• Laser Solutions
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• v.16 no.2
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• pp.7-11
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• 2013

Recently advanced laser processing is widely introduced to improve the efficiency of micro part production and to reduce the rate of inferior goods. In this paper the trend of delamination of single layer with both thin copper and polyimide according to the variation of copper thickness was investigated using the coupled thermal-structural analysis of ANSYS. From these analyses results, some conclusions were obtained. Firstly, the maximum temperature was increasing with respect to decrease of copper thickness. Secondly the maximum strain which was in general estimation the main effect of the delamination was observed in case of the copper thickness of $5{\mu}m$. Finally the trend of the delamination was decreasing with increasing the thickness of copper layer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.355-356
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• 2006

This paper proposes an Molding error compensation method that improves accuracy with geometry information of injected parts using three-dimensional measuring instrument. a traditional mold design has been conducted by an experience-based trial and error, whereby generally the mold designer would decide the gate location and processing conditions. as a natural consequence, almost all creats inferior goods. It's just a process of trial and error and caught in a vicious circle. Due to this reason, this paper uses a three-dimensional measuring instrument, a commercial analysis package of injection molding(Moldflow, MPI) to analysis a state of flux. In addition to that axiomatic approach.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.2
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• pp.218-225
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• 2003

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. However, inferior goods may be made under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not apply this dicing method to a GaN wafer, because the GaN wafer is harder than other wafers such as SiO$_2$, GaAs, GaAsP, and AlGaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using a scriber.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.164-167
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• 2002

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer such as SiO$_2$, GaAs, CaAsP, and AlCaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using scriber.

• Journal of Korean Society for Quality Management
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• v.27 no.2
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• pp.201-217
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• 1999

Industrial Measuring Instrument is a general name of equipments or tools for measuring and weighing. Inaccurate measuring instruments produce inferior goods in spite of excellent experts, good materials and wonderful equipments. Three characteristics are important for measuring instruments: choosing the proper instruments for measuring, using them properly and managing them to keep accuracy and precision. The purpose of this thesis is to develope the management standard for effective control of measuring instruments by analysing the problems and the management conditions of 100 PPM certified companies out of the domestic small and medium manufacturing industry, which steadily carry out quality control.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.958-961
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• 2002

The optical disk drive is a basic option on the PC now. So the lower price and higher read/write speed goods are now on market. These trends make many difficulties to produce more reliable drives, comparing when they are treated as high price stuff. In mechanical terms, the lower price and higher read/write speed drive make higher vibration and noise, lower stiffness, even severe fracture of cheap and low quality disk, problems. Due to the internal crash of P/U inside of the drive, the failure of drives, inferior drives, increase more and more by the careless transportation and the originated low stiffness parts. This report is the introduction of the FE simple model to decrease the internal P/U crash problems, and the results.

• Journal of Ginseng Research
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• v.30 no.3
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• pp.158-164
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• 2006

The American ginseng is getting popular in the world market with cooling effects. This paper study history of the cooling effect of American ginseng. Most references include one's assertion on the cooling effect of American ginseng based on the old chinese believe. However, American ginseng was discovered in 1716 and export to China from mid 18 century. Concerning on the time period for clinical demonstration to get people's believe, it is not sufficient to conform the cooling effects of American ginseng. That is why the American ginseng was sold as an inferior goods compare oriental ginseng until mid 1970s. United State FDA also does not certify any effectiveness of Ginseng yet. However, it is important to study on the American ginseng because of rapid growth in the world ginseng market.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.401-406
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• 2005

According to the ubiquitous times that is new important topic, the miniature is demanded in the industry at large. The high accuracy and accumulation make the assembly equipment and the production equipment huge from the size of view. The huge equipment brings about the expensive price of the equipment, a low flexibleness and a low productivity. It makes the manufacturing equipment huge that the accuracy only depends on the mechanism stiffness. The position of two assembled parts is transformed with the global coordinate system whose datum is machine coordinate system. The purpose of this research is invention of the module that can adjust one part to the order part automatically. The module that has a function of self adjustment only takes a stiffness in assemble direction and can be moved freely in the other direction so this function makes a self adjustment. The self adjustment module reduces the tact time and also diminishes the inferior goods and makes reconfigurable machine in $\mu-part$ assembly.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.1
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• pp.91-97
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• 2000

In this paper, the illuminator is designed to recognize the shape and the existence of holes of radiation fin in the point that the light reflection characteristics are different according to the roughness of the material. The threshold value, the positions of holes and the black pixel nembers in the positon are obtained under the illuminator, in accordance with the reference image, by applying binary conversion and hole segmentation algorithm, as they are suggested in this paper, The existence and shape of hole are recognized by calculating the distance and feature value in the test image, which is obtained from the parameters of reference image. It is programmed to apply to GUI(Graphic User the Interface) in windows. More than 98% of recognition rate is shown, as it is applied to three different sizes of the radiation fin.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.1
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• pp.18-24
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• 2007

If an error occurs in a product that contains a source of vibration, an abnormal noise vibration will occur. Recently a system that has been modified from the previous method of noise detection-a method of appraising the quality of manufactured automobile part by using human ears-is being implemented in the industries of automobile parts. This new system distinguishes the product's vibration signals by measuring and analyzing the signals. Following the recent trend, it has been concluded that the appraisal process of Window Regulator Module needed an improvement. Thus, a vibration monitoring system using LabVIEW, which measures and analyzes vibration signals from a sector gear's connected part by using an accelerometer, has been developed. By analyzing the characteristics of vibration signals of both inferior and superior goods, now the quality of the product can be evaluated much more accurately.