• Journal of KIISE:Computer Systems and Theory
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• v.34 no.8
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• pp.348-366
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• 2007

Capacity of modem storage devices is becoming larger than yesterday and integration of disk is increasing. It refers that physical errors can damage a lot of digital information on storage devices. So we propose file system test framework in this paper to test integrity and robustness of file systems. We develop the tool for generating bad sectors on disks and the tool which creates all physical errors defined in storage devices. We also develop the tool for immediately monitoring the condition of read and write execution on storage devices. So, by integrating those tools, we develop FORT, test framework for confirming robustness of file system. We analyze robustness of ext3 file systems by FORT. Lastly, we present draft of intelligent system merging file system and device driver's layer architecture.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.6
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• pp.1202-1210
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• 2005

For the efficient and safe navigation management of ships cruising across oceans, international maritime law environments have been reinforced and the demand of information sharing between ships and shore has also been increasing. According to these environments and demand. researches about digital ships, ship integration, and ship integration networks have been active recently in US and Europe. In this raper, we first investigate about the proper ship integration platform, and then design and implement a ship integration network based upon the ship integration platform. We construct networks connecting various devices and systems into a layered architecture, and design an integration protocols. Based upon this architecture and protocols, we implement an ship integration system which manages all data and information of ship in a standardized platform and support ship-shore information sharing through which the more efficient and safer ship navigation management are supported with help from shore. We test our ship integration system by applying it to real operating ships and we find our system reliability and verify the efficiency of ship-shore information sharing and management.

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.4
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• pp.176-179
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• 2005

The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.

• Proceedings of the Korea Contents Association Conference
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• 2010.05a
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• pp.390-392
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• 2010

Mobile grid system supports the integration mobile devices as grid resources. Availability of mobile resources changes dynamically in mobile grid system. Stochastic reward nets (SRN) is an extension of stochastic Petri nets and provides compact modeling facilities for system analysis. We build the SRN model to represent availability of mobile resources with disconnected operation service.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.24 no.8
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• pp.101-108
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• 2010

In order to construct the IEC 61850 based substation automation system, the IED integration engineering tool is necessary to cope with the substation automation by full digital devices in the real power system. Compared the configuration tools provided IED vendors which are able to support the operation and communication analysis among IEDs, the XML based IED integration engineering tool can build, edit and save the ICD, SCL and CID files. Particularly, the IED integration engineering tool is possible to apply the IEC 61850 based IEDs to engineering the systems and also provides the reliability and efficiency of the system to the utilities and manufacturers.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.2
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• pp.51-57
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• 2013

The current expanding mobile markets incessantly demands small form factor, low power consumption and high aggregate throughput for silicon-level integration such as memory to logic system. One of emerging solution for meeting this high market demand is 3D through silicon stacking (TSS) technology. Main challenges to bring 3D TSS technology to the volume production level are establishing a cost effective supply chain and building a reliable manufacturing processes. In addition, this technology inherently help increase number of IOs and shorten interconnect length. With those benefits, however, potential signal and power integrity risks are also elevated; increase in PDN inductance, channel loss on substrate, crosstalk and parasitic capacitance. This paper will report recent progress of wide IO memory to high count TSV logic device assembly development work. 28 nm node TSV test vehicles were fabricated by the foundry and assembled. Successful integration of memory wide IO chip with less than a millimeter package thickness form factor was achieved. For this successful integration, we discussed potential signal and power integrity challenges. This report demonstrated functional wide IO memory to 28 nm logic device assembly using 3D package architecture with such a thin form factor.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2004.11a
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• pp.365-370
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• 2004

