• 전기학회논문지
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• 제61권3호
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• pp.472-478
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• 2012

The inspection machine in PCB (printed circuit board) assembly line checks assembly errors by inspecting the images inside of the component inspection region. The component inspection region consists of region of component package and region of soldering. It is necessary to extract the regions automatically for auto-teaching system of the inspection machine. We propose an image segmentation method to extract the component inspection regions automatically from images of PCB. The acquired image is transformed to HSI color model, and then segmented by several regions by clustering method. We develop a modified K-means algorithm to increase the accuracy of extraction. The heuristics generating the initial clusters and merging the final clusters are newly proposed. The vertical and horizontal projection is also developed to distinguish the region of component package and region of soldering. The experimental results are presented to verify the usefulness of the proposed method.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 학술회의 논문집 정보 및 제어부문 A
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• pp.291-294
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• 2003

In this paper, 2D and 3D inspection algorithm for printed solder on PCB is introduced. The aim of inspection is the detection of error such as rich solder poor solder and missing solder. For Inspection, laser distance sensor is used. For 2D inspection, laser image that is created by normalizing laser data between 0 and 255 are used. Reference Image is made using gerber file. Image processing algorithm is used for 2D inspection. By adding thickness of metal stencil to laser image, volume for solder can be calculated and 3D inspection is carried out.

• 제어로봇시스템학회논문지
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• 제10권1호
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• pp.66-72
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• 2004

To assess tunnel safety, cracks in tunnel lining are measured by inspectors, who observe cracks with their naked eyes and record them. But manual inspection is slow, and measured crack data is subjective. Therefore, this study proposes inspection system fur measuring cracks in tunnel lining and providing objective crack data to be used in safety assessment. The system consists of On-vehicle system and Laboratory system. On-Vehicle system acquires image data with line CCD camera on scanning along the tunnel lining. Laboratory system extracts crack information from the acquired image using image processing. Measured crack information is crack thickness, length and orientation. To improve accuracy of crack recognition, the geometric properties and patterns of cracks in concrete structure were applied to image processing. The proposed system was verified with experiments in both laboratory environment and field environment such as subway tunnel.

• 한국멀티미디어학회논문지
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• 제14권3호
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• pp.356-367
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• 2011

본 논문에서는 차 엔진의 누수 방지를 위한 실링 처리 후 실링 처리 영역에 대한 정확도를 검사하는 새로운 알고리즘을 제안하고, 실제 생산라인에서 동작하는 자동차 엔진 실링검사 시스템을 개발하였다. 검사 방법은 기존에 제안된 영상처리 기법에 기반을 두는 세 가지 검사 방법들이 갖는 설치의 어려움, 높은 계산의 복잡도, 유사 색 기름에 의한 실링검사 성능 저하 등의 여러 가지 단점을 해결하고 저 비용의 시스템을 개발하기 위해 개발되었다. 제안하는 시스템은 기존의 방법에서 적용하지 않은 설링 전후의 차영상을 활용하는 기법을 이용하여 다양한 환경변화에 적응적이며, 고정형 카메라 1대로 검사가 가능한 저 비용 시스템이다. 실제 생산라인에서의 비교 실험을 통해 제안하는 실링검사 방법은 기존의 생산라인에서 적용되고 있는 세 가지 다른 방법들에 비해 높은 실링검사 정확도를 보여 성능의 우수성을 입증하였다.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2004년도 춘계학술대회 논문집
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• pp.479-485
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• 2004

The purpose of this study is to develop a practical image inspection system that could recognize it correctly, endowing flexibility to the productive field, although the same object for work will be changed in the size and rotated. In this experiment, it selected a fighter, rotating the direction from $30^{\circ}\;to\;45^{\circ}$ simultaneously while changing the size from 1/4 to 1/16, as an object inspection without using another hardware for exclusive image processing. The invariant moments, Hu has suggested, was used as feature vector moment descriptor. As a result of the experiment the image inspection system developed from this research was operated in real-time regardless of the chance of size and rotation for the object inspection, and it maintained the correspondent rates steadily above from 94% to 96%. Accordingly, it is considered as the flexibility can be considerably endowed to the factory automation when the image inspection system developed from this research is applied to the productive field.

