• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.115-117
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• 2009

Interface dipole energies between interfacial layers with different thicknesses coated on indium tin oxides (ITOs) and 4,4'-bis[N-(1-naphtyl)-N-phenyl-amino]biphenyl are determined. After $O_2$ plasma treatment on thick-metal (>4 nm) coated ITO, the work function and interface dipole energy increased. In thin-metal (< 2 nm) coated ITO, no change in the interface dipole energy was found though the work function increased. Thus, the $O_2$ plasma treated thin (< 2 nm) interfacial layer reduced the hole injection barrier.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1199-1202
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• 2007

The improvement of the electron injection is of critical importance for obtaining efficient and stable organic light-emitting diodes(OLEDs). Here, we report some of our recent results on the development of new cathode interlayer materials for OLEDs. Some of our new materials show performance superior to that of LiF.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.515-518
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• 2002

In this paper, we demonstrate the impact of oxide interface-state on low temperature poly-Si TFTs. The TFTs with interface-state exhibit poor performance and serious degradation under hot carrier and gate bias stress. Our results indicate that the worse oxide integrity cause initial characteristic shift and device instability.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.225-228
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• 2009

We have demonstrated several effective intermediate connectors in tandem organic light-emitting devices (OLEDs) using doped or nondoped organic p-n heterojunction. The influence of n-type or p-type organic layer in intermediate connectors on device performance has been investigated based on the understanding of interfacial electronic structures.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.304-304
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• 2009

We may need to consider 'display' interface and product design as distinct from traditional user- and technologydriven product design. Technology-dominated product development may lead users to demand another 'technological improvement' rather than 'design improvement.' This cycle of product development may cause both users and producers to disregard the potential of 'display' technology and interface. We must develop a better understanding of significant and unique 'display' potential in comparison with 'real' world communications and current sociological and technological contexts.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1187-1188
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• 2009

In this paper we interface Tangible Devices (i.e. Haptic Devices) for 3D Virtual World based on MPEG-RoSE syntax. We called it Virtual World and Real World Interface (VRI). The VRI Technology project intends to provide virtual world information to real world and tangible experience to user of virtual world through tangible devices.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1305-1307
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• 2007

We show that the electrical properties of organic thinfilm transistors(OTFTs) can be enhanced by controlling the morphology of interface between screen printed electrodes and gate dielectrics. Modified surface of the insulator layer($SiO_2$) affect on the interface energy of electrode on $SiO_2$ layer. Contact angle measurement and FT-IR spectrum shows that the interface is properly modified. OTFTs device with high efficiency has been realized through modification of interface layer.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1737-1738
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• 2007

An intelligent remote controller for 3-D TV interface exploits an artificial system of human visual attention for an easy interaction.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1298-1300
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• 2007

The interface between SiNx and ZnO was investigated with Near Edge X-ray Absorption Fine Structure (NEXAFS) for ZnO based thin film transistor (TFT) applications. Impurity species were interstitial $N_2$ molecules at the SiNx / ZnO interface. The evolution of $N_2$ is decreased with increasing of anneal temperature.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1491-1494
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• 2008

Typically internal mobile LCD display modules are connected to the mobile product baseband PCB with flexible printed circuit board equipped with board-to-board connector. This solution has a drawback of limiting the product concept work to certain solutions that are based on connector size, location, flexible PCB length, bending, etc. in the display module. Also flexible printed circuit board based solutions are not completely optimized from reliability point of view, causing flex circuit board breakings. For the external displays in the PC or Home entertainment market, the cable solution is too expensive and resource demanding. The wireless solution has obvious advantages over reliability, low cost and flexibility. This paper describes a wireless audio-visual interface solution.