• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.47-54
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• 2008

In this paper, we studied how and why did abnormal IMC growth at component affect on board level mechanical reliability. First, interfacial reactions between Sn2.5Ag0.5Cu solder and electrolytic Ni/Au UBM of component side were investigated with reflow times and thermal aging time. Also, to compare mechanical reliability of component level, shear energy was evaluated using the ball shear test conducted with variation of shear tip speed. Finally, to evaluate mechanical reliability of board level, we surface-mounted component fabricated with each condition on PCB side. After conducting of 3 point bending test and impact test, we confirmed solder joint crack mode using cross-sectioning and dye & pry penetration method.

• Korean Journal of Applied Biomechanics
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• v.20 no.4
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• pp.447-455
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• 2010

The objective of this study was to analyze the difference in kinematic variables for successful and unsuccessful golf putting strokes. The study population included 8 male secondary school golf players who had played golf for over 3 years and whose handicap was 4 or lower. A hole was made on a 5-m-long artificial flat mat for practice, and an environment similar to that of a real green was created. The participants' motions were analyzed through 3D image analysis, and the difference in kinematic variables for successful and unsuccessful putting strokes in the same direction was determined. Data analysis revealed the following findings: The time spent for a segment of putting was the greatest for the backswing segment for both successful and unsuccessful strokes. During address and impact, the both changed to a larger extent. For successful putting strokes, the change in the elbow angle during the downswing was greater for the right elbow than for the left elbow. For both successful and unsuccessful putting strokes, the left shoulder angle increased during the segment from address to the turning point and decreased during the segment from the turning point to impact. In contrast, the right shoulder angle significantly differed between successful and unsuccessful putting strokes only during address. During successful and unsuccessful motions, the swing was executed with the moving displacement of the X-axis of the club head maintained almost constant along a straight light without back and forth movement. In the backswing segment, moving displacement of the Y- and Z-axes was greater in successful strokes than in unsuccessful strokes; however, this difference was very small for the Y-axis. The velocity of the club head for successful and unsuccessful motions significantly differed during address and at the turning point. The highest velocity of the ball was greater for successful than for unsuccessful putting strokes.

• Korean Journal of Applied Biomechanics
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• v.18 no.3
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• pp.43-80
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• 2008

The purpose of this research is to analysis the swing of driver used by professional golfers during on-season. In order to collect on-season driver swings of research objects, which are three KPGA(Korean Professional Golfer Association) professional golfers, measurements were carried out right after the last game of a season. The analysis range was set to down-swing point while analysis was conducted to after-impact, release point. As a result, systematic process between leading segments of the previous precise kinematic analysis research seems to turn up the same. However, there were different results compared to the preceding research. All three testers expressed adduction of left hand which could not be described with forming cocking angle, in consequence, adduction of left hand does not have a big effect on formation of cocking. Moreover, chest movement right before the impact; which was emphasized in previous research, the direction was not opposite but the same with the ball.

• The Journal of the Acoustical Society of Korea
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• v.40 no.6
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• pp.607-614
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• 2021

Research on elevator noise has mainly focused on the cause of its occurrence and measures to reduce it. There is still insufficient research on how to accurately measure and evaluate elevator noise. There is a measurement method established as an international standard for the measurement method, but it is also difficult to apply to high-rise apartments, and there are many cases that do not closely reflect the characteristics of elevator noise. In order to solve this problem, a study was conducted to improve the elevator noise measurement method in the current standard. In this study, the characteristics of elevator noise were closely identified. Through frequency analysis of the elevator noise and other equipment, it was verified that the elevator noise is noise with different characteristics from other equipment. Elevator noise was compared with heavy floor impact noise, which is a representative structural transmission noise, as structural transmission noise. Elevator noise was compared with heavy floor impact noise, which is a representative structural transmission noise, as structural transmission noise. The correlation between bang machine and rubber ball was found to be very high at 0.9 level. As a result, it was verified that the mid-low frequency band of the elevator noise is the main structural transmission noise and cannot be evaluated together with other equipment.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.41-47
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• 2010

The effect of PCB and BGA pad designs was investigated on the mechanical property of Pb-free solder joints. The mechanical property of solder joint was tested by three different test methods of drop impact tests, bending impact test, and high speed shear test. Two kinds of pad design such as NSMD (Non-Solder Mask Defined) and SMD (Solder Mask Defined) were applied with the OSP finished Pb-free solder (Sn-3.0Ag-0.5Cu, Sn-1.2Ag-0.5Cu). in the drop impact test and bending impact test, the characterized lifetime showed the same tendency, and SMD design showed better mechanical property of solder joint than NSMD regardless of test method, which was due to the different crack path. The fracture crack on SMD pad was propagated along the intermetallic compound (IMC) layer of solder joint, while the fracture crack on NSMD pad propagated through upper edge of land which shields pattern. In the high speed shear test, pad lift occurred on the solder joint of NSMD. SMD/SMD combination of pad design consequently illustrated the best mechanical property of BGA/PCB solder joint, followed by SMD/NSMD, NSMD/SMD, and NSMD/NSMD.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.7
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• pp.605-613
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• 2014

