Objectives: The purpose of this study is to investigate the efficacy and the mechanisms of dietary supplements in cellulite treatment, and then to provide the theoretical and clinical basis for the cellulite treatment in Korean Medicine. Methods: We searched for articles from Korea, China, and English electronic database (Koreanstudies Information Service System [KISS], National Digital Science Library [NDSL], KMbase, Research Information Sharing Service [RISS], Oriental Medicine Advanced Searching Integrated System [OASIS], National Assembly Library, Korean Traditional Knowledge Portal, Google scholar, PubMed, Scopus, China National Knowledge Infrastructure [CNKI]) until April 2018. We chose clinical trial studies by inclusion criteria through titles, abstracts and articles. Results: A total of 10 studies were selected through search. The experimental group had shown more effective cellulite improvement in 90% of studies. Also, improvement of symptoms related with cellulite like pain, edema, heaviness and increase of skin surface temperature were observed in experimental group. In addition, the density of connective tissues of the dermal layer was increased in experimental group. Conclusions: The use of dietary supplements in cellulite treatment is thought to be effective through mechanisms that antioxidant efficacy, microcirculation improvement, interstitial matrix improvement, diuretic effect, and skin metabolic activity effect.
The assembly of the micron-sized Si/CNT/carbon composite wrapped with graphene (SCG composite) is designed and synthesized via a spray drying process. The spherical SCG composite exhibits a high discharge capacity of 1789 mAh g-1 with an initial coulombic efficiency of 84 %. Moreover, the porous architecture of SCG composite is beneficial for enhancing cycling stability and rate capability. In practice, a blended electrode consisting of spherical SCG composite and natural graphite with a reversible capacity of ~500 mAh g-1, shows a stable cycle performance with high cycling efficiencies (> 99.5%) during 100 cycles. These superior electrochemical performance are mainly attributed to the robust design and structural stability of the SCG composite during charge and discharge process. It appears that despite the fracture of micro-sized Si particles during repeated cycling, the electrical contact of Si particles can be maintained within the SCG composite by suppressing the direct contact of Si particles with electrolytes.
Purpose: At the industrial sites of aviation enterprises there is a significant optimization of the main production processes through the use of advanced digital technologies. The most promising are the latest technologies of industrial Internet of Things, active use of big data and practical application of artificial intelligence in production. Research design, data and methodology:The process of creating a competitive product in the high-tech aviation sector is actively linked to the investment appeal of aircraft and helicopter construction products, which is built on the basis of reducing production and time costs through the creation of an effective digital system. Results: The aviation cluster of Rostec State Corporation is currently being transformed in a significant way. The leading enterprises of the Russian aviation industry are actively mastering cooperation schemes using integrated digital management principles and the widespread introduction of digital products from leading Russian vendors. Conclusions: Following the transition to electronic aircraft design technologies and modern materials in the production of aircraft, UAC continues to improve all production processes through robotization and optimization of technological processes, due to the introduction of aircraft assembly technology in accordance with digital models.
International conference on construction engineering and project management
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2013.01a
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pp.553-557
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2013
Roof and exterior wall are designed and constructed in a manner that prevents the accumulation of water within the wall and roof assembly in the formal building. However, in a freeform building there is no clear distinction between exterior wall and roof. In other words, the exterior walls and roof systems of the freeform building are integrated as a surface, unlike the formal building envelope. Therefore, freeform architecture needs a systemized envelope design method to perform functions of exterior wall and roof. However, in many cases, construction methods for roof and exterior wall are applied to freeform buildings without necessary alterations, which lead to incomplete design, leakage, cracks and other problems. Freeform architecture is thus designed and constructed differently from formal buildings. In order to more easily and inexpensively actualize freeform architecture, Building Information Modeling (hereinafter referred to as BIM) has recently been applied in the construction industry. The studies and case analysis are not sufficient to identify the implications and contributions of freeform buildings in future similar projects. Therefore, this research will study design and construction methods for freeform surfaces. This study attempts to analyze the pros and cons of each method for the concrete surface frame, and then presents the panel options for envelope system of the freeform architecture.
To review the theoretical background of regulatory approaches to cross-border transfer of personal data, this paper divides major digital trade participating countries into four types according to the OECD - non-regulatory, post-intervention, pre-supervision, and national control. It then analyzes the US, Japan, the EU, and China respectively that belong to each type. South Korea, which is currently about to pass the amendment by the National Assembly, has identified that it is in the middle of post-intervention and pre-supervision, and needs to evolve into pre-supervision norms like the EU while it has to participate more actively in the process of establishing international digital trade rules. Korea first needs to sign digital trade agreements and promote mutual certification projects more actively from the standpoint of a medium-sized open country with growing digital companies and digitally-open consumers. Second, the government should fully consider the interests of not only companies but also various trade stakeholders including domestic consumers, when drafting and implementing trade policies. To this end, 'a single window approach' is needed not only at the Ministry of Trade, Industry, and Energy, but also at the level of the entire government which require an integrated form of digital trade policy governance.
