• Title/Summary/Keyword: Inspection module

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Development of Dual Energy Radiation Detector (이중 에너지 방사선 검출기 개발)

  • Yeo, Hwa-Yeon
    • Journal of the Korean Society of Radiology
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    • v.4 no.3
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    • pp.5-11
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    • 2010
  • In this paper, we are suggested development of dual-mode detector for dual-energy digital radiography. Design of dual-energy radiography module for commercial BIS (Baggage Inspection System) is used in the spectrum of the X-ray generator and detector for dual-mode features and radiological characteristics were analyzed. BIS suggestl on the image detector module being used to target X-ray tube to simulate X-ray spectrum and simulated spectrum to offer through the new radiographic characteristics of the detector modules were investigated. Using X-ray experiments with an increase in the thickness of the copper filter low energy detector (LED) and high-energy detector (HED) as the difference between the output signal increases. HED, especially in the size of the output signal decreases with increasing thickness of the copper filter was found.

A 3-D Tube Reconstruction based on Axis Alignment of Multiple Laser Scanning (배관측 정렬 방법을 이용한 다중레이저 스캐닝 기반의 3차원 배관복원)

  • Baek, Seung-Hae;Park, Soon-Yong;Kim, Seung-Ho
    • Journal of Institute of Control, Robotics and Systems
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    • v.17 no.11
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    • pp.1159-1167
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    • 2011
  • A novel 3D tube scanning technique is proposed. The proposed tube scanning technique is developed for a special tube inspection module which consists of four line-lasers and one camera. Using the scanning module, we can reconstruct the 360 degree shapes of the inner surfaces of a cylindrical tube. From an image frame captured by the camera, we reconstruct a partial tube model based on four laser triangulations. Then by aligning such partial models with respect to a reference tube axis, a complete 3D shape of the tube is reconstructed. The tube axis in each reconstructed frame is aligned with a 3D Euclidean transformation to the reference axis. Several experiments show that the proposed method can align multiple tube axes very accurately and reconstruct 3D shapes of a tube with very low shape distortion.

Development of Static Testing Tool Related Int'l Standard for Railway Signaling Software (국제표준 기반 열차제어시스템 소프트웨어의 정적 테스팅 지원도구의 개발)

  • Hwang, Jong-Gyu;Jo, Hyun-Jeong
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.58 no.2
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    • pp.108-115
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    • 2009
  • Recent advances in computer technology have brought more dependence on software to train control systems. Hence, the safety assurance of the vital software running on the railway system is very critical task and yet, not many works have been done. While much efforts have been reported to improve electronic hardware's safety, not so much systematic approaches to evaluate software's safety, especially for the vital software running on board train controllers. In this paper, we have developed the static software testing tool for railway signaling, especially Fagan Inspection module and checklists supporting module. This static testing tool for railway signaling can be utilized at the assessment phase, and also usefully at the software development stage also. It is anticipated that it will be greatly helpful for the evaluation on the software for railway signalling system.

Dimensional Analysis for the Front Chassis Module in the Auto Industry (자동차 프런트 샤시 모듈의 좌표 해석)

  • 이동목;양승한
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.8
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    • pp.50-56
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    • 2004
  • The directional ability of an automobile has an influence on driver directly, and hence it must be given most priority. Alignment factors of automobile such as the camber, caster and toe directly affect the directional ability of a vehicle. The above mentioned factors are determined by the pose of interlinks in the assembly of an automobile front chassis module. Measuring the position of center point of ball joints in the front lower arm is very difficult. A method to determine this position is suggested in this paper. Pose estimation for front chassis module and dimensional evaluation to find the rotational characteristics of front lower arm were developed based on fundamental geometric techniques. To interpret the inspection data obtained for front chassis module, 3-D best fit method is needed. The best fit method determines the relationship between the nominal design coordinate system and the corresponding feature coordinate system. The least squares method based on singular value decomposition is used in this paper.

Development of an Analytic Surface Measurement Module for OMM System (기상측정 시스템을 위한 일반형상 측정 모듈 개발)

  • 조승현;이승용;조명우;권혁동;김문기
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.239-242
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    • 2000
  • The purpose of this paper is to establish an effective inspection system by using OMM(ON-Machine Measurement) system. This allows us to reduce the manufacturing lead time by separating the inspection process from manufacturing system. As a first step, the inspection process planning is accomplished by determining the number of measuring points, their locations, measuring path and their sequence. Subsequently, we generate measuring G-codes to be transferred to the machining center through RS232C, and then the inspection process will be performed for each shape. Analysing obtained measuring data, the dimensional tolerance will be validated.

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Operating Voltage of Optical Instruments based on Polymer-dispersed Liquid Crystal for Inspecting Transparent Electrodes

  • Yeo, Sunggu;Oh, Yonghwan;Lee, Ji-Hoon
    • Current Optics and Photonics
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    • v.1 no.1
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    • pp.45-50
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    • 2017
  • Optical instruments based on polymer-dispersed liquid crystal (PDLC) have been used to inspect transparent electrodes. Generally the operating voltage of an inspection instrument using PDLC is very high, over 300 V, reducing its lifetime and reliability. The operating-voltage issue becomes more serious in the inspection of touch-screen panel (TSP) electrodes, due to the bezel structure protruding over the electrodes. We have theoretically calculated the parameters affecting the operating voltage as a function of the distance between the TSP and the PDLC, the thickness, and the dielectric constant of the sublayers when the inspection module was away from the TSP electrodes. We have experimentally verified the results, and have proposed a way to reduce the operating voltage by substituting a plastic substrate film with a hard coating layer of smaller thickness and higher dielectric constant.

