• Journal of Environmental Science International
• /
• v.17 no.3
• /
• pp.305-314
• /
• 2008

As forest land takes up 65% of the Korean peninsula, there have been continuing conflicts between the development and conservation of forest land. As the income level has changed over time, the usage of forest land in society has changed. There has been increasing demands for forest land for urban development and recreational use. On the other hand, a large proportion of the land is required to be preserved for the forest and the natural ecosystem in it. The existing management system for the forest land has been designed focusing on the management of the trees on the land, and not the land itself. Due to this limitation, the current management system of forest land has failed to protect the forest land from being developed indiscreetly, making it difficult to conserve and develop the forest land in an efficient way. A major question in forest land management is how to integrate economic use activities with the supporting ecosystems to maximize performance of the ecological-economic system. In order to promote sustainable use of forest resources, and to achieve efficient forest land management, it is prerequisite to evaluation on forest resources of natural ecosystems. Quantitative measures are needed that signify how necessary the services and products of forested ecosystems are to human endeavors. In this study, the natural wealth provided by forest land was quantified based on emergy synthesis. Emergy is a universal measure of real wealth of the work of nature and society made on a common basis. Thus, Calculations of emergy provide a basis for making choices about environment and economy following the general public policy to maximize real wealth. The goals of forest land management to achieve balance between the ecology and economy of its integrated system and to foster equity among the diverse outcomes of the forest land were assessed with emergy. Emergy was demonstrated to holistically integrated and quantify the interconnections of a coupled nature-human system allowing the goals of ecological balance and outcome equity to be measured quantitatively. Doing so will provide a better understanding of the basis of forest land wealth and the consequences of management decisions.

• Economic and Environmental Geology
• /
• v.39 no.5 s.180
• /
• pp.525-535
• /
• 2006

A study on stream-groundwater exchange was performed using head and temperature data of stream water, streambed, and groundwater. Groundwater level and temperature were obtained from multi-depth monitoring wells in small-scale watershed. During the summer and winter season, time series of temperature data at streambed and groundwater were monitored for six months. In the winter time, we measured the temperature gradient between stream water and streambed. The observed data showed three typical types of temperature characteristics. First, the temperature of streambed was lower than that of stream water; second, the temperature of streambed and stream water was similar; and the last, the temperature of streambed was higher than that of stream water. The interconnections between the stream and the streambed were not homogeneously distributed due to weakly developed sediments and heterogeneous bedrock exposed as bed of the stream. The temperature data may be used in formal solutions of the inverse problems to estimate groundwater flow and hydraulic conductivity.

• Journal of Internet Computing and Services
• /
• v.14 no.4
• /
• pp.35-42
• /
• 2013

Nowadays many tasks are performed using the Web. Accordingly, many web-based application systems with various and complicated functions are being requested. In order to develop such web-based application systems efficiently, object-oriented analysis and design methodology is used, and Java EE(Java Platform, Enterprise Edition) technologies are used for its implementation. The security issues have become increasingly important. For such reasons, Java EE provides mechanism related to security but it does not provide interconnections with object-oriented analysis and design methodology for developing web application system. Consequently, since the security method by Java EE mechanism is implemented at the last step only, it is difficult to apply constant security during the whole process of system development from the requirement analysis to implementation. Therefore, this paper suggests an object-oriented analysis and design methodology emphasized in the security for secure web application systems from the requirement analysis to implementation. The object-oriented analysis and design methodology adopts UMLsec, the modeling language with an emphasis on security for the requirement analysis and system analysis & design with regard to security. And for its implementation, RBAC (Role Based Access Control) of servlet from Java EE technologies is used. Also, the object-oriented analysis and design methodology for the secure web application is applied to online banking system in order to prove its effectiveness.

