• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.04a
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• pp.18-21
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• 2003

The effect of interface bonding strength on the recovery force of SMA wire reinforced polymer matrix composites was investigated by pullout test. Firstly, the recovery forces and transformation temperatures of various prestrained SMA wires were measured and 5% prestrained SMA wires were prepared for the reinforcements of composites. EPDM incorporated with 20vol% silicon carbide particles(SiCp) of 6, 12, $60{mutextrm{m}}$ size were used as matrix. Pullout test results showed that the interface bonding strength increased when the SiCp size decreased due to the increase of elastic modulus of matrix. Cyclic test of composites was performed through control of DC current at the constant displacement mode. The abrupt decrease of recovery force during cycle test at high current was occurred by thermal degradation of matrix. This was in good agreement with temperature related in the thermal degradation of matrix. The hysteresis of recovery force with respect to the temperature was compared between wire and composite and the hysterisis of composites was smaller than the wire due to less thermal conduction.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.4
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• pp.41-47
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• 2000

In this study, the purpose finds out the best welding conditions for bonding of electric wire by ultrasonic welding. The material was plastic-insulating low-voltage-cabels for automobiles. The experiment varied the values of welding time and welding pressure and fixed the values of amplitude and energy. With the facts, the best condition for ultrasonic welding to achieve bonding exactly is gained according to the size of the cross-sectional area of the cable, and the adhesive intensity is greatly influenced by the variables of welding time and welding pressure. Also when the welding time and welding time and welding pressure increase as the cross-sectional areas of the cable increase the welding result in gained exactly.

• Journal of Welding and Joining
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• v.14 no.5
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• pp.145-150
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• 1996

The variation of spatter generation in gas metal arc welding with welding conditions and wire compositions was investigated and interpreted in terms of arc stability. The transition range from a short circuit mode to a spray mode in the mixed gas welding showed an unstable arc and generated the largest amount of spatters. Titanium reduced spatters only in the globular mode of $CO_2$welding and silicon and manganese showed the same effect The effect of silicon and manganese, however, was no longer seen when titanium was added simultaneously to the wire. It is believed that deoxidizers easily form oxides on the anode and make the arc stable even in DCRP welding. The wires with deoxidizers also showed low short circuit frequency, resulting in the increase of large size spatters.

• Journal of Technologic Dentistry
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• v.33 no.4
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• pp.331-337
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• 2011

Purpose: The purpose of this study was to impact of force system change in finger spring that add helical coil one round on orthodontic force. Methods: The following conclusions were drawn from the experiment conducted after bending 90 samples with a CNC wire forming machine while changing the height and lumen size to 1mm - 3mm - 5mm and 2mm - 3mm - 4mm respectively in the coil of the force system in finger spring added with one wheel of helical coil of 18-8 stainless steel round wire (${\Phi}0.5mm$, spring hard) from Jinsung Co. in domestic market under the following conditions: Laboratory name = Instron 5942; Temperature($deg^{\circ}C$) = 18.00; Humidity(%) = 50.00; Rate 1 = 10.00000 mm/min; Compressive extension = 5.0mm. Results: When Coil height is 1, 3, 5mm and lumen size is 2, 3, 4mm reduce finger spring as mean value of compressive extension occasion maximum load(mN) increases as coil height rises, and lumen size grows to 5.0mm. And was expose that compressive load(mN) increases as coil position of finger spring rises and increase as lumen size is decrescent. Conclusion: As the adherence height of coil was raised from 1mm through 3mm to 5mm, compressive load increased. As the lumen size increased from 2mm through 3mm to 4mm, compressive load decreased. Therefore, these results suggest that it is desirable to lower the coil height and enlarge the lumen size to enhance the biomechanical efficiency of finger spring when manufacturing the finger spring for removable orthodontic devices.

• Journal of Welding and Joining
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• v.17 no.3
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• pp.36-43
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• 1999

The effect of Si content in welding wires on spattering characteristics and droplet transfer phenomena was studied. In MAG welding using 80% Ar-20% $CO_2$ shielding gas, spattering characteristics and droplet transfer phenomena were varied with Si content of wire. With increasing Si content, the spattering ratio and the ratio of large size spatter $(d\geq1.0mm)$ were increased. The increase of Si content in molten metal made surface tension increase due to reduction of oxygen content, which resulted from deoxidizing action of silicon. The increase of surface tension resulted in unstable transfer phenomena and arc instability in both short circuit and spray region. With changing Si content of wire, spattering characteristics and droplet transfer phenomena was directly influenced by the variation of surface tension, compared with the effect of arc stability.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Proceedings of the KIEE Conference
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• 2000.07e
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• pp.9-12
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• 2000

