• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.555-556
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• 2006

In recent years, the higher flatness level in wafer shape has been strictly demanded with a high integration of the semiconductor devices. It has become difficult for a conventional wafer preparing process to satisfy those demands. In order to meet those demands, surface grinding with in-feed grinder is adopted. In an in-feed grinding method, a chuck table fur fixing a semiconductor wafrr rotates on its rotation axis with a slight tilt angle to the rotation axis of a cup shaped grinding wheel and the grinding wheel in rotation moves down to grind the wafer. So, stability of the grinder structure is very important to aquire a wafer of good quality. This paper describes the features of the in-feed grinder and some FEM analysis results of the grinder structure.

• Journal of the Korean Wood Science and Technology
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• 제49권4호
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• pp.328-335
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• 2021

Considerable differences exist in the characteristics of size reduction and classification because of biomass species. Miscanthus sacchariflorus (M. sacchariflorus) Goedae-Uksae 1 is not used efficiently because of the imperfections of the processing technology for this biomass. Therefore, for the best use of specific biomass, improvement in the feedstock preparation of the biomass for processing, such as pellet manufacturing, is necessary. In this study, a laboratory-scale cone grinder and air classifier were designed and combined to investigate the performance of the combination system for M. sacchariflorus. The average equivalent spherical diameter of particles showed a close relationship with air velocity for air classification. The air velocity range to classify proper particles for pelletization was determined to be 6.0-6.8 m/s. The mass ratios of the collected particles to feed mass for four lengths of chopped M. sacchariflorus were 45.1%:46.1%, 39.1%:46.6%, and 44.1%:52.8% at the first, second, and third steps in simulating the multistep combination system, respectively.

• 대한인간공학회지
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• 제26권1호
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• pp.29-37
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• 2007

This study was performed to evaluate the characteristics of transmitted vibration to hand-arm system under different work posture while operating a light-weighted powered hand grinder. For the experiment, 8 different types of wrist posture (natural, unlar-flexion, radual-flexion, flexion, extension, complex posture, and etc.) and 3 types of feed force (20[N], 50[N], 70[N]) were considered. 10 male subjects were employed to polish metal plate with a hand grinder. All of them were normal and healthy with no history and symptom of the work related musculoskeletal disorders in the dominant hand. Vibration acceleration data were recorded with sampling rate, 2048[Hz]. In addition, unweighted overall R.M.S. acceleration at the tool and wrist, and transmissibility between them were used to evaluate factors from the recorded tri-axial vibration acceleration. The results indicate that transmissibility of natural wrist posture was significantly higher than others. In addition, as the feed force becomes larger, the vibration was transmitted in large quantities to hand-arm system through radius.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.563-564
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• 2006

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.20-23
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• 2002

In silicon wafer manufacturing process, the grinding process has been adopted to improve the quality of wafer such as flatness, roughness and so on. This paper describes the effect of grinding process on the surface quality of wafer. The experiments are carried out by high precision in fred grinder with air bearing spindle. The relationship between the inclination of chuck table and the flatness of wafer is investigated, and the effect of grinding conditions including wheel speed, table speed, and feed rate on damage depth and roughness of wafer is also investigated. The experimental results show that there is close relationship between the inclination of the chuck table and the flatness of wafer, and the grinding conditions within this paper little affect the flatness of wafer and relatively high affect the damage depth of wafer.

• 산업경영시스템학회지
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• 제20권43호
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• pp.47-57
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• 1997

As a general index in surface quality of machined products, surface roughness is to measure worker's skill level, a ground product quality and machining accuracy, etc. The surface roughness is defined by a function of rotational speed and radius of a grinding wheel, distances of active grains composed of the wheel, and feed of a grinder's worktable. To predict surface roughness in horizontal surface grinding operations, probability distributions were used. Probability distribution functions(p.d.f.) of surface roughness were found as results when the size of active grains(=the radius of a grinding wheel) is given as uniform, exponential distribution, and the distance between active grains follows the distributions of uniform, exponential. For each pdf case, probabilistic features of surface roughness were also analyzed and presented. This study is a substantial step for determining mathematically the surface roughness instead of using empirical approaches. More works should be presented to develop a general model by which an accurate roughness value can be obtained in horizontal surface grinding operations.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1998년도 춘계학술대회 논문집
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• pp.59-64
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• 1998

We need to achieve th mass product through methods of higher efficient, higher precise manufacturing process than those of existing precision abrasive machining. Thus, this study is to develop mirror-like surface machining technique of outer diameter of the piston pin by the compound magneto-electrolytic abrasive polishing system. The procedure of machining is followed as first, fulfill the pre-processing by cylindrical grinder, second, complete mirror-like surface by the method of magneto-electrolytic abrasive polishing used CBN non-woven abrasive pads. In this study, it was found that the best suitable conditions of mirror-like surface polishing were that the electrode density was 0.1A/$\textrm{cm}^2$, the applied pressure 1.5kgf/$\textrm{cm}^2$, the feed rate 0.5mm/rev, and the rotoation velocity of workpiece 80rpm, and that the surface roughness was reduced in this conditions.

• 한국산학기술학회논문지
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• 제20권11호
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• pp.7-12
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• 2019

반도체 시장에서 소재 개발 및 제조 공법에 대한 연구는 꾸준히 진행되고 있다. 일반적으로 자동 로봇용 End Effector는 알루미나(Al₂O₃)와 탄화규소(SiC) 등의 세라믹이 사용되었다. 본 연구는 대량생산이 가능한 분말 성형 프레스 법을 통해 반도체 현장에서 사용되는 블랙 알루미나를 개발하였다. 그리고 알루미나와 블랙 알루미나를 자동 로봇의 End Effector에 적용될 수 있도록 평면 연삭기를 사용하여 연삭가공을 실시하였다. 연삭가공을 통해 블랙 알루미나 대한 표면 거칠기(Ra)를 비교·분석하여 최적의 절삭 조건을 확인 할 수 있었다. 알루미나 표면 거칠기는 이송 속도가 0.72mm/sec이고 회전수가 1,700 rpm에서 0.4876 ㎛로 가장 양호하였다. 블랙 알루미나 표면 거칠기는 대부분의 절삭 조건에서 0.2 ㎛이하의 정밀도를 나타내었으며, 이송 속도가 0.72mm/sec이고 회전수가 1,900 rpm에서 0.1364 ㎛로 가장 양호하였다. 블랙 알루미나의 표면 거칠기는 알루미나 보다 0.35 ㎛ ~ 0.47 ㎛ 정도 양호하였다.