• Proceedings of the KWS Conference
• /
• 2010.05a
• /
• pp.80-80
• /
• 2010

전자제품의 소형화, 경량화, 고집적화가 심화됨에 따라 전자제품을 구성하는 회로의 미세화 또한 요구되고 있다. 이러한 요구는 경성회로기판 (rigid printed circuit board, RPCB) 뿐만 아니라 연성회로기판 (flexible printed circuit board, FPCB) 에도 적용되고 있으며 이에 대한 많은 연구 또한 이루어지고 있다. 연성회로기판은 일반적으로 절연층을 이루는 폴리이미드 (polyimide, PI)와 전도층을 이루는 구리로 이루어져 있다. 폴리이미드는 뛰어난 열적 화학적 안정성, 우수한 기계적 특성, 연속공정이 가능한 장점을 가지고 있으나, 고온다습한 환경하에서 높은 흡습성으로 인해 전도층을 이루는 구리와의 접합특성이 저하되는 단점 또한 가지고 있다. 또한 전도층을 이루는 구리는 고온다습한 환경하에서 산화 발생이 용이하기 때문에 접합특성의 감소를 야기할 수 있다. 따라서 본 연구에서는 고온다습한 조건하에서 sputtering and plating 공정을 통해 순수 Cr seed layer를 가지는 연성회로기판의 seed layer의 두께와 시효시간의 변화로 인해 발생하는 접합특성의 변화를 관찰하고 분석하였다. 본 연구에서는 두께 $25{\mu}m$의 일본 Kadena사(社)에서 제작된 폴리이미드 상에 sputtering 공정을 통해 순수 Cr으로 이루어진 각각 두께 100, 200, $300{\AA}$의 seed layer를 형성한 후 전해도금법을 이용, 두께 $8{\mu}m$의 구리 전도층을 형성한 시료를 사용하였다. 제작된 시료는 고온다습한 환경하에서의 접합 특성의 변화를 관찰하기 위하여 $85^{\circ}C$/85%RH 항온항습 조건하에서 각각 24, 72, 120, 168시간 동안 시효처리 한 후, Interconnections Packaging Circuitry (IPC) 규격에 의거하여 접합강도를 측정하였다. 시료의 전도층은 폭 3.2mm 길이 230mm의 패턴을 가지도록, 절연층은 폭 10mm, 길이 230mm으로 구성되었으며 이를 50.8mm/min의 박리 속도로 각 시편당 8회의 $90^{\circ}$ peel test를 실시하였다. 파면의 형상과 화학적 조성을 분석하기 위해 SEM (Scanning electron microscope)과 EDS (Energy-dispersive X-ray spectroscopy)를 사용하였으며, 파면의 조도 측정을 위해 AFM (Atomic force microscope)을 사용하였다. 또한 계면의 화학적 결합상태를 분석하기 위해 XPS (X-ray photoelectron spectroscopy)를 통해 파면을 관찰 분석하였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.3
• /
• pp.17-26
• /
• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

• Korean Journal of Veterinary Service
• /
• v.39 no.3
• /
• pp.187-192
• /
• 2016

Diarrhea is reported as one of the most common diseases in calves. It is thought to be a major cause of productivity and economic loss to cattle producers. The aim of this study is to provide a better understanding of well-known diarrheagenic pathogens and incidence of diarrhea in Korean calves. In this study, the relationship of calf diarrhea and pathogens were investigated from calves under 60 days of age in five areas of Korea from April to July, 2016. Of examined fecal samples, 38.3% was positive for any pathogens, and Giardia was the most common pathogen (25.5%). The incidence of diarrhea was 31% from pathogen-negative fecal samples whereas 61.1% from pathogen-positive fecal samples, suggesting high correlation between pathogenic factor and diarrhea. In addition, 80% of E. coli (K99) positive calves showed diarrhea, suggesting E. coli (K99) could be highly pathogenic. The incidence of diarrhea and infection rate increased with age. Rotavirus was revealed as a major pathogen in calves under 20 days of age, and the infection rate of Giardia increased rapidly in calves 20 to 39 days of age. The information on interconnections between clinical diarrhea and pathogens would contribute to developing strategies for treatment of calf diarrhea.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.377-377
• /
• 2012

