• Title/Summary/Keyword: INVAR 마스크

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DPSS UV Laser Projection Ablation of IC Substrates using an INVAR Mask (INVAR 마스크 응용 반도체 기판 소재의 고체 UV 레이저 프로젝션 어블레이션)

  • Sohn, Hyonkee;Choe, Hanseop;Park, Jong-Sig
    • Laser Solutions
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    • v.15 no.4
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    • pp.16-19
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    • 2012
  • Due to the fact that the dimensions of circuit lines of IC substrates have been forecast to reduce rapidly, engraving the circuit line patterns with laser has emerged as a promising alternative. To engrave circuit line patterns in an IC substrate, we used a projection ablation technique in which a metal (INVAR) mask and a DPSS UV laser instead of an excimer laser are used. Results showed that the circuit line patterns engraved in the IC substrate have a width of about 15um and a depth of $13{\mu}m$. This indicates that the projection ablation with a metal mask and a DPSS UV laser could feasibly replace the semi-additive process (SAP).

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Femtosecond Pulsed Laser Ablation of OLED Shadow Mask Invar Alloy (펨토초 레이저를 이용한 OLED 용 Shadow Mask Invar 합금의 어블레이션)

  • Chung, Il-Young;Kang, Kyung-Ho;Kim, Jae-Do;Sohn, Ik-Bu;Noh, Young-Chul;Lee, Jong-Min
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.12
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    • pp.50-56
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    • 2007
  • Femtosecond laser ablation of the Invar alloy and hole drilling for a shadow mask are studied. We used a regenerative amplified Ti-sapphire laser with a 1kHz repetition rate, 184fs pulse duration and 785nm wavelength. Femtosecond laser pulse was irradiated on the Invar alloy with air blowing at the condition of various laser peak power. An ablation characteristic of the Invar alloy was appeared non-linear at $125J/cm^2$ of energy fluence. For the application to a shadow mask, the hole drilling of the Invar alloy with the cross section of a trapezoidal shape was investigated. The ablated micro-holes were characterized using an atomic force microscopy(AFM). The optimal condition of hole pattern f3r a shadow mask was $4\;{\mu}m$ z-axis feed rate, 0.2mm/s circular velocity, $26.4{\mu}J$ laser peak power. With the optimal processing condition, the fine circular hole shape without burr and thermal damage was achieved. Using the femtoseocond laser system, it demonstrates excellent tool for the Invar alloy micro-hole drilling without heat effects and poor edge.

Separation of Iron and Nickel from Heavily Concentrated Aqueous Ferric Chloride Solution by Liquid-liquid Extraction (염화 제2철 농축 수용액으로부터의 액-액 추출에 의한 철과 니켈의 분리)

  • Park, Moo-Ryong;Kim, Young-Wook;Park, Jae-Ho;Park, Chin-Ho
    • Clean Technology
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    • v.13 no.4
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    • pp.274-280
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    • 2007
  • A liquid-liquid solvent extraction process was developed in this study to recover Fe and Ni from heavily concentrated aqueous ferric chloride solution, in an effort to substitute the conventional iron reduction method. Solvent composition and extraction conditions were first developed from the laboratory experiments, and the pilot system was designed and built for commercialization. Stage numbers for extraction and stripping were determined from pilot plant runs, and other operation data were obtained for mass production.

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