• 센서학회지
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• 제31권2호
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• pp.131-137
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• 2022

Crimes related to illegal cameras are steadily increasing and causing social problems. Owing to the development of camera technology, the miniaturization and high performance of illegal cameras have caused anxiety among many people. This study is for detecting hidden cameras effectively such that they could not be easily detected by human eyes. An image sensor-based module with 940 nm wavelength infrared detection technology was developed, and an image processing algorithm was developed to selectively detect illegal cameras. Based on the Android smartphone environment, image processing technology was applied to an image acquired from an infrared camera, and a detection sensor module that is less sensitive to ambient brightness noise was studied. Experiments and optimization studies were conducted according to the Gaussian blur size, adaptive threshold size, and detection distance. The performance of the infrared image-based illegal camera detection sensor module was excellent. This is expected to contribute to the prevention of crimes related to illegal cameras.

• Transactions on Electrical and Electronic Materials
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• 제18권6호
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• pp.341-344
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• 2017

Infrared (IR) filters were developed to implement integrated three-dimensional (3D) image sensors that are capable of obtaining both color image and depth information at the same time. The combination of light filters applicable to the 3D image sensor is composed of a modified IR cut filter mounted on the objective lens module and on-chip filters such as IR pass filters and color filters. The IR cut filters were fabricated by inorganic $SiO_2/TiO_2$ multilayered thin-film deposition using RF magnetron sputtering. On-chip IR pass filters were synthetized by dissolving various pigments and dyes in organic solvents and by subsequent patterning with photolithography. The fabrication process of the filters is fairly compatible with the complementary metal oxide semiconductor (CMOS) process. Thus, the IR cut filter and IR pass filter combined with conventional color filters are considered successfully applicable to 3D image sensors.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2002년도 전력전자학술대회 논문집
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• pp.711-714
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• 2002

Thermal infrared camera have poor image qualities compared to commercial CCD cameras, as in contrast, brightness, and. resolution. To compensate the poor Image quality problems associated with the thermal infrared camera, the technique of superimposing thermal infrared image into real ccd image is proposed. The mobile robot KAEROT/m2, loaded with sensor head system at the mast, is entered to monitor leakage of heavy water and thermal abnormality of the calandria reactor area in overhaul period. The sensor head system is composed of thermal infrared camera and cod camera In parallel. When thermal abnormality on observation points and areas of calandria reactor area is occurred, unusual hot image taken from thermal infrared camera is superimposed on real CCD image. In this inspection experiment, more accurate positions of thermal abnormalities on calandria reactor area can be estimated by using technique of mapping thermal infrared image into CCD image, which include characters arranged in MPOQ order.

• 한국인터넷방송통신학회논문지
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• 제21권4호
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• pp.43-49
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• 2021

소형 적외선영상 호밍시스템은 지상의 표적에 대하여 주야간 적외선 영상처리를 통하여 표적을 식별하고 주요 표적에 대하여 표적을 탐색, 탐지하여 추적하는 적외선 영상센서를 보유한 추적시스템이다. 본 논문에서는 지상의 표적을 주야간 적외선 영상을 통하여 표적 정보를 획득하여 실시간 영상처리를 통하여 표적을 식별하기 위한 고속의 CPU와 FPGA(Field Programmable Gate Array)가 탑재된 보드 개발의 내용을 설명한다. CPU, FPGA 선정과 영상신호처리를 위한 CPU-FPGA 결합 아키텍처에 대하여 제안하고 또한 김발구조의 적외선센서를 제어하기 위한 FPGA를 활용에 대하여 설명한다.

• 센서학회지
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• 제9권1호
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• pp.44-50
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• 2000

적외선 센서는 대상 물체의 열 분포를 감지할 수 있고, 그것으로부터 얻은 영상은 물체 내부의 결함과 그 물체표면의 이물질 등의 효과가 모두 포함된 상태이므로 적외선 열 화상 자체만으로는 비정상적인 부분들을 찾아내기 어렵다. 따라서 본 논문에서는 적외선 센서로부터 얻은 영상을 가시화 하는 방법으로 가시광선 영상과의 중첩방법을 제시한다. 이를 위해서 평행이동 관계에 있는 두 가시광선 영상으로부터 열 화상에 대응하는 보간 영상을 생성하고, 이것을 적외선 센서에 의해 감지된 온도를 매핑한 열 화상과 중첩시킨다. 본 논문에서 제안한 가시화 기법은 적외선 센서의 특성을 최대한 고려할 수 있기 때문에 재해방지를 위한 비파괴 검사 등에 쓰여질 수 있다.

