• Title/Summary/Keyword: Impact ionization

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A study on the electron transport properties in HgCdTe using monte carlo method (몬테칼로 방법을 사용한 HgCdTe에서의 전자 전송 특성에 관한 연구)

  • 유상동;곽계달
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.2
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    • pp.40-51
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    • 1998
  • Electron transport properties are investigated by Monte Carlo simulation in n-HgCdTe. The material is easily degenerated at low temperature or being slightly doped, and is characterized by small band gap and large nonparabolic factor. The degeneracy is incorporated in the Monte Carlo simulation by taking into account the electron-electron scattering and the pauli exclusion principle. In the conventional method, however, the electron-electron scattering rate was developed under the assumption of parabolic conduction band. A new formulation of the electron-electron scattering rate is develop considering the band nonparabolicity and overlap integral. The electron-electron scattering effects on the electron distribution,impact ionization coefficienty, electron temperature, drift velocity and electron energy are presented.

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A Study on the Relationships between Substrate Bias Potential and Ion Energy Distributions (이온 플레이팅에서 기판 BIAS 전위와 이온 에너지 분포와의 상관관계 연구)

  • Sung, Y.M.;Shin, J.H.;Son, J.B.;Cho, J.S.;Park, C.H.
    • Proceedings of the KIEE Conference
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    • 1995.11a
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    • pp.472-474
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    • 1995
  • A Sputter ion Plating(SIP) system with a r.f. coil electrode and the Facing Target Sputter(FTS) source was designed for high-quality thin film formation. The rf discharge was combined with DC facing target sputtering in order to enhance ionization degree of a sputtered atoms. The energy of ions incident on the substrate depended on the health potential of DC biased substrate. The mean impact ion energy increased with negative bias voltage and rf power. The adhesive force of the TiN film formed was in the range of 30$\sim$50N, and markedly influenced by substrate bias voltage.

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Urinary Metabolism and Excretion of Carbinoxamine after Oral Administration to Man

  • Jung, Byung-Hwa;Chung, Bong-Chul;Park, Jong-Sei
    • Biomolecules & Therapeutics
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    • v.4 no.3
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    • pp.251-256
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    • 1996
  • The metabolism of carbinoxamine, 2-[(4-chlorophenyl)-2-pyridinyl-methoxy]-N, N-dimethylethaneamine, was studied in adult male volunteers after an oral dose of 15 mg. Solvent extracts of urine obtained with or without enzyme hydrolysis were analyzed by gas chromatography-mass spectrometry after derivatization with MSTFA/TMSCl (N-methyl-N-trimethylsilyltrifluoroacetamide/trimethyl chlorosilane). The structures of metabolites were determined based on the electron impact (EI) and chemical ionization (CI) mass spectra. Nonconjugated metabolites identified in the urine were carbinoxamine, nor-carbinoxamine, and bits-nor-carbinoxamine. Parent drug, nor-carbinoxamine, and bits-nor-carbinoxamine were also detected as conjugated forms. These metabolites observed in human urine were different from those previously reported in the rat. Urinary excretions of carbinoxamine were reached to maxima in 4 hours after drug administration with 4.9%-8.1% and 2.5-4.2% of the dose excreted during 24 h as carbinoxamine and its glucuronide, respectively.

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A Study on Breakdown Voltage of GaAs Power MESFET's (GaAs Power MESFET의 항복전압에 관한 연구)

  • 김한수;김한구;박장우;기현철;박광민;손상희;곽계달
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.27 no.7
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    • pp.1033-1041
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    • 1990
  • In this paper, under pinch-off conditions, the gate-drain breakdown voltage characteristics of GaAs Power MESFET's as a function of device parameters such as channel thickness, doping concentration, gate length etc. are analyzed. Using the Green's function, the gate ionic charge induced by the depleted channel ionic charge is calculated. The impact ionization integral by avalanche multiplication between gate and drain is used to investigate breakdown phenomena. Especially, the localized excess surface charge effect as well as the uniform surface charge effect on breakdown voltage is considered.

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Electrical properties of SOI n-MOSFET's under nonisothermal lattice temperature (격자온도 불균일 조건에서 SOI n-MOSFET의 전기적 특성)

  • 김진양;박영준;민홍식
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.3
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    • pp.89-95
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    • 1996
  • In this ppaer, temeprature dependent transport and heat transport models have been incorperated to the two dimensional device simulator SNU-2D provides a solid bse for nonisothermal device simulation. As an example to study the nonisothermal problem. we consider SOI MOSFET's I-V characteristics have been simulated and compared with the measurements. It is shown that negative slopes in the Ids-Vds characteristics are casused by the temperature dependence of the saturation velocity and the degradation of the temperature dependence mobility. Also it is shown that the kink effect occurs when impact ionization near the drain produces a buildup of holes in this isolated device island, and the hysteresis is caused by the creation of holes in the channel and their flow to the source.