• 한국멀티미디어학회논문지
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• 제12권3호
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• pp.397-408
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• 2009

영상 학습은 컴퓨터를 이용한 자동 시각 검사에서 매우 중요하고 어려운 문제이다. 최근 생산되는 인쇄회로 기판(PCB : Printed Circuit Board)은 부품의 크기가 작아지고 회로 패턴이 점점 복잡해져서 신제품의 개발 주기가 짧고 다양한 제품들을 검사해야 하는 분야에서 어렵고 복잡한 학습 과정은 큰 문제가 되고 있다. 본 논문은 CAD(Gerber: 거버)파일을 이용하여 PCB 자동 시각 검사의 기준이 되는 참조 영상을 생성하였다. Gerber 파일로 생성된 참조 영상은 결함이 없는 PCB 패턴을 보장한다. 시스템의 구현과 실험을 통하여 Gerber 파일을 이용하여 PCB 자동 시각 검사 시스템의 학습 과정을 손쉽게 할 수 있는 방안을 제시하였다.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1996년도 춘계학술대회 논문집
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• pp.24-29
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• 1996

The seniconductor, which is precision product, requires many inspection processes. The surface conditions of the semiconductor chip effect on the functions of the semiconductors. The defects of the chip surface is crack or void. Because general inspection method requires many inspection processes, the inspection system which searches immediately and preciselythe defects of the semiconductor chip surface. We propose the inspection method by using the computer vision system. This study presents an image processing algorithm for inspecting the surface defects(crack, void)of the semiconductor test samples. The proposed image processing algorithm aims to reduce inspection time, and to analyze those experienced operator. This paper regards the chip surface as random texture, and deals with the image modeling of randon texture image for searching the surface defects. For texture modeling, we consider the relation of a pixel and neighborhood pixels as noncasul model and extract the statistical characteristics from the radom texture field by using the 2D AR model(Aut oregressive). This paper regards on image as the output of linear system, and considers the fidelity or intelligibility criteria for measuring the quality of an image or the performance of the processing techinque. This study utilizes the variance of prediction error which is computed by substituting the gary level of pixel of another texture field into the two dimensional AR(autoregressive model)model fitted to the texture field, estimate the parameter us-ing the PAA(parameter adaptation algorithm) and design the defect detection filter. Later, we next try to study the defect detection search algorithm.

• 융합신호처리학회논문지
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• 제22권4호
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• pp.185-192
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• 2021

용접 비드의 불량유무를 판단하기 위하여 다양한 방법들이 제안되어왔으며, 최근에는 센서 자료 검사와 영상 자료 검사가 꾸준히 발표되고 있다. 센서 자료 검사는 정확도가 높고, 2차원 기반의 영상 자료 검사는 용접된 비드의 위치를 파악할 수 있다는 장점이 있다. 하지만 센서 자료만으로 분석 할 경우 정확한 위치에 용접이 되었는지 파악하기가 어렵다. 반면 영상 자료 방법은 잡음과 측정오차가 발생하여 정확도가 높지 않다. 본 논문에서는 평균 전압, 평균 전류, 혼합가스인 센서 자료 검사와 영상 검사 방법을 융합함으로써 각 검사 방법들의 단점을 보완하고 장점을 높여서 정확도를 향상시키고 검사 속도를 높일 수 있는 방법과 이를 소프트웨어로 구현하였다. 그리고 그래픽 사용자 인터페이스(graphical user interface; GUI)를 이용하여 분석을 수행하고 검사에 사용된 자료와 검사 결과를 확인할 수 있도록 하여 사용자가 편리하고 직관적으로 분석을 수행하고 결과를 파악할 수 있도록 하고자 한다. 이 때 각 센서 자료의 특성을 이용하여 센서 검사가 수행되고, 모폴로지 축지적 활성화 윤곽선을 적용하여 영상 자료가 검사된다. 실험 결과를 통하여 98%의 정확도를 보였으며, 네 개의 용접 영상과 센서 자료 검사를 모두 수행할 경우 검사 시간은 약 1.9초로서 용접공정에서 실시간 검사기로 사용 가능한 소프트웨어의 성능을 보였다.

• 한국기계가공학회지
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• 제8권2호
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• pp.25-31
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• 2009

The image processing methods are widely used in many industrial fields to detect defections in inspection devices. In this study an image processing method was conducted for the detection of abnormal pixels in a OLED(Organic Light Emitting Diode) type panel which is used for small size displays. The display quality of an OLED device is dependent on the pixel formation quality. So, among the so many pixels, to find out the faulty pixels is very important task in manufacturing processing or inspection division. We used a line scanning type BW(Black & White) camera which has very high resolution characteristics to acquire an image of display pixel patterns. And the various faulty cases in pixel abnormal patterns are considered to detect abnormal pixels. From the results of the research, the normal BW pixel image could be restored to its original color pixel.

• 반도체디스플레이기술학회지
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• 제19권3호
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• pp.12-18
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• 2020

In semiconductor manufacturing, defect detection is critical to maintain high yield. Currently, computer vision systems used in semiconductor photo lithography still have adopt to digital image processing algorithm, which often occur inspection faults due to sensitivity to external environment. Thus, we intend to handle this problem by means of using Mask R-CNN instead of digital image processing algorithm. Additionally, Mask R-CNN can be trained with image dataset pre-processed by means of the specific designed digital image filter to extract the enhanced feature map of Convolutional Neural Network (CNN). Our approach converged advantage of digital image processing and instance segmentation with deep learning yields more efficient semiconductor photo lithography inspection system than conventional system.