-state governing equations. The transient solution is dependent on the three dimensionless parameters, but the equilibrium state is determined by one parameter of (temperature ratio/conductivity ratio). The effect of the fluid flow on the growth rate of the solid in the pure conduction problem can be clearly seen from the solution of the initial stage and the final equilibrium state. The characteristics of the transient heat transfer at the surface of the solid and the liquid side of the solid-liquid interface for all the dimensionless parameters are elucidated.

고온 보일러 헤더의 잔여수명평가 사례 연구 (A Case Study of Remaining Life Assessment for Boiler Header)

  • 백운봉;이해무;박종서;김동진;윤기봉
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집A
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    • pp.274-279
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    • 2001
  • Creep-fatigue crack growth behavior was experimentally measured particularly when a crack was located in the heat affected region of 1Cr-0.5Mo steel. Load hold times of the tests for trapezoidal fatigue waveshapes were varied among 0, 30, 300 and 3,600 seconds. Time-dependent crack growth rates were characterized by the $C_t$-parameter. It was found that the crack growth rates were the highest when the crack path was located along the fine-grained heat affected zone(FGHAZ). Cracks located in other heat affected regions had a tendency to change the crack path eventually to FGHAZ. Creep-fatigue crack growth law of the studied case is suggested in terms of $(da/dt)_{avg}$ vs. $(C_t)_{avg}$ for residual life assessment.

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PSCAD/EMTDC를 이용한 풍력발전시스템의 과도현상 시뮬레이션에 관한 연구 (Study on the Transient Phenomenon Simulation of Wind Power Generation System using PSCAD/EMTDC)

  • 한상근;박민원;유인근
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2002년도 추계학술대회 논문집 전기기기 및 에너지변환시스템부문
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    • pp.309-312
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    • 2002
  • For the purpose of more effective simulation of the utility interactive WPGS(Wind Power Generation System) the SWRW (Simulation method for WPGS using Real Weather condition) is used in this paper, in which those of three topics for the WPGS simulation. user-friendly method, applicability to grid-connection and the utilization of the real weather conditions, are satisfied. The simulation of the WPGS using the real weather condition including components modeling of wind turbine system is achieved by introducing the interface method of a non-linear external parameter and FORTRAN using PSCAD/EMTDC. The simulations of steady-state and transient-state are performed effectively by the introduced simulation method. The generator output and current supplied into utility can be obtained by the steady-state simulation, and THD can be achieved by analyzing the results as well. The transient - state of the WPGS can be analyzed by the simulation results of over cut-out wind speed.

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반도체 제조 공정에서 장비와 호스트간 SECS 프로토콜 통신을 위한 응용 프로그램 구현 (An Application Implementation for the SECS Protocol Communication between Equipments and a Host in a Semiconductor Process)

  • 김대원;전정만;이병훈;김홍석;이호길
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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    • pp.293-293
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    • 2000
  • The SECS(SEMI Equipment Communications Standard) is a standard protocol for communication between equipments and a host in semiconductor processes. This paper proposes the implementation of the HSMS(High-speed SECS Message Services) as an interface for transmission of the SECS messages and SECS-II containing message contents defined as an SEMI standard. The HSMS driver is implemented as a type of the daemon program and several DLL files. The SECS-II composes of the SML(SECS Message Language) file defining the SECS messages, the SML translator being able to interpret and transform the SML, and the data index table being able to refer to SECS messages. We also define the shared parameter to exchange the HSMS header and SECS message between the HSMS and the SECS-II. Eventually, to show the effectiveness of the proposed drivers, we test the SECS communications between equipments and a host using the implemented communication programs.

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열처리 조건에 따른 Al-Si 접촉 (Al-Si Contact on Annealing condition)

  • 김대형;유석빈;김창일;장의구
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1990년도 하계학술대회 논문집
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    • pp.261-264
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    • 1990
  • The specific contact resistance(SCR) of metal-semiconductor interface is an important design parameter for VLSI interconnecting technology. As the critical feature size of the integrated structures decrease, the physical size of ohmic contacts will also decrease and the series contact resistance will increase. Al-Si contacts on the annealing condition are studied. The propreties of the contacts depend considerably on the annealing procedures. Barrier height is measured from Capacitance-Voltage characteristics. The specific contact resistance are analyzed using a modified four point method.

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반도체 패키지의 칩셋과 다른 설계변수와의 연관성 평가 (Estimate on related to Chip Set and the other Various Parameter in Electronic Plastic Package)

  • 권용수
    • 한국산업융합학회 논문집
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    • 제2권2호
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    • pp.131-137
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    • 1999
  • Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

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전문가시스템을 기반으로 한 통합기계상태진단 알고리즘의 구현(I) (Implementation of an Integrated Machine Condition Monitoring Algorithm Based on an Expert System)

  • 장래혁;윤의성;공호성;최동훈
    • Tribology and Lubricants
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    • 제18권2호
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    • pp.117-126
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    • 2002
  • Abstract - An integrated condition monitoring algorithm based on an expert system was implemented in this work in order to monitor effectively the machine conditions. The knowledge base was consisted of numeric data which meant the posterior probability of each measurement parameter for the representative machine failures. Also the inference engine was constructed as a series of statistical process, where the probable machine fault was inferred by a mapping technology of pattern recognition. The proposed algorithm was, through the user interface, applied for an air compressor system where the temperature, vibration and wear properties were measured simultaneously. The result of the case study was found fairly satisfactory in the diagnosis of the machine condition since the predicted result was well correlated to the machine fault occurred.

MBE에 의한 다양자 우물제작 및 특성연구(공명투과 다이오드의 제작과 전기적 특 성) (Growth and Characterization of the Multi Quantum Wells by MBE(The Growth and Electrical Properties of Resonant Tunneling Structures))

  • 김순구;강태원;홍치유;정관수;주영도
    • 한국진공학회지
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    • 제1권1호
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    • pp.134-138
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    • 1992
  • GaAs/AlAs 이중장벽 구조를 MBE(Molecular Beam Epitaxy)법으로 성장하여, mesa diode를 제작하고 전류전압 특성을 측정하였다. 계면은 평탄한 이중장벽 구조로 성장 되었음이 확인되었으며, 실온에서 장벽의 두께가 변화함에 따라 PVCR(Peak to Valley Current Ratio)의 값은 크게 변하지 않았다. 이는 장벽의 두께가 증가함에 따라 nonresonant tunneling에 의한 valley current가 크게 증가함에 기인한다.

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비행 중 회항 시도 항공기의 비행자료 분석 (The analysis of flight data of aircraft with carry diversion into execution in -flight)

  • 이경철;이종희;송병흠;신대원
    • 한국항공운항학회지
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    • 제11권1호
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    • pp.67-80
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    • 2003
  • This study is performed to secure the safety of civil aviation by establishing systematic analysis ability of Flight Data Recorder. Through this study, downloading SSFDR(Solid State Flight Data Recorder) to personal computer, editing interface file, flight data numerical analysis and regulations relayed to the aircraft with carry diversion into execution are performed. In the analysis, the flight data of B747-400 model aircraft between Jeju(RKPC) and Gimpo(RKSS) was selected.

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