Korean Journal of Air-Conditioning and Refrigeration Engineering (설비공학논문집)

The Society of Air-Conditioning and Refrigerating Engineers of Korea (대한설비공학회)
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Sensitivity Analysis on the Thermal Response of Electronic Components during Infrared Reflow Soldering

적외선 리플로 솔더링시 전자부품의 열적반응 민감도 분석

  • 손영석 (동의대학교 기계. 산업시스템공학부 기계공학전공) ;
  • 신지영 (동의대학교 기계. 산업시스템공학부 기계공학전공)
  • Published : 2002.01.01
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Abstract

The thermal response of electronic components during infrared reflow soldering is studied by a two-dimensional numerical model. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to determine the thermal response of electronic components to various conditions such as conveyor velocities, exhaust velocities and emissivities. The results of this study can be used in selecting the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly stresses.

Keywords

References

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