• 한국산학기술학회논문지
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• 제10권7호
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• pp.1503-1508
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• 2009

본 논문은 열적외선 카메라 이미지를 영상 처리 기법을 활용하여 실시간으로 구현하는데 그 목적이 있다. 열적외선 영상 데이터는 온도의 변화에 따라 Hot Mapping, Cool Mapping, Rainbow Mapping을 하였으며, 열적외선 이미지의 명암대비 기능을 알아보기 위해 히스토그램 영상처리 기법을 사용하였고, 물체의 구분을 위해서 열적외선 이미지의 에지 부분을 추출하였다. 또한 이미지에서 온도를 추출해 내기 위해 이미지 정보 프로그램을 만들어 온도를 측정할 수 있었다.

• 세라미스트
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• 제21권2호
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• pp.59-74
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• 2018

Imaging in the Short Wave Infrared (SWIR) provides several advantages over the visible and near-infrared regions: enhanced image resolution in in foggy or dusty environments, deep tissue penetration, surveillance capabilities with eye-safe lasers, assessment of food quality and safety. Commercially available SWIR imagers are fabricated by integrating expensive epitaxial grown III-V compound semiconductor sensors with Si-based readout integrated circuits(ROIC) by indium bump bonding Infrared image sensors made of solution-processed quantum dots have recently emerged as candidates for next-generation SWIR imagers. They combine ease of processing, tunable optoelectronic properties, facile integration with Si-based ROIC and good performance. Here, we review recent research and development trends of various application fields of SWIR image sensors and nano-materials capable of absorption and emission of SWIR band. With SWIR sensible nano-materials, new type of SWIR image sensor can replace current high price SWIR imagers.

• 한국기계가공학회지
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• 제4권4호
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• pp.34-38
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• 2005

This is a widespread requirement for low cost lightweight thermal imaging sensors for both military and civilian applications. Today, a large number of uncooled infrared detector developments are under progress due to the availability of silicon technology that enables realization of low cost IR sensor. System prices are continuing to drop, and swelling production volume will soon drive process substantially lower. The feasibility of micromechanical optical and infrared (IR) detection using microcantilevers is demonstrated. Microcantilevers provide a simple Structurefor developing single- and multi-element sensors for visible and infrared radiation that are smaller, more sensitive and lower in cost than quantum or thermal detectors. Microcantilevers coated with a heat absorbing layer undergo bending due to the differential stress originating from the bimetallic effect. This paper reports a micromachined silicon uncooled thermal imager intended for applications in automated process control. This paper presents the design, fabrication, and the behavior of cantilever for thermomechanical sensing.

• 우주기술과 응용
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• 제1권3호
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• pp.356-363
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• 2021

중적외선을 이용하여 획득한 영상은 상온 부근의 온도 측정에는 적당하지 않다는 것이 교과서적 상식이었으나, 최근 중적외선 센서를 이용한 위성 영상을 살펴보면 중적외선 센서를 이용하여 측정한 결과물도 상온 부근의 온도를 측정할 수 있다는 가능성을 보여주고 있다. 본 논문에서는 중적외선 센서를 가지는 위성영상의 상온 온도 정보 추출 가능성 및 정확도에 대해 살펴보고자 한다. 논문에서 검토된 중적외선 위성영상은 상온 부분의 온도를 잘 표시하였으며, 측정된 온도의 절대값으로서의 신뢰성에 관해서는, 태양광의 지표면 직접 반사에 의한 열전달량 영향과 대기에서 흡수되는 적외선 대기 흡수량의 영향은 비교적 작거나 일정한 값으로 볼 수 있지만, 비접촉식 온도계의 한계인 물성치의 의한 복사 계수(emissivity)의 불확실성 문제는 여전히 해결해야할 문제로 남아 있게 되었다.

• 센서학회지
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• 제27권5호
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.