Government publications at public institutions are data that are intended to convey the purpose of an institution or the performance of its business to the public or inside the institution. The management of government publications has become increasingly important under the framework of laws and systems, but matters concerning the nature and value of government publications have not been carried out at records management sites. The Act focused on the archives of the six metropolitan government, and presented issues and improvement measures for efficient management of government publications. To that end, the government should maintain a consistent payment system for publications. As payment method and payment book data in government publications are presented differently by law, a system for integrated management should be established to provide brief information and original information. Second, it is necessary to establish an administrative system that meets the storage environment. The publication registration and payment book system presented by the government's publication guidelines is the central system of the National Archives and Records Service, so it is not an efficient system in the agency archives. Third, support should be provided to recognize the value of government publications and to preserve and manage them in the long term. To dispose of the government publications, a realistic classification method, integrated and controlled program should be presented, and criteria for users using the service should be provided. Fourth, it is the establishment of an integrated management system for government publications. The National Archives Service, the National Central Library, and the National Assembly Library should simultaneously build an abstract of information and original information so that they can be managed systematically and efficiently.
Proceedings of the Korean Vacuum Society Conference
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2012.02a
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pp.431-432
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2012
In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.
Journal of the Korea institute for structural maintenance and inspection
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v.22
no.4
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pp.1-9
/
2018
The development of new technology and process in industrial Plant which builds integrated structures, facilities and systems. Has become a key element for strengthening its competitiveness. Although domestic industrial Plant has demonstrated excellence in technology with a persistent increase in order quantity and orders received, the technology gap between countries has narrowed due to global construction trend. Therefore, it is necessary to develop new technology that could help overcome constraints and limitations of the current one to follow the trend in the age of unlimited competition. This study has focused on assembly technology of Pipe-rack joint connection in an effort to strengthen technological competitiveness in industrial Plant. Through an analysis of earlier studies on Pipe-rack and a coMParative analysis of strengths and weaknesses of current assembly technology of it, a new design plan has been made to improve it efficiently. In doing this, standards for design factors of both structural and performance features have been drawn, and value of stress, strain, moment and rotation has been calculated using finite element analysis. As a result, installation technology of modular type Pipe-rack, which has not been developed in Korea and is differentiated from the current one, has been developed. It is considered that the technology reduces work time and saves cost due to simplified joint connection of steel structure, unlike the current one. Moreover, since it is installed without a welding process in the field, industrial accidents would be reduced, which is likely to have economic competitiveness and satisfy.
Gloeostereum incarnatum has edible and medicinal value and was first cultivated and domesticated in China. We sequenced the G. incarnatum monokaryotic strain GiC-126 on an Illumina HiSeq X Ten system and obtained a 34.52-Mb genome assembly sequence that encoded 16,895 predicted genes. We combined the GiC-126 genome with the published genome of G. incarnatum strain CCMJ2665 to construct a genetic linkage map (GiC-126 genome) that had 10 linkage groups (LGs), and the 15 assembly sequences of CCMJ2665 were integrated into 8 LGs. We identified 1912 simple sequence repeat (SSR) loci and detected 700 genes containing 768 SSRs in the genome; 65 and 100 of them were annotated with gene ontology (GO) terms and KEGG pathways, respectively. Carbohydrate-active enzymes (CAZymes) were identified in 20 fungal genomes and annotated; among them, 144 CAZymes were annotated in the GiC-126 genome. The A mating-type locus (MAT-A) of G. incarnatum was located on scaffold885 at 38.9 cM of LG1 and was flanked by two homeodomain (HD1) genes, mip and beta-fg. Fourteen segregation distortion markers were detected in the genetic linkage map, all of which were skewed toward the parent GiC-126. They formed three segregation distortion regions (SDR1-SDR3), and 22 predictive genes were found in scaffold1920 where three segregation distortion markers were located in SDR1. In this study, we corrected and updated the genomic information of G. incarnatum. Our results will provide a theoretical basis for fine gene mapping, functional gene cloning, and genetic breeding the follow-up of G. incarnatum.
Journal of the Computational Structural Engineering Institute of Korea
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v.31
no.5
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pp.267-274
/
2018
For successful BIM settlement, it is a key technic for engineer to design structures in the 3-dimensional digital space and to work out related design documents directly. Lately many BIM tool has been released and each supports their 3-dimensional object libraries. But it is not easy to apply those libraries to design transportation infra structures that were placed along the route(3-dimensional line). Moreover, in case of design changes, it is so difficult to reflect those changes with the integrated model that was assembled by them. Because of they were developed without consideration for redundancy of parameters between objects that were placed nearby or were related each other. In this paper, a method to develop module for modeling and placing 3-dimensional object for transportation infra structures is presented. The modules are employed by a parametric method and can deal with design changes. Also, for a railroad bridge, through developing user interface of the integrated 3-dimensional model that was assembled by those modules the applicability of them was reviewed.
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