Microprocessor technology now relies on copper for most of its electrical interconnections. Because of the high diffusivity of copper, Atomic layer deposition (ALD) $TaN_x$ is used as a diffusion barrier to prevent copper diffusion into the Si or $SiO_2$. Another problem with copper is that it has weak adhesion to most materials. Strong adhesion to copper is an essential characteristic for the new barrier layer because copper films prepared by electroplating peel off easily in the damascene process. Thus adhesion-enhancing layer of cobalt is placed between the $TaN_x$ and the copper. Because, cobalt has strong adhesion to the copper layer and possible seedless electro-plating of copper. Until now, metal film has generally been deposited by physical vapor deposition. However, one draw-back of this method is poor step coverage in applications of ultralarge-scale integration metallization technology. Metal organic chemical vapor deposition (MOCVD) is a good approach to address this problem. In addition, the MOCVD method has several advantages, such as conformal coverage, uniform deposition over large substrate areas and less substrate damage. For this reasons, cobalt films have been studied using MOCVD and various metal-organic precursors. In this study, we used $C_{12}H_{10}O_6(Co)_2$ (dicobalt hexacarbonyl tert-butylacetylene, CCTBA) as a cobalt precursor because of its high vapor pressure and volatility, a liquid state and its excellent thermal stability under normal conditions. Furthermore, the cobalt film was also deposited at various $H_2/NH_3$ gas ratio(1, 1:1,2,6,8) producing pure cobalt thin films with excellent conformality. Compared to MOCVD cobalt using $H_2$ gas as a reactant, the cobalt thin film deposited by MOCVD using $H_2$ with $NH_3$ showed a low roughness, a low resistivity, and a low carbon impurity. It was found that Co/$TaN_x$ film can achieve a low resistivity of $90{\mu}{\Omega}-cm$, a low root-mean-square roughness of 0.97 nm at a growth temperature of $150^{\circ}C$ and a low carbon impurity of 4~6% carbon concentration.

• Journal of Educational Research in Mathematics
• /
• v.22 no.3
• /
• pp.429-444
• /
• 2012

As one of the trials for a systematic approach to mathematics terms which occupies an important place in teaching and learning mathematics, compositions of listed terms in 2011 elementary mathematics curriculum in Korea are discussed in this study. To this end, listed terms are classified in view of three points and looked for their characteristics, from which implications are found out for elementary mathematics teaching and learning First of all classifications into grade-group and domain-specific terms, then into newly coined terms and terms from everyday life, and then into korean terms and chinese character terms and english terms are attempted. Next, terms with a kernel and terms without a kernel are distinguished, and in this process, term-sets are presented. Finally, object terms, operation terms, relationship terms, measure terms, conditions terms, graphics terms, name terms are classified. Based on these results, the following implications for elementary mathematics teaching and learning are suggested. First, it should be considered that many of the listed terms in 2011 curriculum are newly coined and chinese character terms. Second, the interconnections between terms should be considered. Third, a variety of roles and functions of the terms should be considered.

• Korean journal of communication and information
• /
• v.33
• /
• pp.53-86
• /
• 2006

This paper presents comparative analysis of the traits of personal network structure shaping in local press organizations of Korea. For this analysis, this study attempts to investigate three topics. First, the density traits of personal network structure in the whole of local press organization. Second, the comparison of density trait shaping in personal network structure between press section of local broadcasting stations and local newspaper companies. Third, the positional trait in each local press organization. To answer the questions, the data concerning commissioners and executive members in local daily newspapers and local broadcasting organizations from the Civic Government to the People's Government have been collected and analyzed. The interconnections of regional(birthplace) and educational(university graduated) aspect were analyzed via methods of cross analysis, density analysis and correspondence analysis. In brief, major findings of this study are as follows ; As a result of analyzing cross analysis and density analysis of the personal network based of regional and educational aspect, the numerical value of density was too high on the whole of local press organizations. But, especially local newspaper companies has been showed that was higher density compared with press section of local broadcasting stations. And, positional distance between local press organizations were showed obviously in the case of regional(birthplace) aspect. But, in case of educational aspect, positional distance were showed obviously between commissioners and executive members.

• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.3
• /
• pp.37-42
• /
• 2001

The concerns of the toxicity and health hazard of lead in solders have demanded the research to find suitable lead-free solder alloys. It was discussed that effect of the intermetallic formation and structure on the reliability of solder joints. In this study, lead-free solder alloys with compositions of Sn/3.5Ag/0.75Cu, Sn/2.0Ag/0.5Cu/2.0Bi were applied to the 48 $\mu$BGA packages. Also, the lead-free solder alloys compared with eutectic Sn/37Pb solder using shear test under various aging temperature. Common $\mu$BGA with solder components was aged at $130^{\circ}C$, $150^{\circ}C$ and $170^{\circ}C$. And the each temperature applied to 300, 600 and 900 hours. The thickness of the intermetallics was measured for each condition and the activation energy for their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS (Energy Dispersive Spectroscopy). These results for reliability of lead-free interconnections are discussed.