• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.563-564
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• 2006

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.2
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• pp.171-176
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• 2001

This study focuses on the energy partition and heat flux distribution in creep-feed grinding. From the measurements of transient grinding temperature in the workpiece which the thermocouple was embedded, the overall energy partition to the workpiece was estimated with moving heat source theory using the developed scalene triangle heat model. The energy partition was calculated as 3.75% in down grinding smaller than 5.3% in up grinding. Also, the scalene triangle heat model was confirmed as the most optional heat model in correspond to the experimental data. Then, the heat flux distribution was calculated from temperature responses. The heat flux is negative behind the grinding zone where fluid was applied. In this experimental result, the total heat flow to the workpiece per unit width obtained by integrating the positive heat flux was 0,7W/mm for down grinding.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.5
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• pp.58-64
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.946-949
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• 2001

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametral silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpiece are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipped with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6nm in Ra.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.7
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• pp.70-77
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• 2003

The centerless through-feed grinding is performed by passing the workpiece between the grinding wheel and the regulating wheel. So, the amount of removed material around the leading end, of the workpiece is always more than that around the trailing end until the leading end leaves the grinding wheel. Because of this, there are differences in diameters along the workpiece axis during grinding, and workpiece axis is not parallel to the grinding wheel axis and the contact lines between the workpiece and wheels. Thus the ground workpiece shows tapering error inherently. To eliminate this error, the workpiece axis must be kept to be parallel to the grinding wheel axis. And, the direction of the workpiece axis can be controlled by the work-rest blade. Therefore, the effects of work-rest blade inclination angle on the through-feed centerless ground part are investigated in this study. As a result, it is found that there is a positive inclination angle of the work-rest blade for minimizing the tapering error of a ground workpiece.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.555-556
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• 2006

In recent years, the higher flatness level in wafer shape has been strictly demanded with a high integration of the semiconductor devices. It has become difficult for a conventional wafer preparing process to satisfy those demands. In order to meet those demands, surface grinding with in-feed grinder is adopted. In an in-feed grinding method, a chuck table fur fixing a semiconductor wafrr rotates on its rotation axis with a slight tilt angle to the rotation axis of a cup shaped grinding wheel and the grinding wheel in rotation moves down to grind the wafer. So, stability of the grinder structure is very important to aquire a wafer of good quality. This paper describes the features of the in-feed grinder and some FEM analysis results of the grinder structure.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.5-10
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• 2003

• Journal of the Korean Society for Nondestructive Testing
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• v.11 no.2
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• pp.32-41
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• 1991

This paper is to analyze the surface roughness in wet and dry surface grinding in which working conditions are table feed, cross feed and down feed. FFT analyzer is used to identify the surface roughness and the data of surface roughness are stored and displayed using an interfaced computer. In results, components affecting surface roughness exist within 200Hz with respect the conditions and methods of grinding operation. Also, with increase of table feed, cross feed and down feed, the value of surface roughness increases. Of them, cross feed has first influence on surface roughness. In dry, preciser surface can be obtained than one in wet.

• Journal of the Korean Society for Precision Engineering
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• v.10 no.1
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• pp.62-69
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• 1993

The accuracy of machine tools is the major factor concerned with the acuracy of the processed work. The feed errors of feed system in machine tool, therfore, make the machining errors of work directly on processing. In this point, this study focused on the generative elements of feed errors in CNC cylindrical grinding machine, such as supporting method of ball screw, the effect of pitch and yaw error and the position detecting method in servo system when operating its shaft of grinding wheel head. Furthermore, in order to improve the driving accuracy of this machine tool, feed errors are measured by a laser interferometer. Results obtained in this study provide some useful informations to attain high accuracy of CNC machine tool.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.155-159
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• 2002

This paper has studied to obtain the grinding characteristics and optimal grinding conditions of ceramics in the grinding with diamond wheel by Taguchi method. Feed rate was most important factor to the surface roughness. In the case of 4{Si_3}{N_4}$ and ${A1_2}{O_3}$, surface roughness value were small at 3m/min of feed rate. In the case of $ZrO_2$. surface roughness value was small at 4m/min of feed rate. Surface roughness have much influenced by major load for the :ii3N4 and $ZrO_2$. On the other hand, ${A1_2}{O_3}$ have more influenced by grain shedding of brittle fracture phenomenon. The major factors affecting the surface roughness and the optimum grinding conditions were obtained with minimum experiment using Taguchi method.