• Journal of Sensor Science and Technology
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• v.31 no.2
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• pp.131-137
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• 2022

Crimes related to illegal cameras are steadily increasing and causing social problems. Owing to the development of camera technology, the miniaturization and high performance of illegal cameras have caused anxiety among many people. This study is for detecting hidden cameras effectively such that they could not be easily detected by human eyes. An image sensor-based module with 940 nm wavelength infrared detection technology was developed, and an image processing algorithm was developed to selectively detect illegal cameras. Based on the Android smartphone environment, image processing technology was applied to an image acquired from an infrared camera, and a detection sensor module that is less sensitive to ambient brightness noise was studied. Experiments and optimization studies were conducted according to the Gaussian blur size, adaptive threshold size, and detection distance. The performance of the infrared image-based illegal camera detection sensor module was excellent. This is expected to contribute to the prevention of crimes related to illegal cameras.

• Transactions on Electrical and Electronic Materials
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• v.18 no.6
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• pp.341-344
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• 2017

Infrared (IR) filters were developed to implement integrated three-dimensional (3D) image sensors that are capable of obtaining both color image and depth information at the same time. The combination of light filters applicable to the 3D image sensor is composed of a modified IR cut filter mounted on the objective lens module and on-chip filters such as IR pass filters and color filters. The IR cut filters were fabricated by inorganic $SiO_2/TiO_2$ multilayered thin-film deposition using RF magnetron sputtering. On-chip IR pass filters were synthetized by dissolving various pigments and dyes in organic solvents and by subsequent patterning with photolithography. The fabrication process of the filters is fairly compatible with the complementary metal oxide semiconductor (CMOS) process. Thus, the IR cut filter and IR pass filter combined with conventional color filters are considered successfully applicable to 3D image sensors.

• Proceedings of the KIPE Conference
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• 2002.07a
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• pp.711-714
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• 2002

Thermal infrared camera have poor image qualities compared to commercial CCD cameras, as in contrast, brightness, and. resolution. To compensate the poor Image quality problems associated with the thermal infrared camera, the technique of superimposing thermal infrared image into real ccd image is proposed. The mobile robot KAEROT/m2, loaded with sensor head system at the mast, is entered to monitor leakage of heavy water and thermal abnormality of the calandria reactor area in overhaul period. The sensor head system is composed of thermal infrared camera and cod camera In parallel. When thermal abnormality on observation points and areas of calandria reactor area is occurred, unusual hot image taken from thermal infrared camera is superimposed on real CCD image. In this inspection experiment, more accurate positions of thermal abnormalities on calandria reactor area can be estimated by using technique of mapping thermal infrared image into CCD image, which include characters arranged in MPOQ order.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.21 no.4
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• pp.43-49
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• 2021

A small infrared image homing system is a tracking system that has an infrared image sensor that identifies a target through the day and night infrared image processing of the target on the ground and searches for and detects the target with respect to the main target. This paper describes the development of a board equipped with a high-speed CPU and FPGA (Field Programmable Gate Array) to identify target through real-time image processing by acquiring target information through infrared image. We propose a CPU-FPGA combining architecture for CPU and FPGA selection and video signal processing, and also describe a controller design using FPGA to control infrared sensor.

• Journal of Sensor Science and Technology
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• v.9 no.1
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• pp.44-50
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• 2000

Every object emits some energy from its surface. The emission energy forms surface heat distribution which we can capture by using an infrared thermal imager. The infrared thermal image may include valuable information regarding to the subsurface anomaly of the object. Since a thermal image reflects surface clutter and subsurface anomaly, we have difficulty in extracting the information on the subsurface anomaly only with thermal images taken under a wavelength. Thus, we use visible wavelength images of the object surface to remove exterior clutter. We, therefore in this paper, visualize the infrared image for overlaying it with a visible wavelength image. First, we make an interpolated image from two ordinary images taken from both sides of an infrared sensor. Next, we overlay the intermediate image with an infrared image taken from the infrared camera. The technique suggested in this paper can be utilized for analyzing the infrared images on non-destructive inspection against disaster and for safety.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.7
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• pp.1503-1508
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• 2009

This study applied image processing techniques, constructed to real-time, to thermal infrared camera image. Thermal infrared image data was utilized for hot mapping, cool mapping, and rainbow mapping according to changing temperature. It was histogram image processing techniques so that detected shade contrast function of the thermal infrared image, and the thermal infrared image's edge was extracted to classification of object. Moreover, extraction of temperature from image was measured by using the image information program.

• Ceramist
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• v.21 no.2
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• pp.59-74
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• 2018

Imaging in the Short Wave Infrared (SWIR) provides several advantages over the visible and near-infrared regions: enhanced image resolution in in foggy or dusty environments, deep tissue penetration, surveillance capabilities with eye-safe lasers, assessment of food quality and safety. Commercially available SWIR imagers are fabricated by integrating expensive epitaxial grown III-V compound semiconductor sensors with Si-based readout integrated circuits(ROIC) by indium bump bonding Infrared image sensors made of solution-processed quantum dots have recently emerged as candidates for next-generation SWIR imagers. They combine ease of processing, tunable optoelectronic properties, facile integration with Si-based ROIC and good performance. Here, we review recent research and development trends of various application fields of SWIR image sensors and nano-materials capable of absorption and emission of SWIR band. With SWIR sensible nano-materials, new type of SWIR image sensor can replace current high price SWIR imagers.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.4
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• pp.34-38
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• 2005

This is a widespread requirement for low cost lightweight thermal imaging sensors for both military and civilian applications. Today, a large number of uncooled infrared detector developments are under progress due to the availability of silicon technology that enables realization of low cost IR sensor. System prices are continuing to drop, and swelling production volume will soon drive process substantially lower. The feasibility of micromechanical optical and infrared (IR) detection using microcantilevers is demonstrated. Microcantilevers provide a simple Structurefor developing single- and multi-element sensors for visible and infrared radiation that are smaller, more sensitive and lower in cost than quantum or thermal detectors. Microcantilevers coated with a heat absorbing layer undergo bending due to the differential stress originating from the bimetallic effect. This paper reports a micromachined silicon uncooled thermal imager intended for applications in automated process control. This paper presents the design, fabrication, and the behavior of cantilever for thermomechanical sensing.

• Journal of Space Technology and Applications
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• v.1 no.3
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• pp.356-363
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• 2021

It was common knowledge in textbooks that images acquired using mid-infrared ray were not suitable for measuring temperature near room temperature. But a recent satellite image using a mid-infrared sensor show the possibility that the result measured using the mid-infrared sensor can also measure the temperature near room temperature. In this paper, the possibility and accuracy of extraction room temperature information from satellite images with mid-infrared sensors are reviewed. The mid-infrared satellite image reviewed in this paper showed the temperature of room temperature well, and regarding the reliability as an absolute value of the measured temperature, the effect of the heat transfer amount due to the direct reflection of sunlight on the surface and the effect of the infrared absorption amount absorbed in the atmosphere can be seen as a relatively small or constant value. However, the problem of uncertainty in the radiation coefficient due to physical properties, which is the limit of the non-contact thermometer, remained a problem to be solved.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.