The integration of intelligent devices, devices-level networks, and software into motor control systems can deliver improved diagnostics, fast warnings for increased system reliability, design flexibility, and simplified wiring. Remote access to motor-control information also affords an opportunity for reduced exposure to hazardous voltage and improved personnel safety during startup and trouble-shooting. This paper presents LonWorks fieldbus networked intelligent induction control system architecture. Experimental bed system with two inverter motor driving system for controlling 1.5kW induction motor is configured for LonWorks networked intelligent motor control. In recent years, MCCs have evolved to include component technologies, such as variable-speed drives, solid-state starters, and electronic overload relays. Integration was accomplished through hardwiring to a programmable logic controller (PLC) or distributed control system (DCS). Devicelevel communication networks brought new possibilities for advanced monitoring, control and diagnostics. This LonWorks network offered the opportunity for greatly simplified wiring, eliminating the bundles of control interwiring and corresponding complex interwiring diagrams. An intelligent MCC connected in device level control network proves users with significant new information for preventing or minimizing downtime. This information includes warnings of abnormal operation, identification of trip causes, automated logging of events, and electronic documentation. In order to show the application of the multi-motors control system, the prototype control system is implemented. This paper is the first step to drive multi-motors with serial communication which can satisfy the real time operation using LonWorks network.

• Journal of Information Technology Services
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• v.11 no.3
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• pp.241-255
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• 2012

Recently, smart home environments which provide complex services through smart appliances are becoming realized, due to the advances in connected devices and network technologies. Current smart home environments are mostly restricted, because of difficultly of integration of heterogeneous smart appliances. Therefore radical service integration is impracticable. In this paper, we analyze and implement Machine-to-Machine (M2M) standards which are established by European Telecommunications Standards Institute (ETSI) for integrating heterogeneous devices and services. Smart Home is one of the areas covered by ETSI M2M standards, however these standards are just standardized, so adaption and assessment in smart home are not proved yet. Therefore, this paper analyze ETSI M2M standards by focusing the data transport model and evaluate by selecting the most commonly used smart home scenarios and by implementing ETSI M2M standards compatible smart metering system. In some points ETSI M2M standards are not efficient because of its complexity of structure, however ETSI M2M provides sophisticated features for integrating M2M which are appropriate to adopt diverse smart home environments.

• Proceedings of the KIEE Conference
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• 2002.07d
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• pp.2448-2450
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• 2002

In recent years, it has been a worldwide trend that many power utilities gave their attention to develop and operate their power plants, substation and distribution systems. Following this trend, KEPCO(Korea Electric Power Corporation) has developed many electric automation systems with various communication networks. It has been natural that the automation systems are just focused on to remote devices when they come to be designed. But, we have to shirt the focus to the automation system itself. There are many problems in maintenance and integration of the automation systems. When an automation system can't control some remote devices, there is no way to get why and which part(Master, Network, Master-side Modem or Remote-side modem, Remote Device, etc.) of the system has problems. Moreover the system just directly links to another automation system. If the system has to link many systems, it needs the linker per each systems. So, we need a new concept to resolve that problems, and develop the Intelligent and Integrated Gateway(IIG) for the automation systems for easy maintenance and integration.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.10.1-10.1
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• 2011

Energy harvesting technologies converting external sources (such as thermal energy, vibration and mechanical energy from the nature sources of wind, waves or animal movements) into electrical energy is recently a highly demanding issue in the materials science community for making sustainable green environments. In particular, fabrication of usable nanogenerator attract the attention of many researchers because it can scavenge even the biomechanical energy inside the human body (such as heart beat, blood flow, muscle stretching, or eye blinking) by converging harvesting technology with implantable bio-devices. Herein, we describe procedure suitable for generating and printing a lead-free microstructured $BaTiO_3$ thin film nanogenerator on plastic substrates to overcome limitations appeared in conventional flexible ferroelectric devices. Flexible $BaTiO_3$ thin film nanogenerator was fabricated and the piezoelectric properties and mechanically stability of ferroelectric devices were characterized. From the results, we demonstrate the highly efficient and stable performance of $BaTiO_3$ thin film nanogenerator and the integration of bio-eco-compatible ferroelectric materials may enable innovative opportunities for artificial skin and energy harvesting system.