Scanning white-light interferometry is an important measurement option for many surfaces. However, serious profile measurement errors can be present when measuring free-form surfaces being highly curved or tilted. When the object surface slope is not zero, the object and reference rays are no longer common path and optical aberrations impact the measurement. Aberrations mainly occur at the beam splitter in the interference objective and from misalignment in the optical system. Both effects distort the white-light interference signal when the surface slope is not zero. In this paper, we describe a modified version of white-light interferometry for eliminating these measurement errors and improving the accuracy of white-light interferometry. Moreover, we report systematic errors that are caused by optical aberrations when the object is not flat, and compare our proposed method with the conventional processing algorithm using the random ball test.

• Journal of Mechanical Science and Technology
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• v.18 no.9
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• pp.1604-1613
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• 2004

This paper presents an effective and reliable evaluation method for fracture strength and material degradation of the micro-structure of high temperature service steel weldment using advanced small punch (ASP) test developed from conventional small punch (CSP) test. For the purpose of the ASP test, a lower die with a minimized ${\Phi}$1.5 mm diameter loading ball and an optimized deformation guide hole of ${\Phi}$3 mm diameter were designed. The behaviors of fracture energy (E$\_$sp/), ductile-brittle transition temperature (DBTT) and material degradation from the ASP test showed a definite dependency on the micro-structure of weldment. Results obtained from ASP test were compared and reviewed with results from CSP test, Charpy impact test, and hardness test. The utility and reliability of the proposed ASP test were verified by investigating fracture strength, behavior of DBTT, and fracture location of each micro-structure of steel weldment for test specimen in ASP test. It was observed that the fracture toughness in the micro-structure of FL＋CGHAZ and ICHAZ decreased remarkably with increasing aging time. From studies of all micro-structures, it was observed that FGHAZ microstructure has the most excellent fracture toughness, and it showed absence of material degradation.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.2
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• pp.225-231
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• 2012

Drop simulations of the board level in the flip chips with solder joints have been highlighted for years, recently. Also, through the study on the life prediction of thermal fatigue in the flip chips considering underfill, its importance has been issued greatly. In this paper, dynamic analysis using the implicit method in the Finite Element Analysis (FEA) is carried out to assess the factors effecting on flip chips considering underfill. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard is modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. Modal analysis is simulated to find out the relation between drop impact and vibration of the board system.

• Journal of Powder Materials
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• v.2 no.2
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• pp.135-141
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• 1995

As the first step of study on fabrication of ceramic powders from phytoliths in rice, especially in rice husks, pulverization method of rice husks and the properties of milled rice husks were investigated. Impact methods, such as ball milling, were not meaningful for pulverizing elastic and thin fabric structure of rice husks. The most effective one was cutting method. In the present work, a rotating knife cutting method was applied to pulverizing rice husks. A 40-mesh screen was inserted under the rotating knives. The most portion of the milled powder was found in -50/+100 mesh section. Morphology of the milled rice husks revealed that the husks larger than 70 mesh were flake-like shape, at -70/+100 mesh section relatively equi-axed shape, at -170/+325 mesh section rod-like shape, and below 325 mesh section dust-like shape. Tap density of raw rice husks was about 0.1 $g/cm^3$, while those of milled rice husks were over $0.4 g/cm^3$. This meant that, for a given volume of reactor, raw material charge can be increased more that 4 times when using milled rice husks than unmilled one. True densities of unmilled and milled rice husks were higher than $1.4 g/cm^3$, and increased with decreasing milled sizes.

• The Journal of Asian Finance, Economics and Business
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• v.6 no.4
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• pp.139-145
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• 2019

This study examines the dynamic linkages between food price inflation and its volatility in the context of Sri Lanka. The empirical evidence derived from the monthly data for the period from 2003M1 to 2017M12 for Sri Lanka. The relationship between inflation rate and inflation volatility has attracted more attention by theoretical and empirical macroeconomists. Empirical studies on the relationship between food inflation and food inflation variability is scarce in the literature. Food price inflation is defined as log difference of food price series. The volatility of a food price inflation is measured by conditional variance generated by the FIGARCH model. Preliminary analysis showed that food inflation is stationary series. Granger causality test reveals that food inflation seems to exert positive impact on inflation variability. We find no evidence for inflation uncertainty affecting food inflation rates. Hence, the findings of the study supports the Friedman-Ball hypothesis in both cases of consumer food price inflation and wholesale food price inflation. This implies that past information on food inflation can help improve the one-step-ahead prediction of food inflation variability but not vice versa. Our results have some important policy implications for the design of monetary policy, food policy thereby promoting macroeconomic stability.