• 한국지진공학회:학술대회논문집
• /
• 한국지진공학회 2002년도 춘계 학술발표회 논문집
• /
• pp.359-366
• /
• 2002

Direct Integration method(D.I) and Mode Superposition method(M.S) are used widely in dynamic analysis method for structure with isolation devices. D.I is used firstly because it is consider to nonlinearity of isolation device. M.S is applied in elastic region, but it is difficult to apply M.S because coincidence with othogonality condition in the case of adding the damping of isolation device. In this study, the method for calculation of damping ratio of isolated structure is proposed, and proposed method is verified with analysis for example structure.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2009년도 추계학술발표대회
• /
• pp.4.1-4.1
• /
• 2009

The dream of futurists andtechnologists is to build complex, multifunctional machines so small that theycan only be seen with the aid of a microscope. The unprecedented technologyadvancements in miniaturizing integrated circuits on semiconductors, and theresulting plethora of sophisticated, low cost electronic devices demonstratethe impact that micro/nano scale engineering can have when applied only to thearea of electrical and computer engineering. Emerging research efforts indeveloping organic and inorganic nano materials together with using micro/nanofabrication techniques for implementing integrated multifunctional devices hopeto yield similar revolutions in other engineering fields. By cross linking theindividual engineering fields through micro/nano technology, various organicand inorganic materials and miniaturized system devices can be developed thatwill have future impacts in the IT and life science applications. Yet to buildthe complex micromachines and nanomachine of the future, engineering will needto develop the technology capable of seamlessly integrating these materials andsubsystems together at the micro and nano scales. The micromachines of thefuture will be “integrated nanosystems,” complex devices requiring the integration of multiple materials,phenomena, technologies, and functions at the same platform. To develop thistechnology will require great efforts in materials science and engineering, infundamental and applied sciences. In this talk, we will first discuss thenature of micro and nanotechnology research for IT and life sciences, and thenintroduce selected current activities in micro and nanotechnology research fororganic and inorganic materials and devices. The newly developed micro/nanofabrication processes and devices, combined with in-depth scientificunderstandings of materials, can lead to rapid development of next generationsystems for applications in IT and life sciences.

• 패션비즈니스
• /
• 제17권6호
• /
• pp.60-75
• /
• 2013

This study examined the categories and contents of technology that is recently influencing the fashion design. For this, the cases of global companies integrating fashion design and technology were examined, and the types of technology integration studies within the field of fashion design were analyzed through the trend of fashion-technology integration in domestic academic circles released since 2000. According to the case of global companies integrating fashion design and technology, various companies and fashion brands have released fashion products that are integrated with technology, and such integrations are developing up to the field of fashion shows and displays in addition to fashion products. The analysis of studies related with fashion and technology in the design field showed that domestic studies on fashion-technology integration were manifested as the types that applied various technologies to the fashion design. Such types were categorized into the studies that applied light-emitting technology, studies that focused on the integration of interaction and textile design, studies that applied response-perception, studies that used attached electronic devices, and studies that used autogenic bacteria. The fashion has less negative impact on body and environment compared with other areas, and therefore, is the best area for the experiments in IT, bio, and electronics areas and for the integration of fashion and technology. Moreover, studies on fashion that suggest the capability in developing and industrializing cases through the collaboration with other fields such as IT, bio, and electronics shall continue.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제1권1호
• /
• pp.70-83
• /
• 2001

In this paper, the recent progress of RF MEMS research for wireless/mobile communications is reviewed. The RF MEMS components reviewed in this paper include RF MEMS switches, tunable capacitors, high Q inductors, and thin film bulk acoustic resonators (TFBARs) to become core components for constructing miniaturized on chip RF transceiver with multi-band and multi-mode operation. Specific applications are also discussed for each of these components with emphasis on for miniaturization, integration, and performance enhancement of existing and future wireless transceiver developments.

