• Title/Summary/Keyword: Interface material

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금속/copper(II)-phthalocyanine interface에서의 space charge 연구 (Study of space charge of metal/copper(II)-phthalocyanine interface)

  • 박미화;임은주;유현준;이기진;차덕준;이용산
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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    • pp.526-530
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    • 2004
  • We report the space charge and the surface potential of the interface between metal and CuPc according to isotropic property and different metal by measuring the microwave reflection coefficients $S_{11}$ of copper(II)-phthalocyanine(CuPc) thin films by using a near-field microwave microscope(NSMM) in order to understand. CuPc thin films were prepared on gold and aluminium substrates using a thermal evaporation method. Two kinds of CuPc thin films were prepared. One was deposited on preheated substrate at $150^{\circ}C$ and the other was annealed after deposition by using thermal evaporation methods. The microwave reflection coefficients $S_{11}$ of CuPc thin films were changed by the dependence on the heat treatment conditions. By comparing reflection coefficient $S_{11}$ we measured electrical conductivity of CuPc thin films and studied this results with respect to the surface potential and space charge of the interface between metal and CuPc thin films.

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이종재료의 진전 계면 균열에 대한 동적 광탄성 실험법 (Dynamic Photoelastic Experimental Method for Propagating Interfacial Crack of Bimaterials)

  • 신동철;황재석
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 추계학술대회논문집A
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    • pp.292-297
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    • 2000
  • In this research, the dynamic photoelastic experimental hybrid method for bimaterial is introduced. Dynamic biaxial loading device is developed, its strain rate is 31.637 s-1 and its maximum impact load is 20 ton. Manufactured methods for model of the dynamic photoelastic experiment for bimaterial are suggested. They are bonding method(bonding material: AW106, PC-1) and molding method. In the bonding method, residual stress is not occurred in the manufactured bimaterial. Crack is propagated along the interface or sometimes deviated from the interface. While in the molding method, residual stress is occurred in the manufactured bimaterial. Crack is always deviated from the interface and propagated in the epoxy region(softer materila). In order to propagate with constant velocity along the interface of bimaterial with arbitrary stiffer material, edge crack should be located along the interface of the acute angle side of the softer material in the bimaterial.

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Epoxy/EPDM 거시계면의 최적조건과 V-t 특성 (Optimal Pressure Condition and V-t Characteristic of Macro Interface between Epoxy and EPDM)

  • 박우현;이동규;이상극;안준호;김충혁;이기식
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집
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    • pp.439-442
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    • 2002
  • The interface between two different materials in the insulation systems is the weak-link in the underground power transmission systems, In this paper, Optimum conditions of the interface between Epoxy and EPDM is studied. The variation factor condition of interface is roughness of surface, spreading of oils, interfacial pressure and temperature. The breakdown times under the constant voltage below the breakdown voltage were also gained. The breakdown voltage at the after laying time equivalent to is calculated by the V-t characteristic and the inverse power law. When this is done, the characteristic life exponent n is used and the long time breakdown voltage can be evaluated.

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계면공학에 기초한 우르차이트 결정의 극성 조절 (Polarity Control of Wurtzite Crystal by Interface Engineering)

  • 홍순구;쓰즈키 타쿠마;미네기쉬 쯔토무;조명환;야오 타카푸미
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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    • pp.95-96
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    • 2005
  • The general method and mechanism for the polarity control of heteroepitaxial wurtzite films, such as ZnO and GaN, by interface engineering via plasma-assisted molecular beam epitaxy are addressed. We proposed the principle and method controlling the crystal polarity of ZnO on GaN and GaN on ZnO. The crystal polarity of the lower film was maintained by forming a heterointerfce without any interface layer between the upper and the lower layers. However the crystal polarity could be changed by forming the heterointerface with the interface layer having an inversion center. The principle and method suggested here give us a promising tool to fabricate polarity inverted heterostructures, which applicable to invent novel heterostructures and devices.

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Charge Pumping 기술을 응용한 열화된 SONOSFET 비휘발성 기억소자의 Si-SiO$_2$ 계면트랩에 관한 연구 (A Study on the Si-SiO$_2$Interface Traps of the Degraded SONOSFET Nonveolatile Memories with the Charge Pumping Techniques)

  • 김주열;김선주;이성배;이상배;서광열
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1994년도 추계학술대회 논문집
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    • pp.59-64
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    • 1994
  • The Si-SiO$_2$interface trpas of the degraded short-channel SONOSFET memory devices were investigated using the charge pumping techniques. The degradation of devices with write/erase cycle appeared as the increase of the Si-SiO$_2$interface trap density. In order to determine the capture cross-section of the interface trap. I$\_$CP/-V$\_$GL/ characteristic curves were measured at different temperatures. Also, the spatial distributions of Si-SiO$_2$interface trap were examined by the variable-reverse bias boltage method.

