• Transactions of the Society of Information Storage Systems
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• v.2 no.3
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• pp.163-168
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• 2006

Small form factor optical pickup (SFFOP) corresponding to BD specifications is strongly proposed for the next-generation portable storage device. In order to generate SFFOP, small sized optical pickup has been fabricated. We have developed a small sited optical pickup that is called the integrated optical pickup (IOP). The fabrication method of this system is mainly dependant on the use of the wafer based micro fabrication technology, which has been used in MEMS process such as photolithography, reactive ion etching, wafer bonding, and packaging process. This approach has the merits for mass production and high assembling accuracy. In this study, to generate the small sized optical pickup for high recording capacity, IOP corresponding to BD specifications has been designed and developed, including three main parts, 1) design, fabrication and evaluation of objective lens unit, 2) design and fabrication of IOP and 3) evaluation process of FES and TES.

• Transactions of the Society of Information Storage Systems
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• v.1 no.2
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• pp.182-187
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• 2005

A large area micro mirror is an optical element that functions as changing an optical path by reflection in integrated optical system. We fabricated the large area silicon mirror by anisotropic etching using MEMS for implementation of integrated optical pickup. In this work, we report the optimum conditions to better fabricate and design, greatly improve mirror surface quality. To obtain mirror surface of $45^{\circ},\;9.74^{\circ}$ off-axis silicon wafer from (100) plane was used in etching condition of $80^{\circ}C$ with 40wt.% KOH solution. After wet etching, polishing process by MR fluid was applied to mirror surface for reduction of roughness. In the next step, after polymer coating on the polished Si wafer, the Si mirror was fabricated by UV curing using a trapezoid bar-type way structure. Finally, we obtained peak to valley roughness about 50 nm in large area of $mm^2$ and it is applicable to optical pickup using blu-ray wavelength as well as infrared wavelength.

• 정보저장시스템학회:학술대회논문집
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• 2005.10a
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• pp.154-159
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• 2005

The next generation of optical storage systems requires higher numerical aperture (NA) objective lenses and shorter wavelength laser in order to improve the unit areal density. A blu-ray technology satisfies a miniaturization and a high capacity which are the requirements of the portable device. In this paper, we analyze the optical performance of hybrid micro lens and do active alignment. The hybrid micro lens is manufactured by using a wafer based fabrication technology. Optical components of hybrid micro lens are evaluated. The measurement of the optical power, the spot size and the wavefront error awe performed to evaluate the hybrid micro lens with NA 0.85. Using the measured data, we estimate if the performance of hybrid micro lens corresponds to the designed performance. After the performance of hybrid micro lens is evaluated, the integrated optical pickup and the hybrid micro lens are assembled by active alignment using UV curing and the optical performance of SFFOP is satisfied with BD specifications.

• Transactions of the Society of Information Storage Systems
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• v.2 no.1
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• pp.79-84
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• 2006

The next generation of optical storage systems requires higher numerical aperture(NA) objective lenses and shorter wavelength laser in order to improve the unit areal density. A blu-ray technology satisfies a miniaturization and a high capacity which are the requirements of the portable device. In this paper, we analyze the optical performance of hybrid micro lens and do active alignment. The hybrid micro lens is manufactured by using a wafer based fabrication technology. Optical components of hybrid micro lens are evaluated. The measurement of the optical power, the spot size and the wavefront error are performed to evaluate the hybrid micro lens with NA 0.85. Using the measured data, we estimate if the performance of hybrid micro lens corresponds to the designed performance. After the performance of hybrid micro lens is evaluated. the integrated optical pickup and the hybrid micro lens are assembled by active alignment using UV curing and the optical performance of SFFOP is satisfied with BD specifications.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1522-1526
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• 2005

In this study, the fabrication of large area silicon mirror is accomplished by anisotropic etching using MEMS for implementation of integrated optical pickup and the process condition is also established for improving the mirror surface roughness. Until now, few results have been reported about the production of highly stepped $9.74^{\circ}$ off-axis-cut silicon wafer using wet etching. In addition rough surface of the mirror is achieved in case of long etching time. Hence a novel method called magnetorheolocal finishing is introduced to enhancing the surface quality of the mirror plane. Finally, areal peak to valley surface roughness of mirror plane is reduced about 100nm in large area of $mm^2$ and it is applicable to optical pickup using infrared wavelength.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.1 s.178
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• pp.89-96
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• 2006

In this study, fabrication of the large area silicon mirror is accomplished by anisotropic wet etching using micromachining technology for implementation of integrated slim optical pickup and the process condition is also established for improving the mirror surface roughness. Until now, few results have been reported about the production of highly stepped $9.74^{\circ}$ off-axis-cut silicon wafers using wet etching. In addition rough surface of the mirror is achieved in case of tong etching time. Hence a novel method called magnetorheolocal finishing is applied to enhance the surface quality of the mirror plane. Finally, areal peak to valley surface roughness of mirror plane is reduced about 100nm in large area of $mm^2$ and it is applicable to optical pickup using infrared wavelength.

• Proceedings of the Optical Society of Korea Conference
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• 2005.02a
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• pp.314-315
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• 2005

• Transactions of the Society of Information Storage Systems
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• v.1 no.2
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• pp.175-181
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• 2005

SiOB is an essential part of slim optical pickup, where the silicon mirror, LD stand, silicon PD are integrated and LD is flip chip bonded. SiOB is fabricated with bulk micromachining. Especially the fabrication of silicon wafer with stepped concave areas has many extraordinary difficulties. As a matter of fact, experiences and knowledges are rare in the fabrication of the highly stepped silicon wafer. The difficulties occurring in the integration of PD and SiOB, and highly stepped patterning, and silicon mirror roughness and how-to-solve will be discussed.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.3
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• pp.38-49
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• 1998

The 3rd generation optical pick-up used popularly in resent years is composed of many optical and electronic components such as laser diode, photo diode, beam splitter, objective lens, grating lens, concave lens, collimator lens etc. Therefore, the design of its optical system and its main base which the said optical and electronic components are set on, is complicated and needs high precision. Its assembly and adjustment in the production line is also difficult. This complication and the demand of high precision get its production cost to be high and its reliability to be low. In this paper, the 4th generation optical pick-up is designed and developed, with the hologram device which laser diode. photo diode, beam splitter. and grating lens are integrated in. This optical pick-up reduces the number of points of adjustment by 3, compared with the 3rd generation optical pick-up of which the number of points of adjustment is 6. This optical pickup also decreases by 4 the number of points of W bonding to have bad influence on environmental reliability, decreases by about 10 the number of parts, and establishes about 20% cost-down of material cost, compared with the 3rd generation optical pick-up.

• Journal of the Optical Society of Korea
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• v.5 no.2
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• pp.43-48
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• 2001

A three-dimensional (3D) display system based on computer-generated integral photography (CGIP) is proposed and its feasibility is discussed. Instead of the pickup process in conventional If, the elemental images of imaginary objects are computer-generated. Using these images, we observed autostereoscopic 3D images in full color and full parallax. The lateral and depth resolutions of the integrated images are limited by some factors such as the image position, object thickness, the lens width, and the pixel size of display panel.