• 한국정밀공학회지
• /
• 제17권10호
• /
• pp.41-48
• /
• 2000

Manufacturing devices must be integrated for constructing CIM environment, but integration of heterogeneous system meets several economical and technological difficulties. In this case, MMS(Manufacturing Message Specification) can be an effective method, but it has problems which MMS products are generally very expensive and majority of the existing manufacturing devices do not support MMS. This paper describes the development of a gateway for Non-MMS-Compatible CNC machine tools to serve MMS and the implementation of OSI(Open System Interconnection) upper layer on TCP/IP. The developed system is applied to construct cell controller with heterogeneous devices under CIM environment and to evaluate interoperability and portability.

• 전자통신동향분석
• /
• 제32권6호
• /
• pp.17-26
• /
• 2017

Electronic packaging technology is a technology that easily connects devices to the outside. The fourth industrial revolution is thought to be possible with the advancement of certain devices. The advancement of these devices must be accompanied by innovations in electronic packaging that connects the devices to the outside world, allowing their performances to be implemented at the system level. In this paper, the development trends of 2.5D/3D technology, heterogeneous integration technology, ultrafine interconnection technology, and heat dissipation technology will be examined, and the development direction of these technologies will be discussed.

• 마이크로전자및패키징학회지
• /
• 제24권4호
• /
• pp.9-17
• /
• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• Advances in nano research
• /
• 제16권2호
• /
• pp.155-164
• /
• 2024

The rapid evolution of intelligent sports equipment and gadgets has led to the transformation of smartphones into personalized coaching devices. This transformative role is central in today's technologically advanced landscape, addressing the needs of individuals with contemporary lifestyles. The development of intelligent sports gadgets is geared towards elevating overall quality of life by facilitating sports activities, workouts, and promoting health preservation. This categorization yields two primary types of devices: smart sports devices for exercise and smart health control devices, which encompass functionalities such as blood pressure monitoring and muscle volume measurement. Illustrative examples include smart headbands, smart socks, smart wristbands, and smart shoe soles. Significantly, the global market for smart sports devices has garnered substantial popularity among enthusiasts. Moreover, the integration of sensors within these devices has instigated a revolution in group and professional sports, facilitating the calculation of impact intensity and ball speed. The utilization of various types of smart sports equipment has proliferated, encompassing applications in both sports' performance and health monitoring across diverse demographics. This article conducts an assessment of the application of nanotechnology in the continuous modeling of the magnetic electromechanical sensor integrated within smart shoe soles, with a specific emphasis on its implementation in soccer training. The exploration delves into the nuanced intersection of nanotechnology and sports equipment, elucidating the intricate mechanisms that underlie the transformative impact of these advancements.

• International Journal of Internet, Broadcasting and Communication
• /
• 제12권1호
• /
• pp.14-26
• /
• 2020

We categorize partnership types between network operators and a global video streaming or over-the-top service provider, Netflix from 2011 to the first quarter 2018. The options are based on the integration of over-the-top (OTT), Netflix with pay TV and telecommunication operators in the form of carrier billing, access to over-the-top (OTT) via devices or the development of their tariff plans. Options of the Type 3, 'cooperation' or the Type 4, 'agreement' entails a kind of the technical involvement between two partners and commercial agreement. The types of partnership are evolving from one to others. Some partnerships have characteristics of more than one type. The majority of technical or service integration cooperation of Type 3 entail bundling and marketing promotion of Type 2 and Type 1. Similarly, the 'agreement' of Type 4, co-branded or white-label service initiative entail tariff or device user interface (UI) integration of the 'cooperation' of Type 3 and joint marketing initiatives of Type 1.

• 한국IT서비스학회지
• /
• 제4권2호
• /
• pp.71-78
• /
• 2005

The beginning of Web Services was understood as efficient technology for application integration in the internet, thus it was used to integrating the distributed enterprise applications or the e-business applications between partners. But, recently the usage trend of Web Services is largely spreaded out wireless network applications beyond the internet applications. The main reasons are that Web Services is the international standard of W3C, and Web Services is based on XML that is independent of the specific internal implementations such as platform, programming languages, communications networks etc. Currently Major company of Web Services such as MS, IBM, etc. focus on the research about technology for integrating various devices. In this paper, we define and explain technical issues for adapting web services to ubiquitous Environment.