• Journal of Sensor Science and Technology
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• v.16 no.2
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• pp.126-131
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• 2007

In this paper, we fabricated piezoresistive pressure sensor with dry etching technology which used ICP-RIE (inductively coupled plasma reactive ion etching) and etching delay technology which used SOI (silicon-on-insulator). Structure of the fabricated pressure sensor shows a square diaphragm connected to a frame which was vertically fabricated by dry etching process and a single-element four-terminal gauge arranged at diaphragm edge. Sensitivity of the fabricated sensor was about 3.5 mV/V kPa at 1 kPa full-scale. Measurable resolution of the sensor was not exceeding 20 Pa. The nonlinearity of the fabricated pressure sensor was less than 0.5 %F.S.O. at 1 kPa full-scale.

• Journal of Korean Association for Spatial Structures
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• v.18 no.4
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• pp.49-59
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• 2018

Wireless sensors are more favorable in measuring structural response compared to conventional sensors. This is because they are easier to use with no issues with cables and are considerably cheaper. There are several applications that can be used in recording and analyzing data from MEMS sensor installed on an iPhone. The Vibration App is one of the applications used and there has not been adequate research conducted in analyzing the performance of this App. This paper analyzed the performance of the Vibration App by comparing it with the performance of an ICP sensor. Results show that natural frequency results are more accurate (error less than 5%) in comparison to the amplitude results. This means that built- in MEMS sensor in smartphones are good at estimating natural frequency of structures. In addition, it was seen that the results became more accurate at higher frequencies (5.0Hz and 10.0Hz).

• Journal of the Semiconductor & Display Technology
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• v.7 no.1
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• pp.1-5
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• 2008

In this paper, we fabricated pressure difference type gas flow sensor using only dry etching technology by ICP-RIE(inductive coupled plasma reactive ion etching). The sensor's structure consists of a common shear stress type piezoresistive pressure sensor with an orifice fabricated in the middle of the sensor diaphragm. Generally, structure like diaphragm is fabricated by wet etching technology using TMAH, but we fabricated diaphragm by only dry etching using ICP-RIE. To equalize the thickness of diaphragm we applied insulator($SiO_2$) layer of SOI(Si/$SiO_2$/Si-sub) wafer as delay layer of dry etching. Size of fabricated diaphragm is $1000{\times}1000{\times}7\;{\mu}m^3$ and overall chip $3000{\times}3000{\times}7\;{\mu}m^3$. We measured the variation of output voltage toward the change of gas pressure to analyze characteristics of the fabricated sensor. Sensitivity of fabricated sensor was relatively high as about 1.5mV/V kPa at 1kPa full-scale. Nonlinearity was below 0.5%F.S. Over-pressure range of the fabricated sensor is 100kPa or more.

• Journal of KIISE:Software and Applications
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• v.30 no.12
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• pp.1239-1246
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• 2003

Registration is the process aligning the range data sets from different views in a common coordinate system. In order to achieve a complete 3D model, we need to refine the data sets after coarse registration. One of the most popular refinery techniques is the iterative closest point (ICP) algorithm, which starts with pre-estimated overlapping regions. This paper presents an improved ICP algorithm that can automatically register multiple 3D data sets from unknown viewpoints. The sensor projection that represents the mapping of the 3D data into its associated range image is used to determine the overlapping region of two range data sets. By combining ICP algorithm with the sensor projection constraint, we can make an automatic registration of multiple 3D sets without pre-procedures that are prone to errors and any mechanical positioning device or manual assistance. The experimental results showed better performance of the proposed method on a couple of 3D data sets than previous methods.

