• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08a
• /
• pp.51-54
• /
• 2007

Top-emission 3.5 inch qVGA IOD (Inverted AMOLED) was fabricated with inverted EL structure driven by a-Si TFT backplane. In order to get stable driving TFT, we used FCP(Field Control Plate) layer which was connected with the source of the driving TFT. And we developed planarization process to planarize the cathode layer which was the bottom layer of inverted OLED. Our unique IOD structure is “a-Si TFT/ Al(Cathode)/ LiF/ LG-201(ETL)/ EML(RGB)/ HTL/ LG-101(HIL & Buffer layer)/ IZO(Anode)”. LG-201(ETL) layer was studied for more efficient electron injection from cathode to EML, and LG-101(HIL & Buffer layer) covered by IZO anode was also explored for decreasing the EL surface damage.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.48 no.6
• /
• pp.1-6
• /
• 2011

A transparent oxide thin film transistors (Transparent Oxide-TFT) have been fabricated by RF magnetron sputtering at room temperature using amorphous indium zinc oxide (a-IZO) as both of active channel and source/drain, gate electrodes and co-sputtered $HfO_2-Al_2O_3$ (HfAIO) as gate dielectric. In spite of its high dielectric constant > 20), $HfO_2$ has some drawbacks including high leakage current and rough surface morphologies originated from small energy band gap (5.31eV) and microcrystalline structure. In this work, the incorporation of $Al_2O_3$ into $HfO_2$ was obtained by co-sputtering of $HfO_2$ and $Al_2O_3$ without any intentional substrate heating and its structural and electrical properties were investigated by x-ray diffraction (XRD), atomic force microscopy (AFM) and spectroscopic ellipsometer (SE) analyses. The XRD studies confirmed that the microcrystalline structures of $HfO_2$ were transformed to amorphous structures of HfAIO. By AFM analysis, HfAIO films (0.490nm) were considerably smoother than $HfO_2$ films (2.979nm) due to their amorphous structure. The energy band gap ($E_g$) deduced by spectroscopic ellipsometer was increased from 5.17eV ($HfO_2$) to 5.42eV (HfAIO). The electrical performances of TFTs which are made of well-controlled active/electrode IZO materials and co-sputtered HfAIO dielectric material, exhibited a field effect mobility of more than $10cm^2/V{\cdot}s$, a threshold voltage of ~2 V, an $I_{on/off}$ ratio of > $10^5$, and a max on-current of > 2 mA.

• Journal of the Institute of Electronics and Information Engineers
• /
• v.50 no.7
• /
• pp.115-121
• /
• 2013

We fabricated thin film transistors (TFTs) using TiInZnO(TiIZO) thin films as active channel layer. The thin films of TiIZO were deposited at room temperature by RF-magnetron co-sputtering system from InZnO(IZO) and Ti targets. We examined the effects of titanium addition by X-ray diffraction, X-ray photoelectron spectroscopy and the electrical characteristics of the TFTs. The TiIZO TFTs were investigated according to the radio-frequency power applied to the Ti target. We found that the transistor on-off currents were greatly influenced by the composition of titanium addition, which suppressed the formation of oxygen vacancies, because of the stronger oxidation tendency of Ti relative to that of Zn or In. A optimized TiIZO TFT with rf power 40W of Ti target showed good performance with an on/off current ratio greater than $10^5$, a field-effect mobility of 2.09 [$cm^2/V{\cdot}s$], a threshold voltage of 2.2 [V] and a subthreshold swing of 0.492 [V/dec.].

• Bulletin of the Korean Chemical Society
• /
• v.35 no.2
• /
• pp.494-500
• /
• 2014

Indium-doped zinc oxide nanocrystals (IZO NCs), capped with stearic acid (SA) of different sizes, were synthesized using a hot injection method in a noncoordinating solvent 1-octadecene (ODE). The ligand exchange process was employed to modify the surface of IZO NCs by replacing the longer-chain ligand of stearic acid with the shorter-chain ligand of butylamine (BA). It should be noted that the ligand-exchange percentage was observed to be 75%. The change of particle size, morphology, and crystal structures were obtained using a field emission scanning electron microscope (FE-SEM) and X-ray diffraction pattern results. In our study, the 5 nm and 10 nm IZO NCs capped with stearic acid (SA-IZO) were ligand-exchanged with butylamine (BA), and were then spin-coated on a thermal oxide ($SiO_2$) gate insulator to fabricate a thin film transistor (TFT) device. The films were then annealed at various temperatures: $350^{\circ}C$, $400^{\circ}C$, $500^{\circ}C$, and $600^{\circ}C$. All samples showed semiconducting behavior and exhibited n-channel TFT. Curing temperature dependent on mobility was observed. Interestingly, mobility decreases with the increasing size of NCs from 5 to 10 nm. Miller-Abrahams hopping formalism was employed to explain the hopping mechanism insight our IZO NC films. By focusing on the effect of size, different curing temperatures, electron coupling, tunneling rate, and inter-NC separation, we found that the decrease in electron mobility for larger NCs was due to smaller electronic coupling.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.33 no.2
• /
• pp.93-98
• /
• 2020

We investigated the effect of a post-annealing process using ultraviolet (UV) light on the electrical properties of solution-processed InZnO (IZO) thin-film transistors (TFTs). UV light was irradiated on IZO TFTs for different time periods of 0s, 30s, and 90s. We measured transfer and retention stability curves to evaluate the performance of the fabricated TFTs. In addition, we measured height, amplitude, and phase AFM images to analyze changes in the surface and morphology of the devices. AFM measurements were performed by setting the drive amplitude of the cantilever tip to 47.9 mV in tapping mode, then dividing the device surface into 500 nm × 500 nm. In the case of IZO TFT irradiated with UV for 30s, the electron mobility and I_on/I_off ratio were improved, the threshold voltage was reduced by approximately 2 V, and the subthreshold swing also decreased form 1.34 V/dec to 1.11 V/dec.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2007.11a
• /
• pp.76.2-76.2
• /
• 2007

