• Title/Summary/Keyword: InGaAsP

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Movpe Growth of InP/GaAs and GalnAs/GaAs from EDMln, TBP and TBAs (EDMln, TBP와 TBAs를 이용한 InP/GaAs와 GalnAs/GaAs의 MOVPE 성장)

  • 유충현
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.1
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    • pp.12-17
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    • 1998
  • The heteroepitaxial growth of InP and GaInAs on GaAs substrates has been studied by using a new combination of source materials: ethyldimethylindium (EDMIn) and trimethylgallium (TMGa) as group III sources, and tertiarybutylarsine (TBAs) and tertiarybutylphosphine (TBP) as group V sources. Device quality InP heteroepitaxial layers were obtained by using a two-step growth process under atmospheric pressure, involving a growth of an initial nucleation layer at low temperature followed by high temperature annealing and the deposition of epitaxial layer at a growth temperature. The continuity and thickness of nucleation layer were important parameters. The InP layers deposited at 500$^{\circ}$- 55$0^{\circ}C$ are all n-type, and the electron concentration decreases with decreasing TBP/EDMIn molar ratio. The excellent optical quality was revealed by the 4.4 K photoluminescence (PL) measurement with the full width at half maximum (FWHM) of 4.94 meV. Epitaxial Ga\ulcorner\ulcorner\ulcornerIn\ulcorner\ulcorner\ulcornerAs layers have been deposited on GaAs substrates at 500$^{\circ}$ - 55$0^{\circ}C$ by using InP buffer layers. The composition of GaInAs was determined by optical absorption measurements.

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Impact of Passivation and Reliability for Base-exposed InGaP/GaAs HBTs

  • Park, Jae-Woo
    • Transactions on Electrical and Electronic Materials
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    • v.8 no.3
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    • pp.115-120
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    • 2007
  • Reliability between passivated and unpassivated process with the base-exposed InGaP/GaAs HBTs was studied. A passivation of HBT was attempted by $SiO_2$ thin film deposition at $300^{\circ}C$ by means of PECVD. Base-exposed InGaP/GaAs HBTs before and after passivation were investigated and compared in terms of DC and RF performance. Over a total period of 30 days, passivated HBTs show only 2% degradation of DC current gain for the high current density of $40KA/cm^2$. The measured thermal resistance of $2{\times}30{\mu}m^2$ single emitter InGaP/GaAs HBT passivated with PECVD $SiO_2$ devices can be extracted and was founded to be 1430 K/W. The estimated MTTF was $2{\times}10^7hr\;at\;T_j=125^{\circ}C$ with an activation energy $(E_a)$ of 1.37 eV.

Study on InGaAs/InGaAsP/InP Quantum-dot Molecules for Quantum Interference devices (양자간섭소자를 위한 InGaAs/InGaAsP/InP 양자점 분자구조 연구)

  • Kim Jin-Soak;Kim Eun-Kyu;Jeong Weon-G.
    • Journal of the Korean Vacuum Society
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    • v.15 no.2
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    • pp.186-193
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    • 2006
  • In this study, we analyzed the electrical and optical properties of metalorganic chemical vapor deposition grown InGaAs/InGaAsP/InP quantum dot(QD) molecules by using photoluminescence and deep-level transient spectroscopy. From these resulte, the energy levels of the large QDs are located at deeper region from the conduction band edge of the barrier than that of the small QDs, The large QDs seem to have the energy states more than two, and these energy levels of the QD molecules are located at 0.35, 0.42, and 0.45 eV from conduction band edge under -4 V reverse bias conditions. The energy levels are closely coupled under low reverse bias, and then decoupled as the bias voltage is increased.

Effect of trimethyl-indium source depletion on InGaAsP epilayer grown by MOCVD (Trimethyl-indium 소스 고갈에 따른 InGaAsP 에피층의 특성 변화)

  • 김현수;오대곤;편광의;최인훈
    • Journal of the Korean Vacuum Society
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    • v.9 no.4
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    • pp.400-405
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    • 2000
  • We investigated the effect of TMIn (trimethly-indium) source depletion on InGaAs, InGaAsP and 1.55 $\mu\textrm{m}$ InGaAs/InGaAsP SMQW by using EPISON ultrasonic monitor for measuring the concentration of metalorganic/carrier gas mixtures. And the problems for the growth reproducibility in MOCVD was solved by using an EPISON ultrasonic monitor with closed-loop mode under the condition of TMIn source depletion. The saturation pressure of TMIn was dramatically decreased over consumption of 80%. In the case of bulk epilayer, Up-shifting of 300 arcsec to Ga-rich direction and FWHM broadening by a factor of two in DCXRD spectrum were observed due to the TMIn source depletion. In the case of SMQW, Up-shifting of 300 arcsec to Ga-rich direction in DCXRD spectrum and blue-shift of 40 nm in PL spectrum were observed due to the TMIn source depletion. However, good reproducibility ($\Delta\theta$<$\pm$100 arcsec) was achieved even the condition of 95% of TMIn consumption, when we used the EPISON with closed-loop mode.

