• 제목/요약/키워드: IR laser cutting

검색결과 5건 처리시간 0.018초

New CO Laser Technology Offers Processing Benefits

  • Held, Andrew
    • 한국레이저가공학회지
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    • 제18권3호
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    • pp.9-13
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    • 2015
  • The development of a reliable, high-power source of mind-IR laser light gives process develop important tool with unique characteristics that will significantly impact a diverse range of applications.

UV레이저를 이용한 마이크로 히터 트리밍 (Micro Heater Trimming using UV Laser)

  • 유승열
    • 반도체디스플레이기술학회지
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    • 제16권3호
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    • pp.36-40
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    • 2017
  • In this paper, a new method of laser trimming of thick film heater is studied. Various laser waves (IR, Green, UV) are used to ablation the heater and the process parameters are also presented. For given initial printed resisters, the cutting length should be prepared to obtain the target resister value in advance. Therefore, the cutting model is very important. The well-known model was tested and proven that it is valid only within a certain range of cutting length. A new model is proposed for a wide range of resister laser trimming. The cutting lengths and resister variation was obtained and formulated. To verify the presented method, the cutting lengths of each resister are calculated for various target resister value and laser trimming using UV is conducted.

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Experimental Investigation of Laser Spot Welding of Ni and Au-Sn-Ni Alloy

  • Lee, Dongkyoung
    • Journal of Welding and Joining
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    • 제35권2호
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    • pp.1-5
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    • 2017
  • Many microelectronic devices are miniaturizing the capacitance density and the size of the capacitor. Along with this miniaturization of electronic circuits, tantalum (Ta) capacitors have been on the market due to its large demands worldwide and advantages such as high volumetric efficiency, low temperature coefficient of capacitance, high stability and reliability. During a tantalum capacitor manufacturing process, arc welding has been used to weld base frame and sub frame. This arc welding may have limitations since the downsizing of the weldment depends on the size of welding electrode and the contact time may prevent from improving productivity. Therefore, to solve these problems, this study applies laser spot welding to weld nickel (Ni) and Au-Sn-Ni alloy using CW IR fiber laser with lap joint geometry. All laser parameters are fixed and the only control variable is laser irradiance time. Four different shapes, such as no melting upper workpiece, asymmetric spherical-shaped weldment, symmetric weldment, and, excessive weldment, are observed. This shape may be due to different temperature distribution and flow pattern during the laser spot cutting.

고출력 모듈을 위한 NDC 공정에 따른 Half-Cut 태양전지의 특성 분석 (Analysis of Characteristics of Half-Cut Solar Cells According to the NDC Process for High-Power Modules )

  • 함금희;이재형
    • 한국전기전자재료학회논문지
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    • 제37권6호
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    • pp.637-643
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    • 2024
  • One method to increase the output of solar modules is the application of the Half-cut technique, which requires a scribing process involving direct irradiation of infrared lasers on the solar cells. During this process, the laser melts the surface of the solar cells at high temperatures, enabling mechanical division, but this can lead to output loss due to thermal degradation caused by the laser. To minimize such losses, a low-temperature and low-loss division method has been devised. In this study, we compared the electrical characteristics and leakage currents affecting output degradation between the newly devised low-temperature and low-loss cell division method and the conventional laser division method. Additionally, we conducted a 3-point flexural test to evaluate the mechanical properties of both methods.

IR 레이저 스크라이빙에 의한 HJT 셀 분할 시 출력 감소율 최소화에 대한 연구 (Research on Minimizing Output Degradation in HJT Cell Separation Using IR Laser Scribing)

  • 이은비;윤성민;김민섭;신진호;김유진;김정훈;박민준;정채환
    • Current Photovoltaic Research
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    • 제12권2호
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    • pp.37-40
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    • 2024
  • One of the current innovation trends in the solar industry is the increase in the size of silicon wafers. As the wafer size increases, the series resistance of the module rises, highlighting the need for research on methods for cutting and bonding solar cells. Among these, the Infrared (IR) laser scribing technique has been extensively researched. However, there is still insufficient optimization research regarding the thermal damage caused by lasers on the Transparent Conductive Oxide (TCO) layer of Heterojunction (HJT) solar cells. Therefore, in this study, we systematically varied conditions such as IR laser scribing speed, frequency, power, and the number of scribes to investigate their impact on the performance of cut cells under each condition. Additionally, we conducted a comparative analysis of thermal damage effects on the TCO layer based on varying scribing depths.