• Journal of the Institute of Electronics and Information Engineers
• /
• v.50 no.2
• /
• pp.98-103
• /
• 2013

In this work, we investigated the enhanced performance of IZO-based TFTs with $HfSiO_x$ gate insulators. Four types of $HfSiO_x$ gate insulators using different diposition powers were deposited by co-sputtering $HfO_2$ and Si target. To simplify the processing sequences, all of the layers composing of TFTs were deposited by rf-magnetron sputtering method using patterned shadow-masks without any intentional heating of substrate and subsequent thermal annealing. The four different $HfSiO_x$ structural properties were investigated x-ray diffraction(XRD), atomic force microscopy(AFM) and also analyzed the electrical characteristics. There were some noticeable differences depending on the composition of the $HfO_2$ and Si combination. The TFT based on $HfSiO_x$ gate insulator with $HfO_2$(100W)-Si(100W) showed the best results with a field effect mobility of 2.0[$cm^2/V{\cdot}s$], a threshold voltage of -0.5[V], an on/off ratio of 5.89E+05 and RMS of 0.26[nm]. This show that the composition of the $HfO_2$ and Si is an important factor in an $HfSiO_x$ insulator. In addition, the effective bonding of $HfO_2$ and Si reduced the defects in the insulator bulk and also improved the interface quality between the channel and the gate insulator.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.7
• /
• pp.437-440
• /
• 2017

We report on amorphous thin-film transistors (TFTs) with indium zinc oxide (IZO) channel layers that were fabricated via a solution process. We prepared the IZO semiconductor solution with 0.1 M indium nitrate hydrate and 0.1 M zinc acetate dehydrate as precursor solutions. The solution- processed IZO TFTs showed good performance: a field-effect mobility of $7.29cm^2/Vs$, a threshold voltage of 4.66 V, a subthreshold slope of 0.48 V/dec, and a current on-to-off ratio of $1.62{\times}10^5$. To investigate the static response of our solution-processed IZO TFTs, simple resistor load-type inverters were fabricated by connecting a $2-M{\Omega}$ resistor. Our IZOTFTbased N-MOS inverter performed well at operating voltage, and therefore, isa good candidate for advanced logic circuits and display backplane.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2015.08a
• /
• pp.205-205
• /
• 2015

최근, 비정질 산화물 반도체를 이용한 TFT는 투명성, 유연성, 저비용, 저온공정이 가능하기 때문에 차세대 flat-panel 디스플레이의 back-plane TFT로써 다양한 방면에서 연구되고 있다. 산화물 반도체 In-Zn-O-시스템에서는 Gallium (Ga)을 suppressor로 사용한 a-In-Ga-Zn-O (a-IGZO) 뿐만 아니라, Magnesium (Mg), Hafnium (Hf), Tin (Sn), Zirconium (Zr) 등의 다양한 물질이 연구되었다. 그 중 Silicon (Si)은 Ga, Hf, Sn, Zr, Mg과 같은 suppressor에 비해 구하기 쉬우며 가격적인 측면에서도 저렴하다는 장점이 있다. solution 공정으로 제작한 산화물 반도체 TFT는 진공 시스템을 사용한 공정보다 공정시간이 짧고, 저비용, 대면적화가 가능하다는 장점이 있다. 하지만, 투명하고 유연한 device를 제작하기 위해서는 저온 공정과 low thermal budget은 필수적이다. 이러한 측면에서 MWI (Microwave Irradiation)는 저온공정이 가능하며, 짧은 공정 시간에도 불구하고 IZO 시스템의 산화물 반도체의 전기적 특성 향상을 기대할 수 있는 효율 적인 열처리 방법이다. 본 연구에서는 In-Zn-O 시스템의 TFT에서 silicon (Si)를 Suppressor로 사용한 a-Si-In-Zn-O (SIZO) TFT를 제작하여 두 가지 열처리 방법을 사용하여 TFT의 전기적 특성을 확인하였다. 첫 번째 방법은 Box Furnace를 사용하여 N2 분위기에서 $600^{\circ}C$의 온도로 30분간 열처리 하였으며, 두 번째는 MWI를 사용하여 1800 W 출력 (약 $100^{\circ}C$)에 2분간 열처리 하였다. MWI 열처리는 Box Furnace 열처리에 비해 저온 공정 및 짧은 시간에도 불구하고 향상된 전기적 특성을 확인 할 수 있었다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.369-369
• /
• 2012

본 연구에서는 투명한 산화물반도체 a-IGZO 박막을 채널층로 사용하여 박막형트랜지스터를 제작하였고, 이를 이용하여 증가 및 공핍모드를 가지는 인버터소자를 제작하였다. 제작된 인버터는 4인치 유리기판위에 게이트, 채널 그리고 소스/드레인 영역을 스퍼터링방식으로 증착하였고, PECVD를 사용하여 SiNx 절연막을 증착하였다. 또한 투명소자에 응용하기위해 게이트, 소스, 드레인 영역을 투명한 a-IZO 박막으로 증착하였다. 제작된 인버터의 특성은 높은 전압이득과, 잡음여유를 가짐으로써 투명소자회로에서 다양한 응용 가능성을 보였다.