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A study on waveguide properties of InGaAs/InGaAsP GRINSCH MQW laser (InGaAs/InGaAsP GRINSCH MQW 구조의 파동길잡이 성질 연구)

  • 김동철;유건호
    • Korean Journal of Optics and Photonics
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    • v.7 no.3
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    • pp.272-279
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    • 1996
  • A simple transfer matrix algorithm to analyze the properties of 2 dimensional waveguides is introduced. We applied this algorithm to strained InGaAs/InGaAsP GINSCH MQW laser structures. We studied how optical confinement factor and effective refractive index, which are important in calculating the modal gain, depend on the structure parameters such as waveguide width, shape of GRIN, and number of quantum wells. Especially we suggested that the concept of effective waveguide width is very useful in understanding the GRINSCH waveguide.

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Simulation Study on the Breakdown Characteristics of InGaAs/InP Composite Channel MHEMTs with an InP-Etchstop Layer (InP 식각정지층을 갖는 MHEMT 소자의 InGaAs/InP 복합 채널 항복 특성 시뮬레이션)

  • Son, Myung Sik
    • Journal of the Semiconductor & Display Technology
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    • v.12 no.4
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    • pp.21-25
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    • 2013
  • This paper is for enhancing the breakdown voltage of MHEMTs with an InP-etchstop layer. The fully removed recess structure in the drain side of MHEMT shows that the breakdown voltage enhances from 2 V to 4 V in the previous work. This is because the surface effect at the drain side decreases the channel current and the impact ionization in the channel at high drain voltage. In order to increase the breakdown voltage at the same asymmetric gate-recess structure, the InGaAs channel structure is replaced with the InGaAs/InP composite channel in the simulation. The simulation results with InGaAs/InP channel show that the breakdown voltage increases to 6V in the MHEMT as the current decreases. In this paper, the simulation results for the InGaAs/InP channel are shown and analyzed for the InGaAs/InP composite channel in the MHEMT.

Study of Selective Etching of GaAs-based Semiconductors using High Density Planar Inductively Coupled $BCl_3/CF_4$ Plasmas (고밀도 평판형 유도결합 $BCl_3/CF_4$ 플라즈마에 의한 GaAs 계열반도체의 선택적 식각에 관한 연구)

  • Choi, Chung-Ki;Park, Min-Young;Jang, Soo-Ouk;Yoo, Seung-Ryul;Lee, Je-Won;Song, Han-Jung;Jeon, Min-Hyon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.46-47
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    • 2005
  • 이번 연구는 $BCl_3/CF_4$ 플라즈마를 사용하여 반도체소자 제조 시 널리 이용되는 GaAs 계열반도체 중 대표적인 재료인 GaAs/AlGaAs 및 GaAs/InGaP 구조를 선택적으로 건식 식각한 후 분석한 것이다. 공정변수로는 ICP 소스파워를 0-500W, RIE 파워를 0-50W 그리고 $BCl_3/CF_4$ 가스 혼합비를 중점적으로 변화시켰다. $BCl_3$ 플라즈마만을 사용한 경우 (20$BCl_3$, 20W RIE power, 300W ICP source power, 7.5mTorr) 는 GaAs:AlGaAs의 선택비가 0.5:1 이었으며 이때 GaAs의 식각률은 ~2200${\AA}/min$ 이었으며 AlGaAs의 식각률은 ~4500${\AA}/min$ 이었다. 식각 후 표면의 RMS roughness은 < 2nm로 깨끗한 결과를 보여주었다. 15% $CF_4$ 가스가 혼합된 $17BCl_3/3CF_4$, 20W RIE power, 300W ICP source power, 7.5mTorr의 조건에서 3분 동안 공정한 결과 순수한 $BCl_3$ 플라즈마만을 사용한 경우보다 표면은 다소 거칠었지만 (RMS roughness: ~8.4) GaAs의 식각률 (~980nm/min)과 AlGaAs와 InGaP에 대한 GaAs의 선택도 (GaAs:AlGaAs=16:1, GaAs:InGaP=38:1)는 크게 증가하였다. 그리고 AlGaAs 및 InGaP의 경우 식각 시 나타난 휘발성이 낮은 식각 부산물 ($AlF_3:1300^{\circ}C$, $InF_3:1200^{\circ}C$)로 인하여 50nm/min 이하의 낮은 식각률을 보였고, 62.5%의 $CF_4$가 혼합된 $7.5BCl_3/12.5CF_4$플라즈마의 조건에서는 AlGaAs 및 InGaP에 대한 GaAs의 선택도가 각각 280:1, 250:1을 나타내었다.

