• Proceedings of the Korean Magnestics Society Conference
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• 2007.05a
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• pp.16.1-16.1
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• 2007

• Journal of Adhesion and Interface
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• v.2 no.3
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• pp.16-24
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• 2001

The curing behavior of a phenolic resin (F/p: 1.3, 1.9, 2.5 for resol resin, F/P: 0.5, 0.7, 0.9 for novolac resin) has been studied by FT-IR spectroscopy. In this study is to synthesis of resol and novolac type phenolic resin with different F/P molar ratios and to compare the level of cure at different curing temperature conditions ($130^{\circ}C$, $160^{\circ}C$, $180^{\circ}C$ for resol resin, $160^{\circ}C$, $170^{\circ}C$, $180^{\circ}C$ for novolac resin) for 3, 5, 7, 10, 20, and 60 (min.), respectively. The conversion (${\alpha}$) was determined by the ratio of the peak area with time to the peak area of non-baked phenolic QH ($3300cm^{-1}$) at spectra. It is concluded that the initial curing rate of resol and novolac resin was increased as the molar ratio of formaldehyde/phenol increased and as the curing temperature of resin increased. According to the analysis was by the homogenous first-order model, the initial curing rate of resol and novolac resin was increased as the molar ratio of formaIdehyde/phenol increased at specific curing temperature.

• Journal of Adhesion and Interface
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• v.17 no.4
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• pp.136-140
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• 2016

In this study, a series of dimer acid-based polyamides with different diamines were synthesized by condensation polymerization and the polyamides were characterized by Fourier transform infrared spectroscopy (FT-IR). Effects of diamine structures on mechanical and thermal properties of polyamides were investigated. The tensile strength and lap shear adhesion strength of aromatic-based polyamide (DAP) were higher than those of aliphatic-based polyamide (DAH). In DSC thermogram, DAP has a high $T_g$ and $T_m$ compared with DAH. DAP's and DAH's softening point were $112-115^{\circ}C$ and $98-121^{\circ}C$, respectively.

• Journal of Adhesion and Interface
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• v.14 no.4
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• pp.167-174
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• 2013

In this study, Ultraviolet (UV) curable urethane acrylates for ink binder was prepared by reaction of IPDI, polyether polyol and HEA. The UV curing behavior of compositions with HEA/PETA ratio on UV irradiation time was investigated by FT-IR spectrophotometer, probe tack tester and Photo-DSC. Conversion % and gel content were increased with increasing UV irradiation time, but probe tack was decreased. Storage modulus, tensile strength and decomposition temperature were increased as PETA content increased. In case of HEA/PETA ratio was 30/70, adhesion property of UV-cured composition on PMMA sheet was excellent.

• Journal of Korea Game Society
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• v.9 no.6
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• pp.151-161
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• 2009

In this paper, we propose a serious game which aims to draw the interest of rehabilitants and increase their locomotive ability with an infrared ray(IR) pen interface. The proposed game focuses on providing easy-to-manipulate cognitive rehabilitation environments. In order to achieve the goal, we devised new game interface composed of a Wiimote controller and a IR pen. Moreover, SVM(support vector machine) algorithm was employed for gesture recognition. The proposed game can be successfully utilized not only for rehabilitants but also for aged persons in preventing dementia and promoting their health.

• Journal of Korea Multimedia Society
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• v.6 no.5
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• pp.889-895
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• 2003

In this paper, we develop a PC adapter board and application software that do not use mouse or keyboard but the infrared communication, which can control the operation remotely. The infrared communication adapter is made up of the infrared receiver part and the serial communication interface part. The infrared receiver part creates a suitable scan-code using the received signal from the infrared transmitter (remote-controller). The serial communication interface part transmits the scan-code to PC by a serial communication. We implement its application softwares to listen to music and see movies. We can control their operations such as play, stop, pause and volume control remotely.

• Journal of Adhesion and Interface
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• v.15 no.3
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• pp.109-115
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• 2014

In this study, we synthesized and identified microcapsule containing isocyanate, and investigated the mechanical and adhesion properties of polyurethane resin by adding microcapsule. We found out that the core material of microcapsule and the component weight fraction of microcapsule from the FT-IR and TGA analysis. From the results of adhesion and mechanical property tests, we confirmed that in case of using microcapsule for adhesive resin composition, adhesion strength, tensile strength and abrasion were improved by cross-linking reaction between urethane and IPDI in microcapsule.

• Journal of Adhesion and Interface
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• v.18 no.1
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• pp.8-12
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• 2017

In this study, waterborne polyurethane was synthesized with polyester polyol, poly(propylene carbonate) (PPC), 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$) and dimethylol propionic acid (DMPA) to improve the water resistance. The properties of the synthesized waterborne polyurethane using poly(propylene carbonate) (WPUP) was evaluated through FT-IR, GPC, DSC and UTM. The mechanical properties were increased with the increase in the amount of PPC. When the ratio of polyester polyol to poly(propylene carbonate) is 9:1, the highest water resistance was showed.

• Journal of Adhesion and Interface
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• v.21 no.1
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• pp.14-19
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• 2020

In this study, we synthesized a self-photocuring intermediate(SPI) by Michael addition reaction and synthesized polyurethane acrylate oligomer. Analysis and physical properties of the synthesized SPI and polyurethane acrylate oligomer were confirmed by FT-IR, NMR and UTM. As the content of the SPI increased, the tensile strength increased and the elongation decreased. In addition, since the film was hydrophobic, the surface energy tended to decrease. When the content of the SPI was 40 wt%, adhesion, processability, and pencil hardness were excellent, and solvent resistance was excellent overall.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3313-3315
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• 1999

Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera respectively. A bond characteristic on the interface was analyzed by using IT- IR. Si-F bonds on Si surface after HF pre-treatment are replaced by Si-OH during a DI water rinse. Consequently, hydrophobic wafer was bonded by hydrogen bonding of Si $OH{\cdots}(HOH{\cdots}HOH{\cdots}HOH){\cdots}OH-Si$. The bond strength depends on the HF pre-treatment condition before pre- bonding (Min:$2.4kgf/crn^2{\sim}Max:14.9kgf/crn^2$)