• Journal of Korea Multimedia Society
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• v.12 no.3
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• pp.397-408
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• 2009

Image training is a very important yet difficult state for automated visual inspection using computers. Because the size of parts for the recently produced PCB (Printed Circuit Board) becomes smaller and circuit patterns gradually become more complex, a difficult and complex training process is becoming a big problem within an industry where development cycle for new products is short and various products must be inspected. This research produced a reference image by using CAD (Gerber) file which becomes a standard for PCB automatic visual inspection. Reference image from a Gerber file guarantees PCB patterns with no defects. Through system implementation and experimentation, Gerber file is used in order to propose a plan which allows an easy training process for PCB automatic visual inspection system.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1996.03a
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• pp.24-29
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• 1996

The seniconductor, which is precision product, requires many inspection processes. The surface conditions of the semiconductor chip effect on the functions of the semiconductors. The defects of the chip surface is crack or void. Because general inspection method requires many inspection processes, the inspection system which searches immediately and preciselythe defects of the semiconductor chip surface. We propose the inspection method by using the computer vision system. This study presents an image processing algorithm for inspecting the surface defects(crack, void)of the semiconductor test samples. The proposed image processing algorithm aims to reduce inspection time, and to analyze those experienced operator. This paper regards the chip surface as random texture, and deals with the image modeling of randon texture image for searching the surface defects. For texture modeling, we consider the relation of a pixel and neighborhood pixels as noncasul model and extract the statistical characteristics from the radom texture field by using the 2D AR model(Aut oregressive). This paper regards on image as the output of linear system, and considers the fidelity or intelligibility criteria for measuring the quality of an image or the performance of the processing techinque. This study utilizes the variance of prediction error which is computed by substituting the gary level of pixel of another texture field into the two dimensional AR(autoregressive model)model fitted to the texture field, estimate the parameter us-ing the PAA(parameter adaptation algorithm) and design the defect detection filter. Later, we next try to study the defect detection search algorithm.

• Proceedings of the IEEK Conference
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• 2003.07e
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• pp.2335-2338
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• 2003

This paper presents a real-time PCB (Printed Circuit Board) vision inspection system. This system can detect the OPEN and SHORT of the PCB which of the line width is 150$\mu\textrm{m}$. Our PCB inspection system is based on the referential method. Since the size of the captured PCB image is very large, the image is divided into 512${\times}$512 images to apply the accurate alignment efficiently. To correct the misalignment between the reference image and the inspection image, pattern matching is performed. In order to implement the proposed algorithm in real-time, we use the SIMD instruction and the double buffering structures. Our experiential results show the effectiveness of the developed inspection algorithm.

• Textile Coloration and Finishing
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• v.21 no.1
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• pp.53-58
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• 2009

A real-time inspection system has been developed by combining CCD based image processing algorithm and a standard lighting equipment. The system was tested for defective fabrics showing nozzle contact scratch marks, which were one of the frequently occurring defects. Multi-resolution analysis(MRA) algorithm were used and evaluated according to both their processing time and detection rate. Standard value for defective inspection was the mean of the non-defect image feature. Similarity was decided via comparing standard value with sample image feature value. Totally, we achieved defective inspection accuracy above 95%.

• Proceedings of the Optical Society of Korea Conference
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• 2008.07a
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• pp.403-404
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• 2008

This report described the development of Vision Inspector program which can simulate numerically the image acquisition process of Machine Vision System for automatic optical inspection of any products. The program consists of an illuminator, a product to be inspected, and a camera with image sensor, and the final image obtained by ray tracing.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.05a
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• pp.569-571
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• 2010

In this paper, we develop a vision inspection system for inspecting flaws on plastic products such as insufficient moldings, spots, scratches. The inspection algorithm for this system consist of image binarization for curved structure of plastic products, image noise removal using morphology operation, labeling methods for candidate regions and image filtering and calibration method for flaw inspection. In order to improve its performance, we also develop fast image processing algorithm based on GUI. To verify the effectiveness of this system, we conducted evaluation for the system accuracy and the inspection algorithm processing time.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.140.2-140
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• 2001

In this paper, we develop the system which inspects the metal mask using area scan camera and belu type xy-table and introduce its inspection algorithm. Thes whole area of the metal mask is divides into several inspection block and the sixe of a inspection block is decided by FOV(Field of View). To compare with the camera image of each block, the reference image is made by gerber file. The ratation angle of the metal mask is calculated through the linear equation that is substituted two end points of horizontal boundary of a specific hole in a camera image for. To calculate the position error caused by belt type xy-table, hough-transform using the distances among the holes in two images os used. The center of the reference image is moved as much as the calculated position error to be coincide with the camera image ...

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.5
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• pp.444-452
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• 2008

This paper presents an overall image processing approach of defect inspection of patterned TFT-LCD panels for the real manufacturing process. A prototype of AOI(Automatic Optical Inspection) system which is composed of air floating stage and multi line scan cameras is developed. Adjacent pattern comparison algorithm is enhanced and used for pattern elimination to extract defects in the patterned image of TFT-LCD panels. New region merging algorithm which is based on border expansion is proposed to identify defects from the pattern eliminated defect image. Experimental results show that a developed AOI system has acceptable performance and the proposed algorithm reduces environmental effects and processing time effectively for applying to the real manufacturing process.

• Journal of Korea Multimedia Society
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• v.24 no.9
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• pp.1203-1210
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• 2021

In this paper, we developed the inspection system of electric vehicle pouch battery using image processing. Line scan cameras are used for acquiring the all parts of the pouch battery, and several steps of image processing for extracting significant dimensions(User Required Position) of the battery. In image processing, edge lines, node points, dimension lines, etc. were extracted using Preprocessor, Square Edge Detection, and Size Detection algorithms. This is used to measure the dimensions of the location requested by the user on the pouch battery. For verification of the inspection system, the dimensions of three pouch batteries produced in the same process were measured, and the mean and standard deviation were obtained to confirm the precision.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.2
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• pp.225-230
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• 2009

We propose a template matching method for component inspection of SMD assembly system. To discriminate wrong assembled components, the input image of component is matched with its standard image by template matching algorithm. For a fast inspection system, the calculation time of matching algorithm should be reduced. Since the standard images of all components located in a PCB are stored in computer, it is desirable to reduce the memory size of standard image. We apply the discrete wavelet transformation to reduce the image size as well as the calculation time. Only 7% memory of the BMP image is used to discriminate goodness or badness of components assembly. Comparative results are presented to verify the usefulness of the proposed method.