• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.1008-1011
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• 2005

It is necessary for the design of lead frame punches in blanking to consider buckling because inner lead pitch of lead frame has been narrowed by miniaturization and high accumulation of semiconductor. In addition, if process variables change in press stamping process, the lift of punches is no longer influenced in wear and punches can be broken suddenly. To prevent the fracture of fine pitch lead frame punches, having considered applying reinforcement to it, this paper verified the design with buckling analysis. This study presents the optimal position and number of reinforcement to be attached to punches. Finally this study presents design rules of attaching reinforcement.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.3 s.96
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• pp.25-29
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• 1999

The lead frame manufactured by press stamping process, is an important part of semiconductor. The recent technical trend of semiconductor, chip sized and high performance package technology, requires the lead frame to be of more multi-leads and of fine ILP (Inner Lead Pitch). As the ILP is getting finer, its corresponding punch of the stamping die is getting narrower. The punch narrower than its stamping limit has been broken due to local buckling. This paper analyzed the phenomena of punch breakdown. Moreover, the punch design was modified to increase the critical limit of buckling force. This paper, also, suggested new design rules of the punch, which asks the modification of its lead frame design that has to be considered in the stage of semiconductor package design. The new design rules of lead frame design yields a good reliability of semiconductor package as well as a good quality of lead frame.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.9 s.186
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• pp.68-75
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• 2006

The lead frame manufactured by stamping process plays an important role in connecting semiconductor to PCB board. As a result of the miniaturization of semiconductor, its corresponding lead frame punch has been narrow. In case of the punch with high slenderness ratio such as lead frame punch, the punch can be broken suddenly due to buckling. To prevent the fracture of lead frame punch, some manufacturers have experientially attached stiffeners to weak parts of punch. The purpose of this study, therefore, is to suggest the guideline far design of stiffened punch. The optimal position and the number of stiffeners to be attached to punch are investigated by elastic buckling analysis. The elastic buckling analysis consists of the eigenvalue buckling analysis and nonlinear buckling analysis. The critical buckling load of elastic buckling analysis is compared with that of buckling test. Finally, the guideline far attaching stiffeners is suggested through analysis of cross section of lead frame punch such as moment of inertia and eccentricity.