• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.3
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• pp.423-429
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• 1997

A simplified method for determining the mode components of the strain energy release rate of free-edge delaminations in laminated composite is proposed. The interlaminar stresses are evaluated as an interface moment and interface shear forces that are obtained from the equilibrium equations at the interface between the adjacent layers. Deformation of an edge-delaminated laminate is calculated by using a generalized quasi-three dimensional classical laminated plate theory developed by the authors. The analysis provides closed-form expression for the three components of the strain energy release rate. Comparison of results with a finite element solution using the virtual crack closure technique shows good agreement. In the present study, laminated composite with stacking sequences of [30/-30/90]$_{s}$ were examined. The simple nature of the method makes it suitable for primary design analysis for the delaminations of laminated composite.e.

• Structural Engineering and Mechanics
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• v.3 no.4
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• pp.383-390
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• 1995

A 2-D four-noded finite element which contains a ${\lambda}$ singularity is developed. The new element is compatible with quadratic standard isoparametric elements. The element is tested on two different examples. In the first example, an edge crack problem is analyzed using two different meshes and different integration orders. The second example is a crack perpendicular to the interface problem which is solved for different material properties and in turn different singularity order ${\lambda}$. The results of those examples illustrate the efficiency of the proposed element.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.4
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• pp.401-409
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• 2009

This paper presents a method of calculating the stress intensity factor (K) and crack propagation direction (${\theta}_0$) at the crack-tip that is associated with delamination in the large scale integration(LSI) package. To establish a reasonable strength evaluation method and life prediction, it is necessary to assess fracture parameters under various fracture conditions. Therefore, we conducted quantitative stress singularity analysis considering thermal stress simulating the changes of crack length (a), (h) and (v) in delamination using the 2-dimensional elastic boundary element method (BEM), and from these results predicted crack propagation direction and path.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.286-291
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• 2001

Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

• Journal of Mechanical Science and Technology
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• v.16 no.1
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• pp.39-45
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• 2002

Initiation and propagation of interfacial crack along bimaterial interface are considered in this study. A biaxial loading device for a single specimen is used for obtaining a wide range of mode-mixities. The specimen is an edge-cracked bimaterial strip of glass and epoxy; the biaxial loading device, being capable of controlling displacements in two perpendicular directions, is developed. A series of interfacial crack initiation and Propagation experiments are conducted using the biaxial loading device for various mixed modes. Normal crack opening displacement (NCOD) is measured near crack front by a crack opening interferometry and used for extracting fracture parameters. From mixed mode interfacial crack initiation experiments, large increase in toughness with shear components is observed. The behavior of interfacial crack propagation analyzed as a function of mode-mix shows that initial crack propagation is delayed with increase of mode-mixity, and its velocity is increased with positive mode-mixity but decreased with negative case. However, it is found that crack propagation is less accelerated with positive mode-mixity than the negative mode-mixity, which may be caused by contact and/or effects of friction between far field and near-tip Held along the interfacial crack.

• Structural Engineering and Mechanics
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• v.86 no.4
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• pp.535-546
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• 2023

In the present paper, multiple interface cracks between a functionally graded orthotropic coating and an orthotropic half-plane substrate under concentrated loading are considered by means of the distribution dislocation technique (DDT). With the use of integration of Fourier transform the problem is reduced to a system of Cauchy-type singular integral equations which are solved numerically to compute the dislocation density on the surfaces of the cracks. The distribution dislocation is a powerful method to calculate accurate solutions to plane crack problems, especially this method is very good to find SIFs for multiple unequal cracks located at the interface. Hence this technique allows considering any number of interface cracks. The primary objective of this paper is to investigate the effects of the interaction of multiple interface cracks, load location, material orthotropy, nonhomogeneity parameters and geometry parameters on the modes I and II SIFs. Numerical results show that modes I/II SIFs decrease with increasing the nonhomogeneity parameter and the highest magnitude of SIF occurs where distances between the load location and crack tips are minimal.

• Transactions of the Korean Society of Automotive Engineers
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• v.1 no.2
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• pp.117-124
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• 1993

This study is concerned with an application of the boundary element method on the crack problem. The stable and efficient analysis method of two dimensional elastostatic stress intensity factor on the mode I deformations is established from the result o stress analysis for the center cracked plates. In order to precisely analyse, The subelements of quadratic element, singular elements on the crack tip and interface and division into regions are applied to elastic stress. The usefulness of the method has been tested with a center cracked plates, a double edge cracked plate and a single edge cracked plate, and the results have turned out to be fairly satisfactory.

• Transactions of the Korean Society of Mechanical Engineers
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• v.11 no.6
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• pp.884-894
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• 1987

Stress intensity factors for the bimaterial interface cracks are determined by the boundary element method employing the multiregion technique along with the double-point concept. For this purpose, the formulas relating the stress intensity factors to the crack surface displacements, which are applicable to both the homogeneous and the bimaterial systems, are derived and the accuracy of the results is discussed using the preexisting analytic solutions. Besides, the stress intensity factors for the edge-cracked bimaterial plates are computed with various crack lengths and shear modulus ratios under the biaxial and the uniaxial loadings, respectively, to demonstrate the dependence of stress intensity factors on the loading conditions and the material properties.

• Journal of the Korean Society of Industry Convergence
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• v.2 no.2
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• pp.131-137
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• 1999

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.31-35
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• 2000

The stress state developed in a thin adhesive layer bonded between the semiconductor chip and the leadframe and subjected to a shear loading is investigated. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. Within the context of a linear elastic theory, a stress singularity of type $\gamma^{\lambda=1}$(0<1<1) exists at the point where the interface between one of the rigid adherends and the adhesive layer intersects the free surface. Such singularity might lead to edge crack or delamination.