• International Journal of Quality Innovation
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• 제6권3호
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• pp.70-94
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• 2005

The IC packaging industry heavily relies on shop floor information, necessitating the development of a model to flexibly define shop floor information and timely handle manufacturing data. This study presents a novel data model of product manufacturing flow to define shop floor information to effectively respond to accelerated developments in IC package industry. The proposed data model consists of four modules: operation template setup, general process setup, enhanced bill of manufacture (EBOMfr) setup, and work-order process setup. The data model can flexibly define the required shop floor information and decision rules for shop floor product manufacturing flow, allowing one to easily adopt changes of the product and on the shop floor. However, to handle floor dynamics of the IC packaging industry, this work also proposes a WIP (i.e. work-in-process) system for monitoring and controlling the product manufacturing flow on the shop floor. The WIP system integrates the data model with a WIP execution module. Furthermore, an illustrative example, the MIRL WIP System, developed by Mechanical Industrial Research Laboratories of Industrial Technology Research Institute, demonstrates the effectiveness of the proposed model.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2006년도 ISMP 2006
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• pp.213-231
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• 2006

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2005년도 국제표면실장및인쇄회로기판생산기자재전 전자패키지 기술세미나
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• pp.45-58
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• 2005

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• Journal of Welding and Joining
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• 제27권3호
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• pp.4-9
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• 2009

• 월간포장계
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• 통권167호
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• pp.72-81
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• 2007

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 춘계 기술심포지움 전자부품 및 패키징 기술의 최신동향
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• pp.26-36
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• 1999

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.71-85
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• 2001

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• 마이크로전자및패키징학회지
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• 제2권2호
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• pp.49-56
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• 1995

ATM 교환기에 사용되는 하이브리드 IC에 대해 냉각성능과 전자파 차폐성능을 실 험과 수치해석에 의해 분석하였다. 하이브리드 IC 상부에 전자파 차폐를 위해 부착하는 덮 게의 형상에 따라 냉각공기 유속 0.5~0.4m/sec 조건에서 냉각실험을 하였고 냉각 해석 코 드인 Flotherm으로 컴퓨터 시뮬레이션하여 비교하였다. 그리고 각 덮게의 형상에 따라 30MHz ~1GHz 대혁에 걸쳐 전자파 차폐 실험을 하엿다. 실험결과 냉각 특성의 실험과 수 치해석 결과 잘 일치하였으며 공기 유속을 1.0m/sec 이상으로 유지시키면 덮개 형상에 무관 하게 열적으로 안저하였다. 30~700MHz 영역에서는 덮게로 인한 전자파 차폐효과가 뚜렷하 였으나 700MHz 이후의 대역에서는 접지와 접속되는 리이드의 임피던스 증가로 인하여 차 폐효과가 감소하였다.