• Journal of Korean Association for Spatial Structures
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• v.19 no.2
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• pp.63-72
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• 2019

Wireless sensors are more favorable in measuring structural response compared to conventional sensors in terms of them being easier to use with no issues with cables and them being considerably cheaper. Previous tests have been conducted to analyze the performance of MEMS (Micro Electro Mechanical Systems) sensor in sinusoidal excitation tests. This paper analyzes the performance of in-built MEMS sensors in devices by comparing with an ICP sensor as the reference. Earthquake input amplitude excitation in shaking table tests was done. Results show that MEMS sensors are more accurate in measuring higher input amplitude measurements which range from 100gal to 250gal than at lower input amplitudes which range from 10gal to 50gal. This confirms the results obtained in previous sinusoidal tests. It was also seen that natural frequency results have lower error values which range from 0% to 3.92% in comparison to the response spectra results. This also confirms that in-built MEMS sensors in mobile devices are good at estimating natural frequency of structures. In addition, it was also seen that earthquake input amplitudes with more frequency contents (Gyeongju) had considerably higher error values than Pohang excitation tests which has less frequency contents.

• Journal of Institute of Control, Robotics and Systems
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• v.20 no.11
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• pp.1170-1174
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• 2014

This paper suggests using the ICP (Iterative Closet Point) algorithm to compensate a two-dimensional map. ICP algorithm is a typical algorithm method using matching distance data. When building a two-dimensional map, using data through the value of a laser scanner, it occurred warping and distortion of a two-dimensional map because of the difference of distance from the value of the sensor. It uses the ICP algorithm in order to reduce any error of line. It validated the proposed method through experiment involving matching a two-dimensional map based reference data and measured the two-dimensional map.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.4
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• pp.575-582
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• 2013

This paper proposes a map building using the ICP algorithm based robot localization prediction. Proposed method predicts a robot location to dead reckoning, makes a map in the ICP algorithm. Existing method makes a map building and robot position using a sensor value of reference data and current data. In this case, a large interval of the difference of the reference data and the current data is difficult to compensate. The proposed method can map correction through practical experiments.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.2301-2306
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• 2005

Even if there are lots of researches on localization using 2D range finder in static environment, very few researches have been reported for robust real-time localization of mobile robot in uncertain and dynamic environment. In this paper, we present a new localization method based on ICP(Iterative Closest Point) algorithm for navigation of mobile robot under dynamic or uncertain environment. The ICP method is widely used for geometric alignment of three-dimensional models when an initial estimate of the relative pose is known. We use the method to align global map with 2D scanned data from range finder. The proposed algorithm accelerates the processing time by uniformly sampling the line fitted data from world map of mobile robot. A data filtering method is also used for threshold of occluded data from the range finder sensor. The effectiveness of the proposed method has been demonstrated through computer simulation and experiment in an office environment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.40-41
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• 2007

$SnO_2$ nanowires are used at the nanoscale level for the electrical transduction of the gas interaction with these sensing materials. We report on a study of high sensitivity and fast NOx gas sensor. We focused on improving the response time and refresh time by growth nanowires on the trench structure of Si substrate as air path. To improve refresh time we applied the trench structure with depth of $10\;{\mu}m$ by the inductively coupled plasma reactive ion etching(ICP-RIE). The fabricated device was measured at temperature of $200{\sim}300^{\circ}C$. The sensor exhibit ultra-fast and reversible electrical response (t90% ~4 s for response and ~3 s for recovery).

• Journal of Sensor Science and Technology
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• v.31 no.4
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• pp.214-217
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• 2022

The effect of inductively coupled plasma (ICP) treatment with O₂ gas on the surface properties of poly(ether sulfone) (PES) was investigated. X-ray photoelectron spectroscopy (XPS) was used to analyze the chemical characteristics of the O₂ plasma-treated PES films. The surface roughness of the pristine and O₂ plasma-treated PES films for different RF powers of the ICP was determined using an atomic force microscope (AFM). The contact angles of the PES films were also measured, using which the surface free energies were calculated. The O1s XPS spectra of the PES films revealed that the number of polar functional groups increased following the O₂ plasma treatment. The AFM analysis showed the average surface roughness increased from 1.01 to 4.48 nm as the RF power of the ICP was increased. The contact angle measurements revealed that the PES films became more hydrophilic as the RF power of the ICP was increased. The total surface energy increased with the RF power of the ICP, resulting from the increased polar energy component.