• 한국전자통신학회논문지
• /
• 제4권4호
• /
• pp.259-264
• /
• 2009

전자상거래시스템은 다양한 상거래 프로세스를 통합적으로 지원하기 위한 방향으로 발전하고 있다. 본 논문에서는 전자상거래 프로세스를 통합하는 방법에 대하여 제안하고 그러한 방법의 타당성을 확인하고자 노력하였다. 서로 다른 프로세스를 통합할 때에는 프로세스를 공통의 형식으로 표현하는 방법뿐만 아니라, 프로세스 상호간의 미치는 프로세스 전파(Process Propagation)에 대해서도 고려해야 하지만 본 논문에서는 논의 대상에서 제외하였다.

• 한국정밀공학회지
• /
• 제12권3호
• /
• pp.32-41
• /
• 1995

In the analysis of metal forming processes by the finite element method, there are many numerical instabilities such as element locking, hourglass mode and shear locking. These instabilities may have a bad effect upon accuracy and convergence. The present work is concerned with improvement of stability and efficiency in two-dimensional rigid-plastic finite element method using various type of elemenmts and numerical intergration schemes. As metal forming examples, upsetting and backward extrusion are taken for comparison among the methods: various element types and numerical integration schemes. Comparison is made in terms of stability and efficiency in element behavior and computational efficiency and a new scheme of adaptive directional reduced integration is introduced. As a result, the finite element computation has been stabilized from the viewpoint of computational time, convergency, and numerical instability.

• 한국경영과학회:학술대회논문집
• /
• 한국경영과학회 2005년도 추계학술대회 및 정기총회
• /
• pp.182-185
• /
• 2005

To survive in rapidly changing business environment, the enterprise should adapt its business process to the changing environment. The system integration is an important issue to tackle this challenge. It is unavoidable direction that SOA (Service Oriented Architecture) is accepted as an upcoming IT standard to support flexible business processes and integration. In this paper, SOA is introduced, and the Web services and ESB (Enterprise Service Bus) ate also introduced as a foundation technology to implement SOA-enabled solutions. The pilot project, which is introduced in this paper, will be a good reference for future SOA implementation.

• 시스템엔지니어링학술지
• /
• 제9권2호
• /
• pp.69-82
• /
• 2013

US DoD operated JCIDS(Joint Capability Integration and Development System) for top down requirement generation. Although the JCIDS can be a good practice for the countries which are trying to shift from bottom up to top down requirement generation, it contains many processes related with review and approval. In this study we structured a joint capability integration and development process from the JCIDS eliminating the organization dependent review or approval process so that it can be applied to any organization with some modification. Furthermore we implemented the process in the computer aided systems engineering tool, Cradle, for convenient use of the process. The result of this study can provide a basic process for top down capability development, and an efficient why of doing each element of the process using CASE tool.

• 국제학술발표논문집
• /
• The 1th International Conference on Construction Engineering and Project Management
• /
• pp.497-502
• /
• 2005

Needs of automation and computerization in the construction industry has been recognized but the implementation of e-business solutions with project management systems has not been fully explored. In order to cope with different management practices in home office and project sites, integration of two popular systems, Enterprise Resource Planning (ERP) and Project Management System (PMS) is essential. The objective of this study is to find ways to functionally and systematically integrate ERP and PMS. With the integration of ERP and PMS, a project will be managed much more efficiently and effectively. It is expected that this study will benefit system integrators and help them to understand construction management processes and integrate the solutions with minimized programming work.

• 대한기계학회논문집A
• /
• 제24권6호
• /
• pp.1499-1512
• /
• 2000

The dynamic explicit finite element method and the static implicit finite element method are applied effectively to analyze total auto-body panel stamping processes, which include the forming stage , the trimming stage and the spring-back stage.\The explicit time integration method has better merits in the forming stage including highly complicated three-dimensional contact conditions. On the contrary, the implicit time integration method is better for analyzing spring-back since the complicated contact conditions are removed and the computing time to get the final static state is short. In this work, brief descriptions of the formulation and the factor study are presented. Further, the simulated results for the total auto-body panel stamping processes are shown and discussed. The formability and the weld line movement in stamping with Tailor Welded Blanks were investigated through QTR-OTR-FRT.

• 대한산업공학회지
• /
• 제41권6호
• /
• pp.579-587
• /
• 2015

Semiconductor manufacturing industry is a high density integration industry because it generates a vest number of data that takes about 300~400 processes that is supervised by numerous production parameters. It is asked of engineers to understand the correlation between different stages of the manufacturing process which is crucial in reducing production costs. With complex manufacturing processes, and defect processing time being the main cause. In the past, it was possible to grasp the corelation among manufacturing process stages through the engineer's domain knowledge. However, It is impossible to understand the corelation among manufacturing processes nowadays due to high density integration in current semiconductor manufacturing. in this paper we propose a canonical correlation analysis (CCA) using both wafer test voltage variables and fail bit counts variables. using the method we suggested, we can increase the semiconductor yield which is the result of the package test.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
• /
• pp.62-65
• /
• 2007

Conventional semiconductor processes have been utilized to fabricate 3.5-inch OTFT-driven OLEDs with a resolution of $176\;{\times}\;144$ pixels on plastic substrates. By using a PC-OVD method to deposit a pentacene layer and optimizing patterning and the following processes, we could complete a uniform and reliable integration procedure for an active matrix organic light emitting devices on a plastic substrate. The technical importance of ours is the applicability of conventional semiconductor process to organic materials on plastic substrates. Although there are many hurdles to overcome, our approach and technical improvements are proved to be applicable to plastic electronics.

• 한국전자거래학회:학술대회논문집
• /
• 한국전자거래학회 2001년도 e-Biz World Conference
• /
• pp.545-560
• /
• 2001

Agenda ■ Modeling S/W Components ■ Methods of how to implement a Component ■ History of Web Computing ■ e-Biz. frame wok using EJB ■ Legacy Integration Modeling S/W Components ■ Simple components ■ Component assembly-plugging ■ Processes ＆ Methodologies. (omitted)

• 한국수자원학회:학술대회논문집
• /
• 한국수자원학회 2005년도 학술발표회(2)
• /
• pp.1279-1280
• /
• 2005