Linear System Depth Detection using Retro Reflector for Automatic Vision Inspection System (자동 표면 결함검사 시스템에서 Retro 광학계를 이용한 3D 깊이정보 측정방법)

  • Joo, Young Bok
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.4
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    • pp.77-80
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    • 2022
  • Automatic Vision Inspection (AVI) systems automatically detect defect features and measure their sizes via camera vision. It has been populated because of the accuracy and consistency in terms of QC (Quality Control) of inspection processes. Also, it is important to predict the performance of an AVI to meet customer's specification in advance. AVI are usually suffered from false negative and positives. It can be overcome by providing extra information such as 3D depth information. Stereo vision processing has been popular for depth extraction of the 3D images from 2D images. However, stereo vision methods usually take long time to process. In this paper, retro optical system using reflectors is proposed and experimented to overcome the problem. The optical system extracts the depth without special SW processes. The vision sensor and optical components such as illumination and depth detecting module are integrated as a unit. The depth information can be extracted on real-time basis and utilized and can improve the performance of an AVI system.

Development of an Operation Software for the ASRI-FMS/CIM (ASRI-FMS/CIM 을 위한 운용 소프트웨어의 구축)

  • Park, Chan-Kwon;Park, Jin-Woo;Kang, Suk-Ho
    • IE interfaces
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    • v.6 no.2
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    • pp.53-65
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    • 1993
  • This paper deals with the development of a software module for production planning and scheduling activities of an existing Flexible Machining and Assembly System (FMAS). The Production Planning Module uses the hierarchical and sequential scheme based on "divide and conquer" philosophy. In this module, routes are determined based on the production order, orders are screened, tools are allocated, and order adjustments are executed according to the allocated tools. The Scheduling Module allocates the resources, determines the task priority and the start and completion times of tasks. Re-scheduling can be done to handle unforeseen situations such as lumpy demands and machine breakdowns. Since all modules are integrated with a central database and they interface independently, it is easy to append new modules or update the existing modules. The result of this study is used for operating the real FMAS consisting of a machining cell with 2 domestic NC machines and a part feeding robot, an assembly cell with a conveyor and 3 robots, an inspection cell, an AGV, an AS/RS, and a central control computer.

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Development of Memory Controller for Punctuality Guarantee from Memory-Free Inspection Equipment using DDR2 SDRAM (DDR2 SDRAM을 이용한 비메모리 검사장비에서 정시성을 보장하기 위한 메모리 컨트롤러 개발)

  • Jeon, Min-Ho;Shin, Hyun-Jun;Jeong, Seung-Heui;Oh, Chang-Heon
    • Journal of Advanced Navigation Technology
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    • v.15 no.6
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    • pp.1104-1110
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    • 2011
  • The conventional semiconductor equipment has adopted SRAM module as the test pattern memory, which has a simple design and does not require refreshing. However, SRAM has its disadvantages as it takes up more space as its capacity becomes larger, making it difficult to meet the requirements of large memories and compact size. if DRAM is adopted as the semiconductor inspection equipment, it takes up less space and costs less than SRAM. However, DRAM is also disadvantageous because it requires the memory cell refresh, which is not suitable for the semiconductor examination equipments that require correct timing. Therefore, In this paper, we will proposed an algorithm for punctuality guarantee of memory-free inspection equipment using DDR2 SDRAM. And we will Developed memory controller using punctuality guarantee algorithm. As the results, show that when we adopt the DDR2 SDRAM, we can get the benefits of saving 13.5 times and 5.3 times in cost and space, respectively, compared to the SRAM.

Development of automatic die bonder system for semiconductor parts assembly (반도체 소자용 자동 die bonding system의 개발)

  • 변증남;오상록;서일홍;유범재;안태영;김재옥
    • 제어로봇시스템학회:학술대회논문집
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    • 1988.10a
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    • pp.353-359
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    • 1988
  • In this paper, the design and implementation of a multi-processor based die bonder machine for the semiconductor will be described. This is a final research results carried out for two years from June, 1986 to July, 1988. The mechanical system consists of three subsystems such as bonding head module, wafer feeding module, and lead frame feeding module. The overall control system consists of the following three subsystems each of which employs a 16 bit microprocessor MC 68000 : (i) supervisory control system, (ii) visual recognition / inspection system and (iii) the display system. Specifically, the supervisory control system supervises the whole sequence of die bonder machine, performs a self-diagnostics while it controls the bonding head module according to the prespecified bonding cycle. The vision system recognizes the die to inspect the die quality and deviation / orientation of a die with respect to a reference position, while it controls the wafer feeding module. Finally, the display system performs a character display, image display ans various error messages to communicate with operator. Lead frame feeding module is controlled by this subsystem. It is reported that the proposed control system were applied to an engineering sample and tested in real-time, and the results are sucessful as an engineering sample phase.

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