A new type electrolyzing cell with slits on parallel plate electrodes and wire-to-cylinder type electrode system has been proposed instead of the conventional parallel plate type. An investigation was carried out on the effect of the number and size of slits on ion precipitation and oxidant generation characteristics, evidenced by eliminated space charge limiting action and by elevated electric fields in active interelectrode spacing. And it is also studied on the effect of the diameter of wire electrode to ion precipitation and oxidant generation characteristics. With electrode with 48 slits, very oxidants generation water of 3.1 [ppmm] and 19.0 [ppmm] in positive electrode side were obtained with tap water and 0.1 [wt%] NaCl dissolved tap waterfed. In addition, with wire-to-cylinder type electrode system, it is found that oxidant contained water of 0.48 [ppmm] and 5.46 [ppmm] in positive electrode side were obtained with tap water and 0.1 [wt%] NaCl dissolved tap water fed for the case of discharge electrode diameter of 0.5 [$mm{\phi}$]. Consequently, very high ion precipitation and dense oxidant generation characteristics can be realized by having slits on the electrodes of conventional cell as these slits increase the electric fields and decrease the space charge limiting actions in interelectrode spacing.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.12 no.11
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• pp.963-971
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• 2000

In order to investigate the effects of an electric field on EHD(Electro-hydrodynamic) nucleate boiling hat transfer characteristics in a nonuniform electric field under saturated pool boiling, the basic study has been performed experimentally. In the present study, the working fluid is R-113 and the plate-wire electrode system is used to generate a steep electric field gradient. Boiling parameters are investigated by using a high speed camera. The electric field distribution around a wire is obtained to understand the effect of an electric field on bubble departure/movement. The experimental results show EHD effects are much more considerable when the applied voltage increases. Bubbles depart away from the heated wire in radial direction. It is confirmed that the mechanisms of EHD nucleate boiling are closely connected with the dynamic behavior of bubbles. The boiling parameters are significantly changed by the electric field strength. With increasing applied voltages, the bubble size decreases and the nucleation site density, bubble velocity and bubble frequency increase.

• The korean journal of orthodontics
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• v.41 no.5
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• pp.337-345
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• 2011

Objective: The purpose of this study was to evaluate the effect of force and moment produced by Nickel-titanium wires of different sizes at activation and deactivation according to differing vertical bracket displacement. Methods: Superelastic NiTi wires of 3 different sizes (0.014", 0.016", and 0.016" ${\times}$ 0.022") were tied with elastomeric or 0.009-inch stainless steel ligations in a twin-bracket, 0.018-inch slot. A testing machine recorded the effects of simulated activation of 5 distances from 1 to 5 mm and deactivation of 5 distances from 4 to 0 mm, in increments of 1 mm. Results: Frictional force increased the wire stiffness during loading. Ligation of 0.014-inch NiTi wire with O-ring resulted in a significant increase in the stiffness. On application of orthodontic force for 5 mm of vertical displacement of teeth, the effective displacement in the case of the 0.014", 0.016", and 0.016" ${\times}$ 0.022" NiTi wires was 2 mm, 3 mm, and 4 mm, respectively. Conclusions: Our results showed that movement of teeth with large vertical displacement was ineffective because of excessive friction. This finding might contribute to the understanding of the force system required for effective teeth movement and thereby facilitate the application of the appropriate light wire for leveling and alignment.

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.3
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• pp.105-124
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• 2011

TFT-LCD consists of LCD panel on the top, circuit unit on the side and BLU on the bottom. The recent development issues of BLU-dependent TFT-LCD have been power consumption minimization, slimmerization and size maximization. As a result of this trend, LED is adopted as BLU instead of CCFL to increase brightness and to reduce thickness. In liquid crystal displays, the light efficiency is below 10% due to the loss of light in the path from a light source to an LCD panel and presence of absorptive polarizer. This low efficiency results in low brightness and high power consumption. One way to circumvent this situation is to use a reflective polarizer between backlight units and LCD panels. Since a nano-wire grid polarizer has been known as a reflective polarizer, an idea was proposed that it can be used for the enhancement of the brightness of LCD. The use of reflective polarizing film is increasing as edge type LED TV and 3D TV markets are growing. This study has been carried out to fabrication of the nano-wire grid polarizer(NWGP) and investigated the brightness enhancement of LCD through polarization recycling by placing a NWGP between an c and a backlight unit. NWGPs with a pitch of 200nm were fabricated using laser interference lithography and aluminum sputtering and wet etching. And The NWGP fabrication process was using by the UV imprinting and was applied to plastic PET film. In this case, the brightness of an LCD with NWGPs was 1.21 times higher than that without NWGPs due to polarization recycling.