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Dependence of deep submicron CMOSFET characteristics on shallow source/drain junction depth (얕은 소오스/드레인 접합깊이가 deep submicron CMOSFET 소자 특성에 미치는 영향)

  • 노광명;고요환;박찬광;황성민;정하풍;정명준
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.4
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    • pp.112-120
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    • 1996
  • With the MOsES (mask oxide sidewall etch scheme)process which uses the conventional i-line stepper and isotropic wet etching, CMOSFET's with fine gate pattern of 0.1.mu.m CMOSFET device, the screening oxide is deposited before the low energy ion implantation for source/drain extensions and two step sidewall scheme is adopted. Through the characterization of 0.1.mu.m CMOSFET device, it is found that the screening oxide deposition sheme has larger capability of suppressing the short channel effects than two step sidewall schem. In cse of 200.angs.-thick screening oxide deposition, both NMOSFET and PMOSFET maintain good subthreshold characteristics down to 0.1.mu.m effective channel lengths, and show affordable drain saturation current reduction and low impact ionization rates.

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Study of performance and characteristics of InP-composite channel MHEMT for High Breakdown Voltage (높은 항복전압을 위한 InP 합성 채널 MHEMT의 성능과 특성에 대한 연구)

  • Choi, Seok-Gyu;Beak, Young-Hyun;Han, Min;Lee, Seong-Dea;Rhee, Jin-Koo
    • Proceedings of the IEEK Conference
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    • 2006.06a
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    • pp.467-468
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    • 2006
  • To perform the comparative study, we experimented on two differential epitaxial structures, the conventional Metamorphic High Electron Mobility Transistor (MHEMT) using the InAlAs/InGaAs structure and the InP-composite channel MHEMT adopting the InAlAs/InGaAs/InP/n-InP structure. Compared to the conventional MHEMT, the InP-composite channel MHEMT shows improved breakdown performance; over about 3.5 V. This increased breakdown voltage can be explained by the lower impact ionization coefficient of the InP-composite channel MHEMT than that of the conventional MHEMT.

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Influence of Channel Length on the Performance of Poly-Si Thin-Film Transistors (다결정 실리콘 박막 트랜지스터의 성능에 대한 채널 길이의 영향)

  • 이정석;장창덕;백도현;이용재
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.450-453
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    • 1999
  • In this paper, The relationship between device performance and channel length(1.5-50$\mu$m) in polysilicon thin-film transistors fabricated by SPC technology was Investigated by measuring electric Properties such as 1-V characteristics, field effect mobility, threshold voltage, subthreshold swing, and trap density in grain boundary with channel length. The drain current at ON-state increases with decreasing channel length due to increase of the drain field, while OFF-state current (leakage current) is independent of channel length. The field effect mobility decrease with channel length due to decreasing carrier life time by the avalanche injection of the carrier at high drain field. The threshold voltage and subthreshold swing decrease with channel length, and then increase in 1.5 $\mu$m increase of increase of trap density in grain boundary by impact ionization.

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Anode and Cathode Traps in High Voltage Stressed Silicon Oxides (고전계 인가 산화막의 애노우드와 캐소우드 트랩)

  • 강창수;김동진
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.461-464
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    • 1999
  • This study has been investigated that traps generated inside of the oxide and at the oxide interfaces by the stress bias voltage. The traps are charged near the cathode with negative charge and charged near the anode with positive charge. The charge state of the traps can easily be changed by application of low voltages after the stress high voltage. These trap generation involve either electron impact ionization processes or high field generation processes. It determined to the relative traps locations inside the oxides ranges from 113.4$\AA$ to 814$\AA$ with capacitor areas of 10$^{-3}$ $\textrm{cm}^2$ . The oxide charge state of traps generated by the stress high voltage contain either a positive or a negative charge.

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Changes in the Optogalvanic Signal Amplitude in a Hollow Cathode Discharge

  • Lee, Jun-Hoi;Koo, Kyung-Wan;Lee, Ki-Sik
    • Transactions on Electrical and Electronic Materials
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    • v.10 no.6
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    • pp.212-216
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    • 2009
  • The spatial distribution of the optogalvanic (OG) signal in argon at the 801.489 nm ($1s_5-2p_8$ transition at the metastable level in Paschen notation) was investigated in the radial direction of a hollow cathode discharge tube. The results of this experiment showed that the OG signal amplitude decreases in accordance with the following two conditions; first, the level of discharge current and second, the distance from the cathode dark space. These results can be quantified by analyzing the electron density profile along the discharge regions, which can directly influence the collisional ionization induced by electron impact.