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In Vitro Magnetometric Evaluation far Toxicity to Alverolar Macrophage of Arsenic Compounds (In Vitro 자계(磁界) 측정에 의한 비소화합물의 폐포 Macrophage 독성 평가)

  • Cho, Young-Chae
    • Journal of Preventive Medicine and Public Health
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    • v.32 no.4
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    • pp.467-472
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    • 1999
  • Objectives: This study was conducted to evaluate the cytotoxicity of gallium arsenide(GaAs), indium phosphide(InP) and indium arsenide(InAs) all of which are used a$ the semiconductor eletments in semiconductor industry. Methods: Cytotoxicity id the alveolar macrophage was evaluated by the measurement of in vitro magnetometry, LDH release assay and histological examination. Results: The relaxation curves by the in vitro magnetometry showed that GaAs has the cytotoxicity for the alveolar macrophage which is more significant in the higher dosages, while this cytotoxicity is not appeared in the groups added with InP or InAs or PBS. In the decay constant for two minutes after magnetization, GaAs-added groups showed a significant decrease with increasing doses, but both InP- and InAs-added groups did not show any significance. The LDH release assay showed a dose-dependent increasing tendency in the GaAs-, InP- and InAs-added groups. In terms of cellular morphological changes, GaAs-added groups revealed such severe cellular damages as prominent destructions in cell membranes and their morphological changes of nucleus, while InP- and InAs-added groups remained intact in intracellular structures, except for cytoplasmic degenerations. Conclusions: It is suggested that GaAs is more influential to cytotoxicity of alveolar macrophages than InP and InAs.

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Formation of ITO ohmic contact to $n^{+}$-InP for InP/lnGaAs HPT's fabrication (InP/AnGaAs HPT's 제작을 위한 $ITO/n^+$-InP Ohmic contact 특성 연구)

  • 황용한;한교용
    • Proceedings of the IEEK Conference
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    • 2001.06b
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    • pp.213-216
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    • 2001
  • The use of a thin film of indium between the ITO and the $n^{+}$-InP contact layers for InP/InGaAs HPTs was studied without degrading its excellent optical transmittance properties. ITO/$n^{+}$-InP ohmic contact was successfully achieved by the deposition of Indium and thermal annealing. The specific contact resistance of about 6.6$\times$$10^{-4}$$\Omega\textrm{cm}^2$ was measured by use of the transmission line method (TLM). However, as the thermal annealing was just performed to ITO/$n^{+}$-InP contact without the deposition of Indium between ITO and $n^{+}$-InP, it exhibited schottky characteristics. In the applications, the DC characteristics of InP/InGaAs HPTs with ITO emitter contacts was compared with that of InP/InGaAs HBTs with the opaque emitter contacts.

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The Double Balance Mixer Design with the Characteristics of Low Intermodulation Distortion, and Wide Dynamic Range with Low LO-power using InGaP/GaAs HBT Process (InGaP/GaAs HBT공정을 이용하여 낮은 LO파워로 동작하고 낮은 IMD와 광대역 특성을 갖는 이중평형 믹서설계)

  • S. H. Lee;S. S. Choi;J. Y. Lee;J. C. Lee;B. Lee;J. H. Kim;N. Y. Kim;Y. H. Lee;S. H. Jeon
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.14 no.9
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    • pp.944-949
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    • 2003
  • In this paper, the double balance mixer(DBM) for Ku-band LNB using InGaP/GaAs HBT process is suggested for the characteristics of low DC power consumption, low noise figure, low intermodulation distortion and wide dynamic range. The 5 dB conversion gain, 14 dB NF, bandwidth 17.9 GHz and 50.34 dBc IMD are obtained under RF input power of -23 dBm, with bias condition as 3 V and 16 mA. The linearity of InGaP/GaAs HBT, the broad band input matching scheme and the optimization of bias point result in the low IMD, the broad bandwidth and the low power consumption characteristics.