온도에 따른 케이블 직선 접속재 모델링 EPOXY/EPDM 계면의 파괴 특성에 관한 연구 (A study on analysis of interfacial breakdown properties with variable temperalure in straight cable Joint modeling EPGXY/EPOM interface)

  • 배덕권;정인재;김상걸;정일형;이준웅
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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    • pp.532-535
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    • 1999
  • In power cable joints, the interfaces of two different dielectric materials are inevitable. In addition, the interfacial breakdown between two internal dielectric surfaces represents one of the major causes of failure for power cable joints. We chose epoxy/EPDM interface, one of the interface in cable joints, and investigate dielectric interfacial breakdown phenomenon. First, design specimen with Flux 2D. Second, find interface condition which has high dielectric strength. Third, investigate interfacial breakdown properties with variable temperature.

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O-3형 PZT-폴리머 복합체 제조시 압전 복합체내의 경계 기공이 유전, 압전 특성에 미치는 영향 (Effect of Interface Porosity on the Dielectric and Piezoelectric Properties of 0-3 Type-Polymer Composites)

  • 이형규;천재일;김호기
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1988년도 추계학술대회 논문집
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    • pp.21-26
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    • 1988
  • Composition with O-3 connectivity were fabricated from PZT and phenolic resin powders. These composites were investigated for dielectric and pizoelectric properties with PZT-polymer interface porosity variation. The interface porosity dependence of dielectric and piezoelectric properties was especially discussed by porosity factors. The interface porosity dependence of piezoelectric constant was larger than that of dielectric constant. It was considered that the interface pore plays the role of a stress buffer. Thus the local stress applied on PZT particles in the composite was remarkably diminish.

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V-t 특성 분석에 의한 고체 거시계면의 수명 평가 (Prediction of Life-Time on the Macroscopic Interface between Solid Materials with Analysis of V-t Characteristics)

  • 오재한;이경섭;배덕권;김충혁;이준웅
    • 한국전기전자재료학회논문지
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    • 제13권7호
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    • pp.607-611
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    • 2000
  • The characteristics on the interface between Epoxy and EPDM which are materials of the underground insulation systems of power delivery have studied. The breakdown strength of specimens are observed by applying high AC voltage at the room temperature. The breakdown times under the constant voltage below the breakdown voltage were gained. As constant voltage is applied the breakdown time is proportion to the breakdown strength. The life exponent n is gained by inverse power law and the long breakdown life time can be evaluated. AC breakdown strength and life time is improved by oiling to the interface. When the low viscosity oil is spread interface has the highest life time.

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초박막 Si oxynitride의 스트레스에 의한 계면 열화 메커니즘 (Mechanism for stress-induced interface degradations in ultrathin Si oxynitrides)

  • 이은철
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 추계학술대회 논문집
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    • pp.93-93
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    • 2007
  • We present a mechanism for stress-induced interface degrdadations through ab initio pseudopotential calculations. We find that N interstitials at the interface create various defects levels in the Si band gap, which range from the mid gap to the conduction band of Si. The level positions are dependent on the configuration of oxygen toms around the N interstitial. On the other hand, the mid-gap level caused by Pb center is possibly removed by substitution of a N atom for a threefold-coordinated Si atom in the defect. Our calculations explain why interface state generations are enhanced in Si oxynitride, especially near conduction band edge of Si, although densities of Pb center are reduced.

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압자압입시험에 의한 이종재료 접합층의 계면인성 평가 (Evaluation of Apparent Interface Toughness of Composites Layers by Indentation Test)

  • 송준희;김학근;임재규
    • 대한기계학회논문집A
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    • 제26권10호
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    • pp.2089-2095
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    • 2002
  • Ceramic/metal composites have many attractive properties and great potential fur applications. Interfacial fracture properties of different layered composites are important in material integrity. Therefore, evaluation of fracture toughness at interface is required in essence. In this study, the mechanical characteristics for interface of ceramic/metal composites were investigated by indentation test of micro-hardness method. Apparent interfacial toughness of TBC system could be determined with a relation between the applied load and the length of the crack formed at the interface by indentation test.