• 비파괴검사학회지
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• 제34권4호
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• pp.299-304
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• 2014

본 연구에서는 적외선 열화상 카메라와 열원 사이에 유리를 설치하여 측정기기의 보호 및 온도 보정을 통하여 고온의 용접부 온도를 실시간으로 측정하고자 하였다. 먼저 할로겐램프의 열에 대한 온도 차이를 실시간으로 촬영하고 온도를 측정한 결과, 카메라와 열원 사이의 거리별 온도는 거의 동일하게 측정되었음을 확인할 수 있었고, 유리 두께와 측정 거리의 상관관계를 통하여 온도 범위를 예측할 수 있다는 것을 알 수 있었다. 이를 바탕으로 용접열원에 대한 실험을 수행하여 열화상 카메라를 이용한 용접부의 온도 측정의 타당성을 제시하였다.

• 비파괴검사학회지
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• 제33권4호
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• pp.342-348
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• 2013

본 논문에서는 비접촉 비파괴검사에 사용되는 적외선열화상카메라의 응답 및 노이즈 특성을 평가할 수 있는 방법을 제시하고 있으며 차동모드흑체의 적외선 표적과 그 주변의 온도차 ${\Delta}$T를 이용하여 상용 적외선열화상카메라의 신호전달함수 및 온도분해능을 구하고 그 결과를 카메라 사양과 비교함으로써 본 평가 방법의 적합성을 검증하였다. 또한 비균일성 보정의 적용 유무로부터 나타나는 온도분해능의 차이 0.01 K을 통하여 적외선열화상카메라의 성능평가에 있어서 비균일성 보정이 필수적인 과정임을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.282-282
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• 2010

LED Device was designed of electronic circuits of electrical power part for used Pspice student version and used Infrared LED lamps of load part. LED was used Computerized Electronic Medical Infrared Thermographic Imaging System for body surface Investigation of variable Body thermal asymmetry. It was knowledge body thermal Asymmetry of body surface and quantity body surface of electromagnetic wave to inflow electrical power part.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.444-447
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• 2003

All objects with some temperature above absolute zero radiate in the infrared. The intensity of the infrared radiated from a object defends on the condition and temperature on the surface of the one. The present, these techniques are frequently adopted into diagnosis for electricity equipments. Simply, however, the applied techniques are passive thermal testing for the detection of loosened terminals and overcurrent. In this paper, a infrared thermal imager was applied to high voltage windings of cast resin transformers, and the accumulated value of the result temperatures was used for evaluating remained lifetime of them. At each aging level, dielectric loss tangent test was carried out. The results offered capabilities for deciding the condition of the transformers suffering difficulties to diagnose.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 춘계학술대회 논문집
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• pp.133-137
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• 1994

Infrared radiator of Cordierite system were manufactured using Cordierite(2Mgo$.$2Al$_2$O$_3$$.$5SiO$_2$) and Clay 30wt% as main materials and addition of MnO$_2$ from 0. 1 to 2 5wt% of Dry pressing and slip casting The effects of MnO$_2$ additives on the thermal properties of infrared radiator of Cordierite system. The more the thermal expansion could be lowered the more the amount (wt%) of additives MnO$_2$is increased in the below 4.5$\mu\textrm{m}$. The high efficiency Infrared radiator of Cordierite system using dry pressing method when the amount of additives MnO$_2$is 2.0 wt%

• 센서학회지
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• 제27권5호
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2004년도 춘계학술발표회
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• pp.622-628
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• 2004

In general, Reinforced Slopes by Shotcrete are difficult to inspect because of stiff Slope and highly Working Area. So the Inspection Techniques are needed by the Non-contact and Non-destructive. On this Study, Appling the safety method to finding the weak zones(cavity area, dampness area, etc.) by using the Infrared Thermal Technique That is detecting the Detail Thermal Difference on the Surface of Reinforced Slopes by Shotcrete.

• 설비공학논문집
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• 제14권1호
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• pp.1-9
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• 2002

The thermal response of electronic components during infrared reflow soldering is studied by a two-dimensional numerical model. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to determine the thermal response of electronic components to various conditions such as conveyor velocities, exhaust velocities and emissivities. The results of this study can be used in selecting the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly stresses.

• 한국산업융합학회 논문집
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• 제24권6_2호
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• pp.707-713
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• 2021

Symptoms of foot-and-mouth disease include fever and drooling a lot around the hoof, blisters in the mouth, poor appetite, blisters around the hoof, and blisters around the hoof. Research is underway on smart barns that remotely manage these symptoms through cameras. Visible light cameras can measure the condition of livestock such as blisters, but cannot measure body temperature. On the other hand, infrared thermal imaging cameras can measure body temperature, but it is difficult to measure the condition of livestock. In this paper, we propose an object detection system using deep learning-based livestock detection using visible and infrared thermal imaging composite camera modules for preemptive response

• 한국재료학회지
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• 제26권4호
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• pp.216-221
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• 2016

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.